Patent EP0171783A2 successfully refreshed from Google Patents.
EP0171783A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Module board and module using the same and method of treating them
Assignee: Hitachi Ltd
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Filing: 1985-08-12
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Granted: —
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Expires: 2005-08-12
Abstract
Abstract The present invention relates to a module board for a computer and a module using the same, and more particularly to a module board and a module having a surface pattern suitable for high density packaging. To bond a repair wire (12) onto a technical exchange pad (5), a wire bonder is normally used, but a fixed or more interval must be provided between an LSI chip and the technical exchange pad (5) so as to secure a working area. Depending on the direction of bonding, however, a required interval changes substantially. The invention is characterized in that junction pads (6) are installed to provide a module board and a module having a surface pattern capable of restricting the direction of bonding to one direction.
Inventors
- 👤 Masakazu Yamamoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 12:57
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/641; H10W70/67; H10W70/68; H10W70/685; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H10W70/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
59 words
A module board for mounting semiconductor devices, wherein said board comprises on the surface thereof: a plurality of groups of solder pads (4) provided for soldering a plurality of semiconductor devices, respectively; a plurality of technical exchange pads (5) provided in the surroundings of a plurality of said respective groups of solder pads; and electrically insulated junction pads (6).
Claim 2
Dependent Claim
59 words
A module board for mounting semiconductor devices, wherein said board comprises on the surface thereof: a plurality of groups of solder pads (4) provided for soldering a plurality of semiconductor devices, respectively; a plurality of technical exchange pads (5) provided in the surroundings of a plurality of said respective groups of solder pads; and electrically insulated junction pads (6).
Claim 3
Dependent Claim
42 words
A module board according to claim 1, wherein the number of said junction pads (6) is one half or more of the number of said technical exchange pads (5) provided in the surrounding portion closets to said groups of solder pads (4).
Claim 4
Dependent Claim
29 words
A module board according to claim 1, wherein said junction pad (6) is shaped such as to have a slender structure with a recessed portion in the midway thereof.
Claim 5
Dependent Claim
25 words
A module board according to claim 1, wherein said junction pads (6) are disposedon the periphery of the surrounding portion of said technical exchange pads.
Claim 6
Dependent Claim
46 words
A module board according to claim 1, wherein each of a plurality of said technical exchange pads (5) contains in the inside thereof a plurality of conductive layers (18,19,20) for being electrically connected with any one of said solder pads among said groups of solder pads.
Claim 7
Dependent Claim
159 words
A module having a plurality of semiconductor devices and a module board for mounting a plurality of said semiconductor devices, wherein said module comprises on the surface thereof: a plurality of groups of solder pads (4) provided for. soldering each of a plurality of said semiconductor devices; a plurality of technical exchange pads (5) provided in the surroundings of a plurality of said respective groups of solder pads; and electrically insulated junction pads (6) and repair wires (12), wherein each of a plurality of said semiconductor devices are connected to said module board via said groups of solder pads, and connection between a technical exchange pad provided in the surrounding portion closest to a predetermined semiconductor device (hereinafter referred to as a first semiconductor device) among said semiconductor devices on the one hand, and anogher circuit element to be electrically connected to said first semiconductor device on the other, is effected by said repair wire via said junction pad.
Claim 8
Dependent Claim
159 words
A module having a plurality of semiconductor devices and a module board for mounting a plurality of said semiconductor devices, wherein said module comprises on the surface thereof: a plurality of groups of solder pads (4) provided for. soldering each of a plurality of said semiconductor devices; a plurality of technical exchange pads (5) provided in the surroundings of a plurality of said respective groups of solder pads; and electrically insulated junction pads (6) and repair wires (12), wherein each of a plurality of said semiconductor devices are connected to said module board via said groups of solder pads, and connection between a technical exchange pad provided in the surrounding portion closest to a predetermined semiconductor device (hereinafter referred to as a first semiconductor device) among said semiconductor devices on the one hand, and anogher circuit element to be electrically connected to said first semiconductor device on the other, is effected by said repair wire via said junction pad.
Claim 9
Dependent Claim
74 words
A module according to claim 6, wherein a technical exchange pad provided on the surrounding portion closest to said first semiconductor device on the one hand, and a technical exchange pad provided on the surrounding portion closest to the other predetermined semiconductor device (hereinafter referred to as a second semiconductor device) to be connected electrically to said first semiconductor device on the other, are electrically connected by said repair wire via said junction pad.
Claim 10
Dependent Claim
38 words
A module according to claim 6, wherein the number of said junction pads is one half or more of the number of said technical exchange pads provided on the surrounding portion closest to said groups of solder pads.
Claim 11
Dependent Claim
36 words
A module according to claim 6, wherein each of said junction pads has a slender structure with a recessed portion in the midway thereof and is disposed on the surrounding portion of said technical exchange pads.
Claim 12
Independent Claim
163 words
A method of connecting the circuitry in a module, using a module which is provided on the surface thereof with a plurality of groups of solder pads for soldering semiconductor devices and which has groups of technical exchange pads provided on the surrounding portions of a plurality of said respective groups of solder pads and groups of junction pads provided on the peripheral portion of the surrounding portion of said groups of technical exchange pads, and comprising the steps of: connecting one end of a repair wire to one technical exchange pads in the surrounding portion closest to a semiconductor device; connecting the other end of said repair wire to one of said groups of junction pads; and connecting to one of said groups of junction pads a repair wire connected to a circuit element which is provided on said module board and which is to be electrically connected to said semiconductor device, thereby electrically connecting said circuit element and said semiconductor device.
Claim 13
Independent Claim
163 words
A method of connecting the circuitry in a module, using a module which is provided on the surface thereof with a plurality of groups of solder pads for soldering semiconductor devices and which has groups of technical exchange pads provided on the surrounding portions of a plurality of said respective groups of solder pads and groups of junction pads provided on the peripheral portion of the surrounding portion of said groups of technical exchange pads, and comprising the steps of: connecting one end of a repair wire to one technical exchange pads in the surrounding portion closest to a semiconductor device; connecting the other end of said repair wire to one of said groups of junction pads; and connecting to one of said groups of junction pads a repair wire connected to a circuit element which is provided on said module board and which is to be electrically connected to said semiconductor device, thereby electrically connecting said circuit element and said semiconductor device.
Claim 14
Dependent Claim
195 words
ll. A method of connecting the circuitry in a module, using a module which is provided on the surface thereof with a plurality of groups of solder pads for soldering semiconductor devices and which has groups of technical exchange pads provided on the surrounding portions of a plurality of said respective groups of solder pads and groups of junction pads provided on the peripheral portion of the surrounding portion of said groups of technical exchange pads, and comprising the steps of: connecting one end of a repair wire to one technical exchange pads in the surrounding portion closest to a semiconductor device; connecting the other end of said repair wire to one junction pad in said group of technical exchange pads in the surrounding portion closest to said semiconductor device; connecting one end of the other repair wire to the other one of technical exchange pads provided in the surrounding portion closest to said semiconductor device; and connecting the other end of said repair wire to said one junction pad in said groups of junction pads; thereby connecting each other the respective technical exchange pads provided in the surrounding portion closest to said semiconductor device.
Claim 15
Dependent Claim
195 words
ll. A method of connecting the circuitry in a module, using a module which is provided on the surface thereof with a plurality of groups of solder pads for soldering semiconductor devices and which has groups of technical exchange pads provided on the surrounding portions of a plurality of said respective groups of solder pads and groups of junction pads provided on the peripheral portion of the surrounding portion of said groups of technical exchange pads, and comprising the steps of: connecting one end of a repair wire to one technical exchange pads in the surrounding portion closest to a semiconductor device; connecting the other end of said repair wire to one junction pad in said group of technical exchange pads in the surrounding portion closest to said semiconductor device; connecting one end of the other repair wire to the other one of technical exchange pads provided in the surrounding portion closest to said semiconductor device; and connecting the other end of said repair wire to said one junction pad in said groups of junction pads; thereby connecting each other the respective technical exchange pads provided in the surrounding portion closest to said semiconductor device.
References Cited (Backward Citations)
No citation records indexed.
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