Patent EP0206628A2 successfully refreshed from Google Patents.
EP0206628A2
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EP
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Adhesively mountable die attach film
Assignee: National Starch and Chemical Investment Holding Corp
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Filing: 1986-06-10
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Granted: —
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Expires: 2006-06-10
Abstract
Abstract A die attach film (11) adapted for adhesive mounting to a dicing frame characterised in that it comprises: (a) a support film (12); (b) a curable die bonding adhesive (13) releasably mounted on the support film; and (c) adhesive means (14) to bond the support film to a dicing frame is disclosed. <??>Also disclosed is a combination of such a film and a dicing frame. <??>The present invention provides advantages over the prior art.
Inventors
- 👤 Gregory Michael Sheyon
- 👤 Joseph Anthony Aurichio
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 20:12
CPC Classifications
B; B29; B29C; B29C65/00; H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; H10P50/00; H10P54/00; H10P72/7416; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/351; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24355; Y10T428/24372; Y10T428/24413; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
50 words
A die attach film (11) adapted for adhesive mounting to a dicing frame characterised in that it comprises: (a) a support film (12); (b) a curable die bonding adhesive (13) releasably mounted on the support film; and (c) adhesive means (14) to bond the support film to a dicing frame.
Claim 2
Dependent Claim
50 words
A die attach film (11) adapted for adhesive mounting to a dicing frame characterised in that it comprises: (a) a support film (12); (b) a curable die bonding adhesive (13) releasably mounted on the support film; and (c) adhesive means (14) to bond the support film to a dicing frame.
Claim 3
Dependent Claim
19 words
A film as claimed in claim 1 wherein the adhesive means comprise pressure sensitive means on the support film.
Claim 4
Dependent Claim
22 words
A film as claimed in claim 1 wherein the adhesive means comprise a larger tacky film bonded to the die attach film.
Claim 5
Dependent Claim
21 words
A film as claimed in claim 1 wherein the die bonding adhesive is adapted to support a semiconductor wafer for dicing.
Claim 6
Dependent Claim
24 words
A film as claimed in claim 1 wherein the die bonding adhesive is adapted to support a semiconductor die after it has been diced.
Claim 7
Dependent Claim
15 words
A film as claimed in claim 1 wherein the die bonding adhesive is electrically conductive.
Claim 8
Dependent Claim
37 words
A film as claimed in claim 1 wherein the adhesive means (c) comprises a larger tacky film bonded to the die attach film and the die bonding adhesive is adapted to support a semiconductor wafer for dicing.
Claim 9
Dependent Claim
17 words
A film as claimed in claim 7 wherein the die bonding adhesive comprises an electrically conductive adhesive.
Claim 10
Dependent Claim
27 words
A film as claimed in claim 8 wherein the portion of the tacky film under the die bonding adhesive adapted to support the wafer has been removed.
Claim 11
Dependent Claim
20 words
A film as claimed in claim 1 wherein there is also provided a release covering to protect the adhesive (b).
Claim 12
Dependent Claim
19 words
In combination, a dicing frame and a film as claimed in any of claims 4 or 6 to 9.
References Cited (Backward Citations)
No citation records indexed.
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