Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
104 words
A semiconductor integrated circuit characterised by at least one circuit configuration (6,8,9,71,72, 104-106;118,119); at least one evaluating circuit element (10,11,12); a plurality of bonding pads (31-39) operatively connectable to the circuit configuration and the evaluating circuit element or elements; means for selectively making connection between the circuit configuration and the bonding pads, and between the evaluating circuit element and the bonding pads, the connection means including switching means (41,42; 44-46;48,49) provided between the bonding pads and the evaluating circuit element or elements for switching the connection between the bonding pads and the evaluating circuit element or elements in response to a control signal (S2,S2').
Claim 2
Dependent Claim
104 words
A semiconductor integrated circuit characterised by at least one circuit configuration (6,8,9,71,72, 104-106;118,119); at least one evaluating circuit element (10,11,12); a plurality of bonding pads (31-39) operatively connectable to the circuit configuration and the evaluating circuit element or elements; means for selectively making connection between the circuit configuration and the bonding pads, and between the evaluating circuit element and the bonding pads, the connection means including switching means (41,42; 44-46;48,49) provided between the bonding pads and the evaluating circuit element or elements for switching the connection between the bonding pads and the evaluating circuit element or elements in response to a control signal (S2,S2').
Claim 3
Dependent Claim
36 words
A circuit according to claim 1, characterised by means (Q 11 ,Q 12 ,25,58,59) for controlling the circuit configuration to have a high impedance, as seen from the bonding pads, in response to the control signal.
Claim 4
Dependent Claim
51 words
A circuit according to claim 2, characterised in that the circuit configuration includes an output driver (71,72) connected to a said bonding pad (32,33); and in that the high-impedance making means comprises a switching element (Q 11 ,Q 12 ) for deenergising the output driver in response to the control signal.
Claim 5
Dependent Claim
64 words
A circuit according to claim 2, characterised in that the circuit configuration comprises an input driver (118) connected to a said bonding pad (38) and having a low impedance to the bonding pad, and in that the high-impedance making means comprises a circuit (25,58) for electrically disconnecting a line from the input driver to the bonding pad in response to the control signal (S2').
Claim 6
Dependent Claim
34 words
A circuit according to any preceding claim, characterised in that the connecting means further comprises means (2,2 1 ) for outputting the control signal (S2;S2') in response to reception of a test request signal.
Claim 7
Dependent Claim
34 words
A circuit according to claim 5, characterised in that the control signal outputting means (2,2') is connected to a bonding pad (31;37) of the plurality of bonding pads to receive the test request signal.
Claim 8
Dependent Claim
103 words
A circuit according to claim 6, characterised in that the bonding pad (31;37) connected to the control signal outputting means (2;2') is also connected to the circuit configuration; and in that the control signal outputting means comprises a transistor (Q 1 ) having a threshold voltage higher than a normal voltage supplied to the bonding pad for operating the circuit configuration, the control signal outputting means being not operable in response to the application of the normal voltage to the bonding pad and being operable in response to the application of the test request signal having a voltage higher than the threshold voltage.