Patent EP0193643A2 successfully refreshed from Google Patents.
EP0193643A2
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EP
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Curable resin composition
Assignee: Toshiba Corp
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Filing: 1985-10-23
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Granted: —
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Expires: 2005-10-23
Abstract
Abstract A curable resin composition comprising, (a) at least one of partially acrylated and methacrylated epoxy resins; (b) a sensitizer which can initiate at least one of acryloyl group or methacryloyl group by photoirradiation; and (c) a curing catalyst comprising an organic metal compound and an organic silicon compound. The curable resin composition of this invention can be cured by photoirradiation and heating, and the cured product obtained has excellent electrical characteristics, adhesiveness, humidity resistance and solder heat resistance, and therefore it can be expected to be useful for electrical insulating materials, paints, materials for solder resist, etc.
Inventors
- 👤 Teiji Kohara
- 👤 Shuzi Hayase
- 👤 Shuichi Suzuki
- 👤 Moriyasu Wada
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 14:12
CPC Classifications
C; C08; C08F; C08F299/00; C08F299/02; C08F299/026; C08G; C08G59/00; C08G59/18; C08G59/68; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
51 words
A curable resin composition comprising: (a) at least one of partially acrylated and methacrylated epoxy resins; (b) a sensitizer which can initiate the polymerization of at least one of acryloyl group or methacryloyl group by photoirradiation; and (c) a curing catalyst comprising an organic metal compound and an organic silicon compound.
Claim 2
Dependent Claim
51 words
A curable resin composition comprising: (a) at least one of partially acrylated and methacrylated epoxy resins; (b) a sensitizer which can initiate the polymerization of at least one of acryloyl group or methacryloyl group by photoirradiation; and (c) a curing catalyst comprising an organic metal compound and an organic silicon compound.
Claim 3
Dependent Claim
62 words
The curable resin composition according to Claim 1, wherein said partially acrylated and methacrylated epoxy resin in component (a) is a resin obtained by the reaction of an epoxy resin with at least one of acrylic acid and methacrylic acid at an equivalent ratio (latter/former) of 0.1 to 0.9 in the presence of an organic metal compound or an organic phosphorus compound.
Claim 4
Dependent Claim
54 words
The curable resin composition according to Claim 2, wherein the organic metal compound used for the preparation of the resin in component (a) is selected from compounds comprising at least one metal selected from the group consisting of aluminum, gallium, tin, zirconium, zinc, copper, iron, nickel, cobalt, manganese, chromium, vanadium, platinum, molybdenum and palladium.
Claim 5
Dependent Claim
18 words
The curable resin composition according to Claim 3, wherein said organic metal compound is an organic aluminum compound.
Claim 6
Dependent Claim
28 words
The curable resin composition according to Claim 4, wherein the amount of said organic aluminum compound employed is 5 % by weight or less based on component (a).
Claim 7
Dependent Claim
17 words
The curable resin composition according to Claim 2, wherein said organic phosphorus compound is a tertiary phosphine.
Claim 8
Dependent Claim
28 words
The curable resin composition according to Claim 2, wherein the amount of said organic phosphorus compound employed is 0.5 % by weight or less based on component (a).
Claim 9
Dependent Claim
21 words
The curable resin composition according to Claim 1, wherein said organic metal compound in component (c) is an organic aluminum compound.
Claim 10
Dependent Claim
36 words
The curable resin composition according to Claim 8, wherein the amount of said organic aluminum compound in component (c) is 0.1 to 5 % by weight based on the total amount of components (a) to (c).
Claim 11
Dependent Claim
26 words
The curable resin composition according to Claim 1, wherein said organic silicon compound in component (c) is a compound capable of forming silanol group by photoirradiation.
Claim 12
Dependent Claim
39 words
The curable resin composition according to Claim 10, wherein the compound capable of forming silanol group by photoirradiation is a compound having at least one of an alkoxysilyl group, an aryloxysilyl group, a peroxysilyl group and an a-ketosilyl group.
Claim 13
Dependent Claim
36 words
The curable resin composition according to Claim 10, wherein the amount of said organic silicon compound in component (c) is 0.1 to 10 % by weight based on the total amount of components (a) to (c).
Claim 14
Dependent Claim
46 words
The curable resin composition according to Claim 1, wherein said curable resin composition further comprises (d) a compound having at least one group selected from the group consisting of an acryloyl group, a methacryloyl group and an epoxy group, with proviso that component (a) is excluded.
Claim 15
Dependent Claim
81 words
The curable resin composition according to Claim 13, wherein the ratio of component (a) to component (d) is within the range of from 40 : 60 to 95 : 5, and the ratios of the respective components to the total amount of components (a) to (d) are 80 to 99 % by weight for the total amount of components (a) and (b), 0.5 to 10 % by weight for component (b) and 0.5 to 10 % by weight for component (c).
References Cited (Backward Citations)
No citation records indexed.
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