Patent EP0175489A2 successfully refreshed from Google Patents.
EP0175489A2
Expired / Lapsed
EP
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An eprom device and method of manufacturing same
Assignee: Oki Electric Industry Co Ltd
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Filing: 1985-08-20
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Granted: —
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Expires: 2005-08-20
Abstract
Abstract 57 An EPROM device and a manufacturing method thereof are described. The device comprises a hollow cap (24), the head portion (24a) of which is made of a material which passes UV ray therethrough. The cap (24) is installed on a lead frame (21) covering an EPROM chip (22). An UV ray permeable resin (25) occupies at least the space between the head portion (24a) of the hollow cap (24) and a main surface of the EPROM chip (22) and an insulating resin (28) occupies the remaining portion of the hollow cap so as to establish a double layer structure within the cap.
Inventors
- 👤 Hiroshi C/O Oki Electric Industry Co. Ltd. Okuaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:01
CPC Classifications
G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/10; G11C16/18; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
167 words
A method of manufacturing an EPROM device comprising the steps of: a) mounting an EPROM chip on a chip mounting portion on a lead frame; b) connecting each of the electrodes of said EPROM chip to a corresponding terminal portion of said lead frame with thin metal wire; c) dropping an UV ray permeable resin onto a surface of said EPROM chip; d) covering said dropped resin by means of a hollow cap so as to cause said resin to fill at least the space between a head portion of said hollow cap and the surface of said EPROM chip; e) hardening said resin by heating; f) filling the remaining portion within said cap with insulating resin so as to establish, with said UV ray permeable resin, a double layer structure; g) hardening said insulating resin by heating; and h) enclosing said cap with further insulating resin except for both said head portion of said cap and a part of said terminal portions of the lead frame.
Claim 2
Independent Claim
167 words
A method of manufacturing an EPROM device comprising the steps of: a) mounting an EPROM chip on a chip mounting portion on a lead frame; b) connecting each of the electrodes of said EPROM chip to a corresponding terminal portion of said lead frame with thin metal wire; c) dropping an UV ray permeable resin onto a surface of said EPROM chip; d) covering said dropped resin by means of a hollow cap so as to cause said resin to fill at least the space between a head portion of said hollow cap and the surface of said EPROM chip; e) hardening said resin by heating; f) filling the remaining portion within said cap with insulating resin so as to establish, with said UV ray permeable resin, a double layer structure; g) hardening said insulating resin by heating; and h) enclosing said cap with further insulating resin except for both said head portion of said cap and a part of said terminal portions of the lead frame.
Claim 3
Dependent Claim
157 words
An EPROM device comprising: a) a lead frame having a chip mounting portion and a plurality of terminal portions thereon; b) an EPROM chip mounted on said chip mounting portion and connected to said terminal portions with thin metal wires; c) a hollow cap, a head portion thereof being made of a material through which UV rays may pass, said cap being situated on said lead frame so as to cover said EPROM chip and said thin metal wires; d) an UV ray permeable resin filling at least the space between said head portion of the hollow cap and a main surface of said EPROM chip; e) insulating resin filling the remaining portion within said cap so as to establish, with said UV ray permeable resin, a double layer structure; and f) further insulating resin for enclosing said cap except for both said head portion thereof and a part of said terminal portions of said lead frame.
Claim 4
Dependent Claim
157 words
An EPROM device comprising: a) a lead frame having a chip mounting portion and a plurality of terminal portions thereon; b) an EPROM chip mounted on said chip mounting portion and connected to said terminal portions with thin metal wires; c) a hollow cap, a head portion thereof being made of a material through which UV rays may pass, said cap being situated on said lead frame so as to cover said EPROM chip and said thin metal wires; d) an UV ray permeable resin filling at least the space between said head portion of the hollow cap and a main surface of said EPROM chip; e) insulating resin filling the remaining portion within said cap so as to establish, with said UV ray permeable resin, a double layer structure; and f) further insulating resin for enclosing said cap except for both said head portion thereof and a part of said terminal portions of said lead frame.
Claim 5
Dependent Claim
46 words
An EPROM device as claimed in claim 2, wherein said hollow cap is so constituted that an edge portion thereof which is situated opposite to said head portion is formed with an L shaped flange which extends outwardly in a direction parallel to said lead frame.
References Cited (Backward Citations)
No citation records indexed.
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