Patent EP0214307A1 successfully refreshed from Google Patents.
EP0214307A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconducteur circuit device
Assignee: Sony Corp
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Filing: 1986-02-28
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Granted: —
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Expires: 2006-02-28
Abstract
Abstract In a semiconductor circuit device in which semiconductor elements are mounted on the mounting portion of a lead frame, a power-source lead and a grounding- lead are improved so that the individual leads will have decreased common inductances, in order to improve electric characteristics of the device. A support member of the mounting member has an increased width to form a power-source lead, and provision is made of a grounding lead with a plurality of branches to decrease the common inductance. Further, one of the support members of the mounting member is coupled to a neighboring lead member to form a grounding lead which has a plurality of branches, in order to decrease the common inductance of the grounding lead. Moreover, provision is made of a power-source lead having a plurality of branches and of a grounding lead having a plurality of branches to decrease common inductances of the two leads.
Inventors
- 👤 Kazuo Sony Corporation Watanabe
- 👤 Shigeo Sony Corporation Araki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 13:29
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W44/00; H10W44/501; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
194 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted, a pair of support members extended from said mount member and a plurality of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of power source terminals and a plurality of ground terminals are provided on said semiconductor circuit element, one of said support members is formed wide in width and a branch portion is formed at one end portion of said one support member so as to form a power source lead and adjacent two lead members of said plurality of lead members are coupled together within said package so as to form a ground lead, and said plurality of power source terminals and said power source lead and said plurality of ground terminals and said ground lead are respectively connected with one another through said fine conductive wires.
Claim 2
Dependent Claim
194 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted, a pair of support members extended from said mount member and a plurality of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of power source terminals and a plurality of ground terminals are provided on said semiconductor circuit element, one of said support members is formed wide in width and a branch portion is formed at one end portion of said one support member so as to form a power source lead and adjacent two lead members of said plurality of lead members are coupled together within said package so as to form a ground lead, and said plurality of power source terminals and said power source lead and said plurality of ground terminals and said ground lead are respectively connected with one another through said fine conductive wires.
Claim 3
Dependent Claim
145 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted, a pair of support members extended from said mount member and a pluraliy of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of ground terminals are provided on said semiconductor circuit element, one of said pair of support members and said lead member adjacent to said one support member are coupled together within said package so as to form a ground lead and said plurality of ground terminals and said ground lead are connected through said fine conductive wires, respectively.
Claim 4
Dependent Claim
145 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted, a pair of support members extended from said mount member and a pluraliy of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of ground terminals are provided on said semiconductor circuit element, one of said pair of support members and said lead member adjacent to said one support member are coupled together within said package so as to form a ground lead and said plurality of ground terminals and said ground lead are connected through said fine conductive wires, respectively.
Claim 5
Dependent Claim
154 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted and a plurality of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of power source terminals and a plurality of ground terminals are provided on said semiconductor circuit element, adjacent two lead members of said plurality of lead members are coupled together within said package so as to form a power source lead and a ground lead, respectively, and said plurality of power source terminals and said power source lead and said plurality of ground terminals and said ground lead are connected one another through said fine conductive wires.
Claim 6
Dependent Claim
154 words
In a semiconductor circuit device in which a semiconductor circuit element having a plurality of terminals, a mount member made of a conductive thin plate material and on which said semiconductor circuit element is mounted and a plurality of lead members provided on a periphery of said mount member and to be connected with said plurality of terminals through fine conductive wires are incorporated in a package, said semiconductor circuit device being formed such that a plurality of power source terminals and a plurality of ground terminals are provided on said semiconductor circuit element, adjacent two lead members of said plurality of lead members are coupled together within said package so as to form a power source lead and a ground lead, respectively, and said plurality of power source terminals and said power source lead and said plurality of ground terminals and said ground lead are connected one another through said fine conductive wires.
References Cited (Backward Citations)
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