EP0210397A1
Expired / Lapsed
EP
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LSI circuits adaptable for custom design methods
Assignee: International Business Machines Corp
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Filing: 1986-06-13
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Granted: —
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Expires: 2006-06-13
Abstract
Abstract A standardized cell layout for LSI circuits having a first and second metal overlay pattern (16,18; 260-265) above a predetermined generalized logic circuit pattern, where the first metal overlay includes a generally parallel set of conductors having conductive contact with underlying circuits at a plurality of possible contact points, and the second metal overlay is insulated from the first metal overlay, the second metal overlay having a plurality of orthogonal conductors relative to the first metal overlay, to permit selective laser cutting of first metal conductor segments at positions intermediate second metal conductors, and to permit laser welding of first and second metal conductors at respective intersections of same.
Inventors
- 👤 Anthony Gus Aipperspach
- 👤 Joseph Michael Fitzgerald
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 02:49
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10D; H10D84/00; H10D84/90; H10W20/41; H10W20/43
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
134 words
An integrated circuit having an array of multi-function cells, each of said cells having a predetermined arrangement of conductive and semiconductive elements and a plurality of conductive vias connected to selected elements and projecting upwardly in a known configuration, characterized in that it comprises a) an insulating layer overlaying said array and having said conductive vias projecting therethrough; b) a pattern of M1 metal conductors arranged in generally parallel conductor segments overlaying said insulating layer and conductively coupled to said vias, said M1 conductor pattern being repetitively reprocduced across said array of cells; c) an insulating layer over said M1 conductor pattern; and d) a further pattern of M2 metal conductors arranged in parallel conductor segments orthogonal to said M1 conductor pattern, wherein M1 conductor segments bridge the gap between adjacent M2 conductor segments.
Claim 2
Dependent Claim
134 words
An integrated circuit having an array of multi-function cells, each of said cells having a predetermined arrangement of conductive and semiconductive elements and a plurality of conductive vias connected to selected elements and projecting upwardly in a known configuration, characterized in that it comprises a) an insulating layer overlaying said array and having said conductive vias projecting therethrough; b) a pattern of M1 metal conductors arranged in generally parallel conductor segments overlaying said insulating layer and conductively coupled to said vias, said M1 conductor pattern being repetitively reprocduced across said array of cells; c) an insulating layer over said M1 conductor pattern; and d) a further pattern of M2 metal conductors arranged in parallel conductor segments orthogonal to said M1 conductor pattern, wherein M1 conductor segments bridge the gap between adjacent M2 conductor segments.
Claim 3
Dependent Claim
31 words
The integrated circuit of claim 1, characterized in that said M1 conductor pattern further comprises segment branches parallel to said M2 conductor segments in positions directly below said M2 conductor segments.
Claim 4
Dependent Claim
37 words
The integrated circuit of claim 2, characterized in that said M1 conductor pattern comprises at least a portion of every M1 conductor segment passing through a vertical plane which does not coincide with an M2 conductor segment.
Claim 5
Dependent Claim
35 words
The integrated circuit of claim 3, characterized in that said M1 conductor pattern comprises at least a portion of every M1 conductor segment passing through a vertical plane which coincides with an M2 conductor segment.
Claim 6
Dependent Claim
27 words
The integrated circuit of claim 4 characterized in that said parallel M1 conductor segments and said parallel M2 conductor segments are spaced apart at least 2 microns.
Claim 7
Independent Claim
152 words
A method of personalizing functions of an integrated circuit having an array of multi-function cells, wherein each of said cells have a first M1 conductor overlay comprising a pattern of generally parallel conductor segments, and a second M2 conductor overlay comprising a pattern of parallel conductor segments orhtogonal to said M1 pattern, and an insulating layer separating said M1 pattern and said M2 pattern, characterized in that it comprises the steps of a) identifying the M1 conductor segments necessary for interconnecting elements of each of said integrated circuit cells to achieve the desired personalized functions; b) identifying the M1 conductor segments necessary for disconnecting elements of each of said integrated circuit cells to achieve the desired personalized functions; and c) selectively cutting M1 conductor segments by a laser been directed between adjacent M2 conductor segments and through said insulating layer, according to the identified M1 conductor segments of steps a) and b).
Claim 8
Independent Claim
152 words
A method of personalizing functions of an integrated circuit having an array of multi-function cells, wherein each of said cells have a first M1 conductor overlay comprising a pattern of generally parallel conductor segments, and a second M2 conductor overlay comprising a pattern of parallel conductor segments orhtogonal to said M1 pattern, and an insulating layer separating said M1 pattern and said M2 pattern, characterized in that it comprises the steps of a) identifying the M1 conductor segments necessary for interconnecting elements of each of said integrated circuit cells to achieve the desired personalized functions; b) identifying the M1 conductor segments necessary for disconnecting elements of each of said integrated circuit cells to achieve the desired personalized functions; and c) selectively cutting M1 conductor segments by a laser been directed between adjacent M2 conductor segments and through said insulating layer, according to the identified M1 conductor segments of steps a) and b).
Claim 9
Dependent Claim
136 words
The method of claim 6, further characterized in that it comprises the steps of d) identifying the M2 conductor segments necessary for interconnecting elements of said integrated circuit cells to achieve the desired personalized functions; e) identifying the M2 conductor segments necessary for disconnecting elements of said integrated circuit cells to achieve the desired personalized functions; f) selectively cutting M2 conductor segments by a laser beam, without also cutting through said insulating layer, according to the identified M2 conductor segments of steps d) and e); and g) selectively welding M2 conductor segments and M1 conductor segments together, by a laser beam directed at an intersecting point of said M1 and M2 conductor segments, according to the identified M1 conductor segments of steps a) and b) and the identified M2 conductor segments of steps d) and e).
Claim 10
Dependent Claim
22 words
The method of claim 7, characterized in that the steps of selectively cutting further comprise cutting a width of approximately two microns.
References Cited (Backward Citations)
US4240094A
Cited
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