Patent EP0212124B1 successfully refreshed from Google Patents.
EP0212124B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of fabricating a multilayer ceramic substrate
Assignee: International Business Machines Corp
•
Filing: 1986-06-18
•
Granted: 1990-05-23
•
Expires: 2006-06-18
Abstract
No abstract record available.
Inventors
- 👤 David W. Boss
- 👤 Derry Jay Dubetsky
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 08:46
CPC Classifications
H; H10; H10W; H10W99/00; C; C04; C04B; C04B35/00; C04B35/622; C04B35/64; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10W70/00; H10W70/01; H10W70/05; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0191; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2203/00; H05K2203/06; H05K2203/063; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
149 words
A method of fabricating a multilayer ceramic substrate with an internal conductive metallurgy circuit network, wherein a slurry of particulate ceramic material, an organic binder and a solvent for the binder is formed into green ceramic sheets (32), via holes are punched into the sheets, conductive material is deposited in the via holes and on the surface of the sheets to form lines, a plurality of green ceramic sheets is assembled, and the resultant substrate (30) sintered, characterized in that it comprises the steps of incorporating additional green ceramic material 36 in the substrate during assembly in the areas outside of the areas of conductive material lines and filled via holes, subjecting the resultant substrate to pressure to laminate the sheets, and sintering the resultant substrate, said added green ceramic material compensating for the volume of the conductive material in the central portions of said green ceramic sheets (32)
Claim 2
Independent Claim
149 words
A method of fabricating a multilayer ceramic substrate with an internal conductive metallurgy circuit network, wherein a slurry of particulate ceramic material, an organic binder and a solvent for the binder is formed into green ceramic sheets (32), via holes are punched into the sheets, conductive material is deposited in the via holes and on the surface of the sheets to form lines, a plurality of green ceramic sheets is assembled, and the resultant substrate (30) sintered, characterized in that it comprises the steps of incorporating additional green ceramic material 36 in the substrate during assembly in the areas outside of the areas of conductive material lines and filled via holes, subjecting the resultant substrate to pressure to laminate the sheets, and sintering the resultant substrate, said added green ceramic material compensating for the volume of the conductive material in the central portions of said green ceramic sheets (32)
Claim 3
Dependent Claim
57 words
The method of claim 1, wherein said additional green ceramic material is incorporated in said substrate by forming an opening in the central area of at least one additional green ceramic sheet (36), and placing the resultant at least one additional green ceramic sheet (36) with said plurality of green ceramic sheets (32) as they are assembled.
Claim 4
Dependent Claim
34 words
The method of claim 2, wherein said central opening in said at least one additional green ceramic sheet (36) approximately encompasses said conductive material lines on the associated said plurality of green sheets (32).
Claim 5
Dependent Claim
73 words
The method of claim 1, wherein said additional green ceramic material is incorporated in said substrate by forming at least one additional green ceramic sheet (42) with a profile having a thinner central portion, forming via holes in said additional sheet and filling the via holes with conductive material, and placing the resultant at least one additional green ceramic sheet (42) with said plurality of green ceramic sheets (32) as they are assembled.
Claim 6
Dependent Claim
48 words
The method of claim 4, wherein two additional green ceramic sheets (42), each with a thinner central profile, are placed in the resultant stack (40) of said plurality of green ceramic sheets (32), said additional green ceramic sheets (42) being arranged with said profiles orthogonal to each other.
Claim 7
Dependent Claim
76 words
The method of claim 1, wherein said additional green ceramic material is incorporated in said substrate by using a plurality of green ceramic sheets (52) with a sheet profile having a thicker outer section, and wherein said sheets (52) contain via holes filled with conductive material, and lines on the surface, said profile shape of said plurality of green ceramic sheets (52) acting to compensate for the conductive material in the central areas of the sheets.
Claim 8
Dependent Claim
27 words
The method of claim 6, wherein said plurality of green ceramic sheets (52) are assembled with said profiles of the sheets arranged orthogonally to the adjacent sheet.
Claim 9
Dependent Claim
70 words
An unsintered multiplayer ceramic substrate (30) with an internal conductive metallurgy circuit network, made of green ceramic sheets (32) with via holes and conductive metal lines on the surfaces which collectively form the circuit network, characterized in that it comprises additional green ceramic material in the substrate in areas outside of the areas of the conductive metallurgy network to compensate for the additional volume of material of the conductive metal.
Claim 10
Dependent Claim
70 words
An unsintered multiplayer ceramic substrate (30) with an internal conductive metallurgy circuit network, made of green ceramic sheets (32) with via holes and conductive metal lines on the surfaces which collectively form the circuit network, characterized in that it comprises additional green ceramic material in the substrate in areas outside of the areas of the conductive metallurgy network to compensate for the additional volume of material of the conductive metal.
Claim 11
Dependent Claim
27 words
The ceramic substrate of claim 8, wherein said additional green ceramic material is in the form of at least one ceramic sheet (36) with a central opening.
Claim 12
Dependent Claim
32 words
The ceramic substrate of claim 8, wherein said additional green ceramic material is in the form of at least one green ceramic sheet (42) with a profile having a thinner central portion.
Claim 13
Dependent Claim
53 words
The ceramic substrate of claim 8, wherein said additional green ceramic material is in the form of sheets and in that said green ceramic sheets (52) have a profile with a thicker outer portion, said sheets being assembled so that the profiles of the sheets (52) are arranged orthogonal to the adjacent sheet.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.