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EP0171531A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

High electron mobility semiconductor device

Assignee: Hitachi Ltd
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Filing: 1985-06-03
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Granted: —
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Expires: 2005-06-03
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Abstract

Abstract A semiconductor device comprises an undoped GaAs layer (21), an intermediate undoped layer (24) and an undoped Ga 1-x Al x As layer (3) which are successively provided on a substrate (1) made of a semiinsulating GaAs crystal. The intermiediate undoped layer (24) can be an undoped In y Ga 1-y As iayer, an undoped GaAs 1-z Sb z layer, a superlattice layer which includes an undoped In y Ga 1-y As layer and an undoped GaAs 1-2 Sb r layer, a superlattice layer which includes an undoped In y Ga -y As layer and an undopted GaAs layer, or a superlattice layer which includes an undoped GaAs, Sb layer ane an undoped GaAs iayer. Use of such an intermediate layer as the channel layer improves the channels crystal quality and increases its possible thickness. tnereby increasing the possible sheet density the two dimensional electron gas, with respect to prior at devices When applied to a high electron mobility transister mis semiconductor device affords a high current and a hgt, speed and has the merit of a small dispersion in the threshold voitage thereof.

Inventors

  • 👤 Takao Kuroda
  • 👤 Yasuhiro Shiraki

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 21:58
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/80; H10D62/82; H10D62/824; H10D30/00; H10D30/40; H10D30/47; H10D30/471; H10D30/473; H10D30/4732; Y; Y10; Y10S; Y10S438/00; Y10S438/938

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 152 words
A semiconductor device which comprises an undoped GaAs layer (21), an intermediate undoped layer (24) and an undoped G a 1-x Al x As layer (3) stacked on a substrate (1) in this order, in which said intermediate undoped layer (24) is an undoped In y Ga 1 -y As layer, or an undoped GaAs -z sb z layer, or a superlattice layer formed by alternately stacking at least one undoped In y Ga 1-y As layer and at least one undcped GaAs 1-z Sb z layer, or a superlattice layer formed by alternately stacking at least one undoped In y Ga 1-y As layer and at least one undoped GaAs layer, or a superlattice layer formed by alternately stacking at least one undoped GaAs 1-z Sb z and at least one undcped GaAs layer, wherein 1 ≧ x > 0, 1 ≧ y > 0, and 1 ≧ z > 0.
Claim 2
Dependent Claim 152 words
A semiconductor device which comprises an undoped GaAs layer (21), an intermediate undoped layer (24) and an undoped G a 1-x Al x As layer (3) stacked on a substrate (1) in this order, in which said intermediate undoped layer (24) is an undoped In y Ga 1 -y As layer, or an undoped GaAs -z sb z layer, or a superlattice layer formed by alternately stacking at least one undoped In y Ga 1-y As layer and at least one undcped GaAs 1-z Sb z layer, or a superlattice layer formed by alternately stacking at least one undoped In y Ga 1-y As layer and at least one undoped GaAs layer, or a superlattice layer formed by alternately stacking at least one undoped GaAs 1-z Sb z and at least one undcped GaAs layer, wherein 1 ≧ x > 0, 1 ≧ y > 0, and 1 ≧ z > 0.
Claim 3
Dependent Claim 15 words
The semiconductor device of claim 1, wherein said substrate (1) is a semiinsulating GaAs crystal.
Claim 4
Dependent Claim 28 words
The semiconductor device of claim 1 or 2, wherein the value of x is 0.1 to 0.5, and the value of y and z are 0.05 to 0.5.
Claim 5
Dependent Claim 40 words
The semiconauctor device of any of claims 1 to 3, wherein said intermediate undoped layer (24) is an undoped In y Ga 1-y As layer or an undoped GaAs 1-z Sb z layer, and is 5 to 50 nm thick.
Claim 6
Dependent Claim 18 words
The semiconductor device of claim 4, wherein said intermediate undoped layer (24) is 10 to 20 nm thick.
Claim 7
Dependent Claim 29 words
The semiconductor device of any of claims 1 to 3, wherein said intermediate undoped layer (24) is one of said superlattice layers, and is 5 to 100 nm thick.
Claim 8
Dependent Claim 72 words
The semiconductor device of any of claims 1 to 6, including an n-type Ga 1-x Al x As layer (4) provided on said undoped Ga 1-x Al x As layer (3), a drain region (10) and a source region (9) which reach said undoped GaAs layer (21) located on said substrate (1), and a drain electrode (8), a source electrode (6) and a gate electrode (7), thereby constructing a field effect transistor.

References Cited (Backward Citations)

EP0050064A2 Cited
EP0133342A1 Cited

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