Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
42 words
A method for forming an electrically conductive pathway comprising: providing on a substrate, a layer of zirconium which extends from a first location on the substrate to a second location on the substrate; and providing a conductive layer over the zirconium layer.
Claim 2
Independent Claim
42 words
A method for forming an electrically conductive pathway comprising: providing on a substrate, a layer of zirconium which extends from a first location on the substrate to a second location on the substrate; and providing a conductive layer over the zirconium layer.
Claim 3
Dependent Claim
28 words
The method of claim 1 comprising providing the zirconium laver at a thickness of from 2.5 x 10 -6 cm to 2.0 x 1 0 -5 cm .
Claim 4
Dependent Claim
28 words
The method of claim 1 comprising forming the conductive layer in a pattern which leaves the zirconium layer exposed in regions where a conductive pathway is not desired.
Claim 5
Dependent Claim
42 words
The method of claim 3 further comprising maintaining the electrically conductive pathway, when completed, at 250-400°C for two to six hours in an oxidizing environment to form a protective layer of zirconium oxide in the regions where the zirconium layer is exposed.
Claim 6
Dependent Claim
65 words
The method of claim 1 further comprising forming the conductive layer by: depositing a primary copper layer on the zirconium layer at a thickness of from 5.0 x 10 -6 cm to 1.0 x 10 -4 cm; and depositing a secondary copper layer on the primary copper layer at a thickness of from 1.0 x 10 -4 cm to 1.0 x 10 -3 cm .
Claim 7
Dependent Claim
58 words
The method of claim 5 further comprising: depositing a nickel layer on the secondary copper layer at a thickness of from 5.0 x 10 -6 cm to 5.0 x 10 -5 cm; and depositing a gold layer on the nickel layer at a thickness of from 5.0 x 10 -6 cm to 4.0 x 10 -5 cm .
Claim 8
Dependent Claim
69 words
The method of claim 1 further comprising forming the conductive layer of a plurality of metal layers by: depositing a primary gold layer on the zirconium layer at a thickness of from 5.0 x 10 cm to 1.0 x 10 -4 cm; and depositing a secondary gold layer on the primary gold layer at a thickness of from 1.0 x 10 -4 cm to 1.0 x 10 -3 cm.
Claim 9
Dependent Claim
31 words
The method of claim 1 in which the substrate is comprised of a material selected from the group consisting of alumina, quartz, fused silica, beryllia, glass, forsterite, polyimide, and oxidized silicon.
Claim 10
Dependent Claim
14 words
The method of claim 1 in which the substrate has electrical components affixed thereto.
Claim 11
Dependent Claim
16 words
The method of claim 9 in which at least some of the electrical components comprise resistors.
Claim 12
Dependent Claim
13 words
A thin-film metal conductor system manufactured according to the process of claim 1.
Claim 13
Dependent Claim
24 words
A thin-film metal conductor system which comprises: a substrate; a layer of zirconium on the substrate; and a conductive layer on the zirconium layer.
Claim 14
Dependent Claim
24 words
A thin-film metal conductor system which comprises: a substrate; a layer of zirconium on the substrate; and a conductive layer on the zirconium layer.
Claim 15
Dependent Claim
34 words
The thin-film metal conductor system of claim 12 in which the conductive layer is present in a pattern such that the zirconium layer is exposed in regions where a conductive pathway is not desired.
Claim 16
Dependent Claim
50 words
The thin-film metal conductor system of claim 13 in which a protective layer of zirconium oxide exists in the regions where the zirconium layer was exposed, the zirconium oxide having been formed by maintaining the system of claim 13 at 250-400°C for two to six hours in an oxidizing environment.
Claim 17
Dependent Claim
26 words
The thin-film metal conductor system of claim 12 in which the zirconium layer is from 2.5 x 10 -6 cm to 2.0 x 10 -5 cm.
Claim 18
Dependent Claim
73 words
The thin-film metal conductor system of claim 12 in which the conductive layer is comprised of a plurality of metal layers comprising: a primary copper layer on the zirconium layer at a thickness of from 5.0 x 10 -6 cm to 1.0 x 10 -4 cm; and a secondary copper layer on the primary copper layer at a thickness of from 1.0 x 10 -4 cm to 1.0 x 10 -3 cm .
Claim 19
Dependent Claim
65 words
The thin-film metal conductor system of claim 16 in which the metal layers further comprise: a nickel layer on the secondary copper layer at a thickness of from 5.0 x 10 -6 cm to 5 . 0 x 10 -5 cm; and a gold layer on the nickel laver at a thickness of from 5.0 x 10 -6 cm to 4.0 x 10 -5 cm.
Claim 20
Dependent Claim
71 words
The thin-film metal conductor system of claim 12 in which the conductive layer comprises a plurality of metal layers comprising: a primary gold layer on the zirconium layer at a thickness of from 5.0 x 10 -6 cm to 1.0 x 10 -4 cm; and a secondary gold layer on the primary gold layer at a thickness of from 1.0 x 10 -4 cm to 1.0 x 10 -3 cm .
Claim 21
Dependent Claim
42 words
A circuit board comprising: a substrate; thin-film conductive pathways, each including a layer of zirconium on the substrate and a conductive layer on the zirconium layer; and nonconductive regions of zirconium oxide on the substrate, the regions being located between the pathways.
Claim 22
Dependent Claim
42 words
A circuit board comprising: a substrate; thin-film conductive pathways, each including a layer of zirconium on the substrate and a conductive layer on the zirconium layer; and nonconductive regions of zirconium oxide on the substrate, the regions being located between the pathways.