Patent JPS6142984A successfully refreshed from Google Patents.
Patent EP0177772A2 successfully refreshed from Google Patents.
EP0177772A2
Expired / Lapsed
EP
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Processes for fabricating a sintered powdered metal component
Assignee: International Business Machines Corp
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Filing: 1985-09-06
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Granted: —
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Expires: 2005-09-06
Abstract
Abstract In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, an improvement is provided which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal oxide which can be the same as or different from the metal of the aforesaid metal member. The improved sintering process of the present invention is particularly adapted for use in the fabrication of multilayer ceramic substrates which serve as circuit modules for semiconductor chips.
Inventors
- 👤 James Merritt Brownlow
- 👤 Robert Rosenberg
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 11:13
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; B; B22; B22F; B22F3/00; B22F3/10; B22F3/1003; B22F7/00; B22F7/02; C04B41/45; C04B41/50; C04B41/51; C04B41/5127; C04B41/80; C04B41/81; C04B41/85; C04B41/88; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12049; Y10T428/12056; Y10T428/12063; Y10T428/12493; Y10T428/1266
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
96 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering a densification temperature-modifying amount of a metal or metal oxide, the metal component of which can be the same as or different from the metal of the aforesaid metal member.
Claim 2
Dependent Claim
96 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering a densification temperature-modifying amount of a metal or metal oxide, the metal component of which can be the same as or different from the metal of the aforesaid metal member.
Claim 3
Dependent Claim
122 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide, the metal component of which can be the same as or different from the metal of the aforesaid metal member.
Claim 4
Dependent Claim
122 words
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, the improvement which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide, the metal component of which can be the same as or different from the metal of the aforesaid metal member.
Claim 5
Dependent Claim
158 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a free metal or metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 6
Dependent Claim
158 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a free metal or metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 7
Dependent Claim
130 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering a densification temperature-modifying amount of a metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 8
Dependent Claim
130 words
In a process for fabricating a multilayer ceramic substrate wherein individual layers of ceramic substrate having a metal pattern bonded thereto are subjected to sintering resulting in the densification of the metal contained in the metal pattern and the curing of the ceramic substrate, the temperature at which the metal undergoes densification being different from the temperature at which the ceramic substrate undergoes curing, the improvement which comprises causing the densification temperature of the metal contained in the metal pattern to be closer to or identical with the curing temperature of the ceramic substrate by adding to said metal prior to sintering a densification temperature-modifying amount of a metal oxide, the metal component of which can be the same as or different from the metal contained in the metal pattern.
Claim 9
Dependent Claim
35 words
A process as claimed in any one of claims 1 to 4, wherein the metal member or pattern comprises copper, nickel, molybdenum, silver, gold and platinum or a metal alloy containing any of the foregoing.
Claim 10
Dependent Claim
19 words
A process as claimed in any one of claims 1 to 5, wherein the substrate contains a refractory oxide.
Claim 11
Dependent Claim
14 words
A process as claimed in claim 6, wherein the refractory oxide is cordierite ceramic.
Claim 12
Dependent Claim
28 words
A process as claimed in claim 2 or 3, wherein the organometallic compound decomposes to provide a metal component which increases the densification temperature of the metal member.
Claim 13
Dependent Claim
23 words
A process as claimed in claim 8, wherein the organometallic compound is a metal acetyl acetonate which decomposes to provide a metal oxide.
Claim 14
Dependent Claim
19 words
A process as claimed in claim 8, wherein organometallic compound is aluminum acetyl acetonate which decomposes to provide alumina.
Claim 15
Dependent Claim
28 words
A process as claimed in claim 2 or 3, wherein the organometallic component decomposes to provide a metal component which decreases the densification temperature of the metal member.
Claim 16
Dependent Claim
22 words
A process as claimed in claim 11, wherein the organometallic compound is a metal acetyl acetonate which decomposes to provide a metal.
Claim 17
Dependent Claim
22 words
A process as claimed in claim 12, wherein the metal acetyl acetonate is copper acetyl acetonate which decomposes to provide copper metal.
Claim 18
Dependent Claim
33 words
A process as claimed in claim 1 to 13, wherein sintering is carried out within the range of from about 500°C to about 1800°C in the presence or absence of a reducing atmosphere.
Claim 19
Dependent Claim
31 words
A process as claimed in claim 14, wherein sintering is carried out within the range of from about 600°C to about 1000°C in the presence or absence of a reducing atmosphere.
Claim 20
Dependent Claim
21 words
A process as claimed in claim 3, wherein the metal pattern is made with copper and the ceramic substrate contains alumina.
Claim 21
Dependent Claim
25 words
A process as claimed in any one of claims 1 to 16, wherein the metal oxide is an oxide of magnesium, titanium, zirconium or aluminum.
References Cited (Backward Citations)
No citation records indexed.
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