Use of a thermo-setting, polymerizable composition and wiring board

Claim 2

A thermo-setting, polymerizable composition which comprises at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other.

Claim 3

A thermo-setting, polymerizable composition according to Claim 1, wherein the composition shows substantially one exothermic polymerization peak at the polymerization by heating.

Claim 4

A thermo-setting, polymerizable composition according to Claim 1 or 2, wherein the polymerizable compounds are solid at room temperature.

Claim 5

A thermo-setting, polymerizable composition according to any of the Claims 1 to 3, wherein the polymerizable compounds have a difference of not more than 50°C in exothermic polymerization starting temperature therebetween.

Claim 6

A thermosetting, polymerizable composition according to Claim 1, wherein one of the polymerizable compound is at least one of compounds represented by the following general formula (I): wherein A is a m-valent organic group having at least one aromatic ring, and m is an integer of 1 to 6, and the other polymerizable compound is at least one of compounds represented by the following general formula (I): B c NHCN)n (II) wherein B is an n-valent organic group having at least one aromatic ring, and n is an integer of 1 to 6.

Claim 7

A thermo-setting, polymerizable composition according to Claim 5, wherein one of the polymerizable compounds is at least one of aromatic maleimide compounds and the other polymerizable compound is at least one of aromatic cyanamide compounds.

Claim 8

A thermo-setting, polymerizable composition according to Claim 6, wherein the aromatic maleimide compounds are N,N'-methylenebismaleimide, N,N'- ethylenebismaleimide, N,N'-hexamethylenebis- maleimide, N,N'-trimethylenebismaleimide, N,N'-m-phenylenebismaleimide, N,N'-p-phenylenebis- maleimide, N,N'-(methylene-di-p-phenylene)-bismaleimide, N,N'-(oxy-di-p-phenylene)-bismaleimide, N,N'-methylenebis(3-chloro-p-phenylene)bismaleimide, N,N'-(sulfonyl-di-p-phenylene)bismaleimide, N,N'-(methylene-di-4,1-hexylene)bismaleimide, N,N'-α,α'-4,4'-dimethylenecyclohexanebismaleimide, N,N'-m-xylylenebismaleimide, N,N'-4,4'-diphenylcyclohex- anebismaleimide, a condensate of aniline with formaldehyde, and a polyvalent maleimide represented by the following general formula: wherein n is an integer of 1 to 3, and the aromatic cyanamide compounds are 4,4'- dicyanamidodicyclohexylmethane, 1,4- dicyanamidocyclohexane, 2,6-dicyanamidopyridine, m-phenylenedicyanamide, p-phenylenedicyanamide, 4,4'-dicyanamidodiphenyl- methane, 2,2'-bis(4-cyanamidophenyl)propane, 4,4'-dicyanamidodiphenylsutfone, bis(4- cyanamidophenyl)phosphine oxide, bis(4-aminophenyl)phenylphosphine oxide, bis(4- cyanamidophenyl)methylamide, bis(4- - cyanamidophenyl)methylamine, 1,5- dicyanamidonaphthalene, m-xylylenedicyanamide, 1,1-bis(p-cyanamidophenyl)furan, p-xylylenedicyanamide, hexamethytenedicyanamide 6,6'-dicyanamido-2,2'-dipyridyl, 4,4'- dicyanamidobenzophenone, 4,4'- dicyanamidoazobenzene, bis(4-cyanamidophenyl)-phenylmethane, 1,1-bis(4-cyanamidophenyl)-cyclohexane, 1,1-bis(4-cyanamido-3-methylphenyl)-1,3,4-oxadiazole, 4,4'-dicyanamidodiphenyl ether, 4,4'-bis(p-cyanamidophenyl)-2,2'-dithiazole, m-bis-(4-p-cyanamidophenyl-2-thiazolyl)benzene, 4,4'- dicyanamidobenzanilide, 4,4'-dicyanamidophenyl benzoate, 2,2'-bis[4-(4-cyanamidophenoxy)henyl]-propane, 2,2-bis[4-propyt-4-(4-cyanamidophenoxy)-phenyl]propane, 2,2-bis[3-isopropyl-4-(4- cyanamidophenoxy)phenyl]propane, bis[4-(4- cyanamidophenoxy)phenyl]methane, 3,3'-methyl-4,4'-dicyanamidodiphenylmethane, 3,3'-methyl-4,4'dicyanamidodiphenyl ether, 3,3'-methyl-4,4'- dicyanamidodiphenylsulfone, 3,3'-ethyl-4,4'- dicyanamidodiphenylmethane, 3,3'-ethyl-4,4'- dicyanamidodiphenyl ether, 3,3'-ethyl-4,4'- dicyanamidodiphenylsufone, and cyanamido-terminating sulfone ether oligomers having the following formula: , wherein n is an integer of 0 to 3.

Claim 9

A thermo-setting, polymerizable composition according to Claim 6, wherein the aromatic maleimide compound is N,N'-(methylene-di-p-phenylene)-bismaleimide and the aromatic cyanamide is bis(3-methyl-4-cyanamidophenyl)methane.

Claim 10

A thermo-setting, polymerizable composition according to Claim 6, wherein the mixing ratio of the aromatic maleimide compound to the aromatic cyanamide compound is 5:95 to 95:5 by weight.

Claim 11

A thermo-setting, polymerizable composition according to Claim 6, wherein at least one of monomaleimide compounds is contained.

Claim 12

A thermo-setting, polymerizable composition according to Claim 10, wherein the monomaleimide compounds are N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-butylmaleimide, N-allylmaleimide, N-vinylmaleimide, N-phenylmaleimide, N-3-chlorophenylmaleimide, N-o-tolylmaleimide, N-m-methoxyphenylmaleimide, N-p-methoxyphenylmaleimide, N-benzylmaleimide, N-pyridylmaleimide, N-hydroxyphenylmaleimide, N-acetoxyphenylmaleimide, N-dichlorophenyl- maleimide, N-benzophenonemaleimide, N-diphenylethermaleimide, N-acetylphenylmaleimide, and N-cyclohexylmaleimide.

Claim 13

A wiring board which comprises an insulating resin layer reinforced by a fibrous substrate and a wiring conductor layer, the resin layer being formed by curing a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic temperature ranges by polymerization by heating substantially coincide with each other.

Claim 14

A wiring board which comprises an insulating resin layer reinforced by a fibrous substrate and a wiring conductor layer, the resin layer being formed by curing a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic temperature ranges by polymerization by heating substantially coincide with each other.

Claim 15

A wiring board according to Claim 12, wherein the thermo-setting polymerizable composition is as defined in any of the Claims 2 to 11.

Claim 16

A wiring board according to Claim 12 or 13, wherein the thermo-setting, polymerizable composition is in a form of a solution or varnish in an organic solvent.

Claim 17

A wiring board according to Claim 14, wherein the organic solvent is at least one of methylethylketone, methylacetylketone, 2-methoxyethanol, 2-(methoxymethoxy)ethanol, 2-isopropoxyethanol, 2-(ethoxyethoxy)ethanol, dioxane, dimethyldioxane, monopropyleneglycol methyl ether, N,N-dimethylformamide, and N-methyl-2-pyrrolidone, preferably at least one of methylethylketone, 2-methoxyethanol, N,N-dimethylformamide, N-methyl-2-pyrrolidone, and dioxane.

Claim 18

A wiring board according to Claim 14 or 15, wherein the organic solvent is contained in an amount of 20 to 70% by weight on the basis of total solution or varnish.

Claim 19

A wiring board according to Claim 14 or 15, wherein the solution or varnish is in a state of polymers or prepolymers.

Claim 20

A wiring board according to any of the Claims 12 to 17, wherein the fibrous substrate comprises inorganic or organic fibers, which preferably are at least one of carbon fibers, rock fibers, slug fibers, glass fibers, quartz fibers, ceramic fibers, tungsten fibers, beryllium fibers, polyamide-based fibers, and aramide fibers.