Patent EP0169574A2 successfully refreshed from Google Patents.
EP0169574A2
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EP
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Apparatus for manufacturing semiconductor device
Assignee: Toshiba Corp
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Filing: 1985-07-26
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Granted: —
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Expires: 2005-07-26
Abstract
Abstract A lead frame (40) is conveyed along a convey direction (2) in a convey path (10) filled with a reducing gas. A semiconductor pellet (50) is placed on the lead frame at a die bonding portion (12). A bonding wire (80) made of copper or a copper alloy is supplied to the next wire bonding portion (14). The lower end of the bonding wire (80) is melted with an oxyhydrogen torch surrounded by an air curtain, thereby forming a ball (82). The bonding wire is guided into the convey path by a capillary (60). The ball is thermocompress- ed to an electrode pad (56) of the semiconductor pellet (50). The other end of the bonding wire is fused and thermocom- pressed against the outer lead (44) of the lead frame (40) at a postbonding portion (16). The bonding wire (81) is thus looped between the semiconductor pellet (50) and the outer lead (44).
Inventors
- 👤 Mituo C/O Patent Division Kobayashi
- 👤 Osamu C/O Patent Division Usuda
- 👤 Yoshihiko C/O Patent Division Sano
- 👤 Koichiro C/O Patent Division Atsumi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 13:39
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H05; H05K; H05K13/00; H05K13/06; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/041; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/0198; H10W72/071; H10W72/0711; H10W72/07125; H10W72/07141; H10W72/07173; H10W72/075; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07541; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
201 words
An apparatus for manufacturing a semiconductor device, wherein a bonding wire (80) is looped between an electrode pad (56) of a semiconductor element (50) and an outer lead (44) of a lead frame (40), comprising: ball forming means (90) for heating the bonding wire (80) of copper or a copper alloy at a wire bonding portion (14) and forming balls (82, 84) at both ends of the bonding wire; bonding wire feeding means (60) for feeding the bonding wire to said wire bonding portion and compressing the ball (82) of the bonding wire on the electrode pad (56); and compressing means (70) for compressing the ball (84) of the bonding wire on the outer lead (44) at a postbonding portion; characterized by comprising; a convey path (10) for conveying the lead frame (40) along a convey direction (2), said convey path being provided with the wire bonding portion (14) and postbonding portion (16) which are separated from each other along the convey direction; and gas supply means (31, 35, 48) for supplying a reducing or inert gas to said wire bonding portion (14) and said postbonding-portion (16) and surrounding the bonding wire and the balls by the reducing or inert gas.
Claim 2
Independent Claim
201 words
An apparatus for manufacturing a semiconductor device, wherein a bonding wire (80) is looped between an electrode pad (56) of a semiconductor element (50) and an outer lead (44) of a lead frame (40), comprising: ball forming means (90) for heating the bonding wire (80) of copper or a copper alloy at a wire bonding portion (14) and forming balls (82, 84) at both ends of the bonding wire; bonding wire feeding means (60) for feeding the bonding wire to said wire bonding portion and compressing the ball (82) of the bonding wire on the electrode pad (56); and compressing means (70) for compressing the ball (84) of the bonding wire on the outer lead (44) at a postbonding portion; characterized by comprising; a convey path (10) for conveying the lead frame (40) along a convey direction (2), said convey path being provided with the wire bonding portion (14) and postbonding portion (16) which are separated from each other along the convey direction; and gas supply means (31, 35, 48) for supplying a reducing or inert gas to said wire bonding portion (14) and said postbonding-portion (16) and surrounding the bonding wire and the balls by the reducing or inert gas.
Claim 3
Dependent Claim
32 words
An apparatus according to claim 1, characterized by further comprising heating means (30, 32), provided at each of said wire bonding portion and said postbonding portion, for heating the lead frame (40).
Claim 4
Dependent Claim
20 words
An apparatus according to claim 2, characterized in that said heating means heats the lead frame (40) to about 300°C.
Claim 5
Dependent Claim
21 words
An apparatus according to claim 1, characterized in that the reducing gas is kept at a temperature not lower than 200°C.
Claim 6
Dependent Claim
39 words
5 . An apparatus according to claim 4, characterized in that the reducing gas comprises a gas mixture consisting of 5 to 20 % of a H 2 gas and 95 to 80 % of a N 2 gas.
Claim 7
Dependent Claim
53 words
An apparatus according to claim 1, characterized in that said bonding wire feeding means urges the ball (82) of the bonding wire (80) against the electrode pad (56) so that a diameter of a bonding region of the ball and the electrode pad becomes not less than twice that of the bonding wire.
Claim 8
Dependent Claim
48 words
An apparatus according to claim 6, characterized in that said bonding wire feeding means urges the ball (82) of the bonding wire (80) against the electrode pad (56) so that a part of the ball extends into the electrode pad to a depth of 0.4 to 3 µm.
Claim 9
Dependent Claim
26 words
An apparatus according to claim 7, characterized in that said bonding wire feeding means applies a load of 50 to 100 g to the bonding wire.
Claim 10
Dependent Claim
46 words
An apparatus according to claim 1, characterized in that said compressing means urges the ball (84) of the bonding wire (80) against the outer lead (44) so that a part of the ball extends into the outer lead to a depth of 20 to 50 µm.
Claim 11
Dependent Claim
24 words
An apparatus according to claim 9, characterized in that said compressing means applies a load of 300 to 500 g to the bonding wire.
Claim 12
Dependent Claim
29 words
An apparatus according to claim 1, characterized in that said convey path (10) comprises a die bonding portion (12) before said wire bonding portion along the convey direction (2).
Claim 13
Dependent Claim
36 words
An apparatus according to claim 11, characterized by further comprising semiconductor element mounting means (52) for supplying a semiconductor element (50) to said die bonding portion (12) and mounting the element on the lead frame (40).
Claim 14
Dependent Claim
117 words
An apparatus according to claim 1, characterized in that said ball forming means comprises a double-structure burner (90) having an inner tube (92) and an outer tube (94) outside said inner tube, a gas mixture of an H 2 gas and an 0 2 gas in a mixing ratio of 2 : 1 is blown from said inner tube to form an oxyhydrogen torch (100), and a gas mixture of an 0 2 gas and an N 2 gas in a mixing ratio of 20 to 100 % : 80 to 0 % is blown from a space (96) between said outer tube and said inner tube to form an air curtain (102) around the oxyhydrogen torch.
Claim 15
Dependent Claim
48 words
An apparatus according to claim 13, characterized in that said convey path (10) comprises a substantially rectangular and cylindrical cover (20), and a portion of said cover corresponding to said wire bonding portion (14) comprises a window (24) for supplying the bonding wire to said convey path therethrough.
Claim 16
Dependent Claim
50 words
An apparatus according to claim 14, characterized in that said window (24) has a variable opening area, and the opening area of said window is decreased and the ball is surrounded by the reducing gas when said burner (90) melts the bonding wire (80) to form the ball (82, 84).
References Cited (Backward Citations)
No citation records indexed.
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