Patent EP0171232A2 successfully refreshed from Google Patents.
EP0171232A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Area-bonding tape
Assignee: 3M Co
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Filing: 1985-07-24
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Granted: —
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Expires: 2005-07-24
Abstract
Abstract A flexible tape for bonding electronic components to external circuitry comprising a solid, flexible, electrically insulating body, and arrays of open internal and external terminals which are electrically interconnected by multiplicities of conductive paths. The open internal and external terminals comprise holes through the tape which may, in part, if desired, comprise an electrically conductive material.
Inventors
- 👤 Robert R. C/O Minnesota Mining And Rohloff
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 13:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W70/62; H10W70/63; H10W70/635; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
96 words
A flexible tape (2) for providing electrical interconnection between electronic components (3) and external circuitry (5), said tape (2) comprising a flexible, electrically insulating body having a predetermined array of internal terminals (10) comprising openings therethrough for electrical interconnection to said electronic components (3), a predetermined array of external terminals (11) comprising openings therethrough for electrical interconnection to said external circuitry (5), said internal (10) and external (11) terminals being electrically interconnected by a multiplicity of electrically conductive paths (14), and wherein at least a portion of each of said openings comprises an electrically conductive material.
Claim 2
Dependent Claim
96 words
A flexible tape (2) for providing electrical interconnection between electronic components (3) and external circuitry (5), said tape (2) comprising a flexible, electrically insulating body having a predetermined array of internal terminals (10) comprising openings therethrough for electrical interconnection to said electronic components (3), a predetermined array of external terminals (11) comprising openings therethrough for electrical interconnection to said external circuitry (5), said internal (10) and external (11) terminals being electrically interconnected by a multiplicity of electrically conductive paths (14), and wherein at least a portion of each of said openings comprises an electrically conductive material.
Claim 3
Dependent Claim
14 words
A tape (2) according to claim 1 wherein said insulating material is a polyimide.
Claim 4
Dependent Claim
17 words
A tape (2) according to claim 1 wherein the walls of said openings comprise electrically conductive material.
Claim 5
Dependent Claim
24 words
A tape (2) according to claim 1 wherein said electrically conductive paths (14) are at least partially buried within the body of said tape.
Claim 6
Independent Claim
206 words
A method for providing electrical interconnection between an electronic component (3) and external circuitry (5), the method comprising the steps of a) providing a flexible tape (2) comprising a flexible, electrically insulating body having a predetermined array of internal terminals (10) comprising openings therethrough for electrical interconnection to said electronic components (3), a predetermined array of external terminals (11) comprising openings therethrough for electrical interconnection to said external circuitry (5), said internal (10) and external (11) terminals being electrically interconnected by a multiplicity of conductive paths; b) aligning said array of internal terminals (10) with first bonding locations on said electronic component (3) and contacting said first bonding locations with said internal terminals (10): c) bonding said array of internal terminals (10) to said first bonding locations on said electronic component (3) so that solder on said first bonding locations flows into said internal terminals (10); d) aligning said array of external terminals (11) with second bonding locations on said external circuitry (5) and contacting said second bonding locations with said external terminals (11); and e) bonding said array of external terminals (11) to said second bonding locations on said external circuitry (5) so that solder on said second bonding flows into said external terminals (11).
Claim 7
Independent Claim
206 words
A method for providing electrical interconnection between an electronic component (3) and external circuitry (5), the method comprising the steps of a) providing a flexible tape (2) comprising a flexible, electrically insulating body having a predetermined array of internal terminals (10) comprising openings therethrough for electrical interconnection to said electronic components (3), a predetermined array of external terminals (11) comprising openings therethrough for electrical interconnection to said external circuitry (5), said internal (10) and external (11) terminals being electrically interconnected by a multiplicity of conductive paths; b) aligning said array of internal terminals (10) with first bonding locations on said electronic component (3) and contacting said first bonding locations with said internal terminals (10): c) bonding said array of internal terminals (10) to said first bonding locations on said electronic component (3) so that solder on said first bonding locations flows into said internal terminals (10); d) aligning said array of external terminals (11) with second bonding locations on said external circuitry (5) and contacting said second bonding locations with said external terminals (11); and e) bonding said array of external terminals (11) to said second bonding locations on said external circuitry (5) so that solder on said second bonding flows into said external terminals (11).
References Cited (Backward Citations)
No citation records indexed.
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