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EP0203623A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Wavesoldering device, particularly for printed circuits

Assignee: Italtel SpA
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Filing: 1986-03-03
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Granted: —
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Expires: 2006-03-03
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Abstract

Abstract The invention relates to a device for soldering the components on printed circuits, of the type for carrying out so-called wavesoldering. As claimed in the invention, the printed circuits are fed in a feed direction that coincides with the machine's main axis, and the soldering wave is produced in such a manner that, on the one hand, its main dimension is oblique in relation to the said feed direction and/or, on the other hand, it is subject to an orbital or alternative movement in the direction of its said main dimension.

Inventors

  • 👤 Roberto Scorta

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-02 21:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09418; H05K2203/00; H05K2203/15; H05K2203/1581

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 106 words
1) Procedure for wavesoldering printed circuits, particularly circuits carrying discreet components, such as chips for example, on the surface on which the soldering is carried out, of the type in which the printed circuits have a relative movement in relation to a soldering well, in which a wave of fluid solder is created that is lengthened out along its main dimension, characterised in that the wave is produced with its main dimension pointed obliquely in relation to the general alignment of the front faces of the said components to be soldered and/or is subjected to an orbital or alternative movement fundamentally along its said main dimension.
Claim 2
Dependent Claim 106 words
1) Procedure for wavesoldering printed circuits, particularly circuits carrying discreet components, such as chips for example, on the surface on which the soldering is carried out, of the type in which the printed circuits have a relative movement in relation to a soldering well, in which a wave of fluid solder is created that is lengthened out along its main dimension, characterised in that the wave is produced with its main dimension pointed obliquely in relation to the general alignment of the front faces of the said components to be soldered and/or is subjected to an orbital or alternative movement fundamentally along its said main dimension.
Claim 3
Dependent Claim 50 words
2) Procedure as claimed in claim 1, in which the general alignment of the front faces of the components applicated onto the printed circuits is perpendicular to the feed direction of the circuits themselves and the main dimension of the soldering wave is oblique in relation to said feed direction
Claim 4
Dependent Claim 50 words
3) Procedure as claimed in claim 1, in which the main dimension of the soldering wave is perpendicular to the feed direction of the printed circuits and the general alignment of the front faces of the components applicated onto the printed circuits is oblique in relation to said feed direction.
Claim 5
Dependent Claim 86 words
4) Device for soldering printed circuits, which have discreet components applicated onto their surface to be soldered, of the type comprising means to transport the printed circuits in a feed direction and a wavesoldering well with a slot-shaped nozzle to form the wave, characterised in that the said slot-shaped nozzle is pointed obliquely in relation to the alignment of the front faces of the said comonents and/or is connected to means designed to give it an orbital or alternative movement in relation to its main dimension.
Claim 6
Dependent Claim 86 words
4) Device for soldering printed circuits, which have discreet components applicated onto their surface to be soldered, of the type comprising means to transport the printed circuits in a feed direction and a wavesoldering well with a slot-shaped nozzle to form the wave, characterised in that the said slot-shaped nozzle is pointed obliquely in relation to the alignment of the front faces of the said comonents and/or is connected to means designed to give it an orbital or alternative movement in relation to its main dimension.
Claim 7
Dependent Claim 46 words
5) Device as claimed in claim 4, in which the said slot-shaped nozzle is formed in the lid of the wavesoldering well, and is mobile in respect to the well and to which the said means to give it an orbital or alternative movement are connected.
Claim 8
Dependent Claim 30 words
6) Device as claimed in claim 5, in which the said lid of the wavesoldering well, with the slot-shaped nozzle mounted in it, slides perpendicularly to the said feed direction.
Claim 9
Dependent Claim 33 words
7) Device as claimed in claim 5, in which the said lid of the wavesoldering well, with the slot-shaped nozzle mounted in it, slides parallel to the main dimension of the said slot.

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