Patent EP0200221A2 successfully refreshed from Google Patents.
EP0200221A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Evaporation cooling module for semiconductor devices
Assignee: Fujitsu Ltd
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Filing: 1986-04-30
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Granted: —
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Expires: 2006-04-30
Abstract
Abstract An evaporation cooling module for cooling semiconductor chips (3) bonded on circuit boards (4) immersed in a coolant liquid comprises heat exchangers (16) to condense evaporated vapour of the coolant, immersed in the coolant liquid and provided with bubble traps (8). The bubble traps, preferably made from porous metal, collect the bubbles of the evaporated coolant and accumulate them around the heat exchangers. Thus the liquefaction efficiency of the coolant is increased, though the heat exchanger is immersed in the coolant. The circuit board may be provided with bubble guides (9) which separate the bubbles of coolant from the surface of the circuit board, and guide them to the bubble traps. Such guided motion of bubbles causes a local convection current of the coolant, which further increases the liquefaction efficiency and improves the uniformity of temperature distribution over the circuit board. Since the heat exchanger is placed in the coolant, its liquefaction efficiency is not decreased by the extracted gas inevitably evolved from various parts in the module. Degassing thus becomes unnecessary and maintenance is simplified.
Inventors
- 👤 Kishio Yokouchi
- 👤 Yuichi Suzuki
- 👤 Koichi Niwa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 06:02
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2029; H05K7/203
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
88 words
An evaporation cooling module for cooling a plurality of semiconductor chips (3) mounted on a circuit board (4) immersed in a coolant, comprising a case (1) for sealing said coolant, one or more heat exchangers (6) for cooling said coolant and liquefying evaporated coolant vapour, said heat exchanger(s) being immersed in said coolant; and bubble traps (8) for collecting bubbles of evaporated vapour of said coolant and making them contact said heat exchanger(s), said bubble traps being immersed in said coolant and being positioned over said heat exchanger(s).
Claim 2
Dependent Claim
88 words
An evaporation cooling module for cooling a plurality of semiconductor chips (3) mounted on a circuit board (4) immersed in a coolant, comprising a case (1) for sealing said coolant, one or more heat exchangers (6) for cooling said coolant and liquefying evaporated coolant vapour, said heat exchanger(s) being immersed in said coolant; and bubble traps (8) for collecting bubbles of evaporated vapour of said coolant and making them contact said heat exchanger(s), said bubble traps being immersed in said coolant and being positioned over said heat exchanger(s).
Claim 3
Dependent Claim
120 words
ln evaporation cooling module for cooling a plurality of semiconductor chips (3) mounted on a circuit board (4) immersed in a coolant, comprising: a case (1) for sealing said coolant and cooled objects in it, said case having on its side wall an opening for hermetically fixing said circuit board with the surface carrying the chips facing the inside of the case; one or more heat exchangers (6) for cooling said coolant and liquefying evaporated coolant vapour, said heat exchanger(s) being immersed in said coolant; and bubble traps (8) for collecting bubbles of evaporated vapour of said coolant and making them contact said heat exchangers, said bubble traps being immersed in the coolant and being positioned over said heat exchangers.
Claim 4
Dependent Claim
120 words
ln evaporation cooling module for cooling a plurality of semiconductor chips (3) mounted on a circuit board (4) immersed in a coolant, comprising: a case (1) for sealing said coolant and cooled objects in it, said case having on its side wall an opening for hermetically fixing said circuit board with the surface carrying the chips facing the inside of the case; one or more heat exchangers (6) for cooling said coolant and liquefying evaporated coolant vapour, said heat exchanger(s) being immersed in said coolant; and bubble traps (8) for collecting bubbles of evaporated vapour of said coolant and making them contact said heat exchangers, said bubble traps being immersed in the coolant and being positioned over said heat exchangers.
Claim 5
Dependent Claim
50 words
A cooling module according to claim 2, further comprising bubble guides (9) for guiding bubbles of evaporated coolant toward said bubble traps,said bubble guides being attached to said circuit board between upper and lower chips, said bubble guides having one edge aligned with one edge of the respective bubble traps.
Claim 6
Dependent Claim
17 words
A cooling module according to any preceding claim,wherein said bubble traps (8) are made from porous metal.
Claim 7
Dependent Claim
22 words
A cooling module according to claim 4, wherein the porosity of said porous metal is approximately 15-50 pores per cm 3 .
Claim 8
Dependent Claim
31 words
A cooling module according to claim 2 or claim 3,wherein said bubble trap is attached at one end to said bubble guide, and has a plurality of heat exchangers beneath it.
Claim 9
Dependent Claim
42 words
A cooling module according to any preceding claim, wherein said heat exchanger is composed of a heat pipe (16), one end of said heat pipe protruding from said case (1) and being cooled there by a second coolant flowing outside said case.
Claim 10
Dependent Claim
101 words
An evaporation cooling module for cooling a plurality of semiconductor chips (3) immersed in a forced circulated coolant comprising: a case (20) for sealing said coolant and cooled objects in it; one or more circuit boards (4) carrying a plurality of chips, said circuit board(s) being placed horizontally in said case, and being immersed in coolant; and a plurality of heat exchangers (6) for cooling the coolant and liquefying evaporated vapour of said coolant, said heat exchangers being immersed in said coolant, at least one of said heat exchangers being positioned beneath a circuit board; a pump for circulating said coolant.
Claim 11
Dependent Claim
101 words
An evaporation cooling module for cooling a plurality of semiconductor chips (3) immersed in a forced circulated coolant comprising: a case (20) for sealing said coolant and cooled objects in it; one or more circuit boards (4) carrying a plurality of chips, said circuit board(s) being placed horizontally in said case, and being immersed in coolant; and a plurality of heat exchangers (6) for cooling the coolant and liquefying evaporated vapour of said coolant, said heat exchangers being immersed in said coolant, at least one of said heat exchangers being positioned beneath a circuit board; a pump for circulating said coolant.
Claim 12
Dependent Claim
47 words
A cooling module according to claim 8, further comprising: an external heat exchanger (21) for liquefying evaporated vapour of said coolant included in said circulating coolant, said external heat exchanger being provided outside said case; and a gas extractor for extracting gas included in said circulating coolant.
Claim 13
Dependent Claim
16 words
A cooling module according to any preceding claim, wherein said circuit boards are made from ceramic.
Claim 14
Dependent Claim
33 words
A cooling module according to claim 2, wherein said circuit boards are provided with plurality of hermetically sealed contact pins (10) for connecting the circuit on the circuit boards to an outer circuit.
References Cited (Backward Citations)
No citation records indexed.
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