Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
103 words
An epoxy resin composition for encapsulation of semiconductor device, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50 %; (c) 1.2 to 40 parts by weight of a polyvinyl acetal compound; (d) 0.8 to 30 parts by weight of a silicone oil; and (e) 4 to 80 parts by weight of a rubber-modified phenolic resin.
Claim 2
Dependent Claim
103 words
An epoxy resin composition for encapsulation of semiconductor device, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50 %; (c) 1.2 to 40 parts by weight of a polyvinyl acetal compound; (d) 0.8 to 30 parts by weight of a silicone oil; and (e) 4 to 80 parts by weight of a rubber-modified phenolic resin.
Claim 3
Dependent Claim
24 words
An epoxy resin composition according to Claim 1, wherein the component (a) is an epoxy resin with an epoxy equivalent of 100 to 300.
Claim 4
Dependent Claim
26 words
An epoxy resin composition according to Claim 1, wherein the component (b) is a novolak type phenolic resin with a hydroxyl equivalent of 100 to 150.
Claim 5
Dependent Claim
23 words
An epoxy resin composition according to Claim 1, wherein the component (d) has a viscosity of 500 to 1,000,000 cP at 20 °C.
Claim 6
Dependent Claim
19 words
An epoxy resin composition according to Claim 1, wherein the composition comprises the components (a), (b), (c) and (d).
Claim 7
Dependent Claim
19 words
An epoxy resin composition according to Claim 1, wherein the composition comprises the components (a), (b), (c) and (e).
Claim 8
Dependent Claim
19 words
An epoxy resin composition according to Claim 6, wherein the composition further comprises a curing accelerator and silica powder.
Claim 9
Dependent Claim
18 words
An epoxy resin composition according to Claim 6, wherein the component (a) is a novolak type epoxy resin.
Claim 10
Dependent Claim
26 words
An epoxy resin composition according to Claim 8, wherein the component (a) is a novolak type epoxy resin having an epoxy equivalent of 175 to 220.
Claim 11
Dependent Claim
17 words
An epoxy resin composition according to Claim 6, wherein the component (b) is a phenolic novolak resin.
Claim 12
Dependent Claim
17 words
ll. An epoxy resin composition according to Claim 5, wherein the component (C) is polyvinyl butyral resin.
Claim 13
Dependent Claim
20 words
An epoxy resin composition according to Claim 1, wherein the composition comprises the components (a), (b), (c), (d) and (e).