Patent EP0164921A2 successfully refreshed from Google Patents.
EP0164921A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Improvements in and relating to printed circuit boards
Assignee: Individual
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Filing: 1985-05-16
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Granted: —
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Expires: 2005-05-16
Abstract
Abstract A single or multi-layer circuit board is formed by printing directly onto an electrically non-conductive medium using a metal-based fluid which, upon drying, leaves behind a solid metallic residue defining a predetermined circuit configuration. For multi-layer boards a plurality of conductive and non-conductive layers are printed alternately onto a non-conductive substrate or onto a conductive substrate provided with a non-conductive surface.
Inventors
- 👤 John Murray
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 06:55
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1275; H05K3/46; H05K3/4644; H05K3/4664; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/0289; H05K1/03; H05K1/05; H05K1/09; H05K1/092; H05K1/095; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0143; H05K2203/05; H05K2203/0502; H05K2203/0534; H05K3/20; H05K3/207
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
61 words
A single layer printed circuit board comprising an electrically non-conductive layer carrying an electrically conductive medium in the form of a pattern defining a predetermined circuit configuration, characterised in that the conducting medium is printed onto the electrically non-conductive medium in the form of a metal-based fluid which, upon drying, leaves behind a solid metallic residue defining said predetermined circuit configuration.
Claim 2
Dependent Claim
61 words
A single layer printed circuit board comprising an electrically non-conductive layer carrying an electrically conductive medium in the form of a pattern defining a predetermined circuit configuration, characterised in that the conducting medium is printed onto the electrically non-conductive medium in the form of a metal-based fluid which, upon drying, leaves behind a solid metallic residue defining said predetermined circuit configuration.
Claim 3
Dependent Claim
20 words
A printed circuit board as claimed in claim 1, wherein the electrically non-conductive layer is carried by a metal substrate.
Claim 4
Independent Claim
87 words
A method of manufacturing a single-layer printed circuit board of the type comprising an electrically non-conductive medium carrying an electrically conductive medium in the form of a pattern defining a predetermined circuit configuration, characterised in that the conducting medium is printed directly onto the electrically non-conductive medium in the form of a metal-based fluid and the metal based fluid is then dried, the metal-based fluid being chosen such that, upon drying, it leaves behind on said non-conductive medium a solid metallic residue defining said predetermined circuit configuration.
Claim 5
Independent Claim
87 words
A method of manufacturing a single-layer printed circuit board of the type comprising an electrically non-conductive medium carrying an electrically conductive medium in the form of a pattern defining a predetermined circuit configuration, characterised in that the conducting medium is printed directly onto the electrically non-conductive medium in the form of a metal-based fluid and the metal based fluid is then dried, the metal-based fluid being chosen such that, upon drying, it leaves behind on said non-conductive medium a solid metallic residue defining said predetermined circuit configuration.
Claim 6
Dependent Claim
98 words
A multi-layer printed circuit board in which at least two layers of an electrically conductive medium are separated by an electrically non-conductive medium, said two conductive medium layers defining respective predetermined circuit patterns, characterised in that the board comprises an electrically non-conductive layer onto which is printed a conducting medium and a non-conducting medium alternately in layers, the conducting medium in each case being printed directly onto a respective non-conductive layer in the form of a metal-based fluid which, upon drying, leaves behind a solid metallic residue on that non-conductive layer to define a respective predetermined circuit configuration.
Claim 7
Dependent Claim
98 words
A multi-layer printed circuit board in which at least two layers of an electrically conductive medium are separated by an electrically non-conductive medium, said two conductive medium layers defining respective predetermined circuit patterns, characterised in that the board comprises an electrically non-conductive layer onto which is printed a conducting medium and a non-conducting medium alternately in layers, the conducting medium in each case being printed directly onto a respective non-conductive layer in the form of a metal-based fluid which, upon drying, leaves behind a solid metallic residue on that non-conductive layer to define a respective predetermined circuit configuration.
Claim 8
Dependent Claim
31 words
A multi-layer circuit board wherein discrete components are mounted on a top surface of the board and are connected to two or more conductive layers via holes in said non-conductive layers.
Claim 9
Dependent Claim
31 words
A multi-layer circuit board wherein discrete components are mounted on a top surface of the board and are connected to two or more conductive layers via holes in said non-conductive layers.
Claim 10
Independent Claim
133 words
A method of manufacturing a multi-layer printed circuit board of the type having at least two layers of an electrically conductive medium separated by an electrically non-conductive medium, the two conductive medium layers defining respective predetermined circuit patterns, characterised by printing a first electrically conductive medium layer directly onto a first electrically non-conductive layer in the form of a metal-based fluid, drying the metal-based fluid, the metal-based fluid being chosen such that, on drying it leaves behind a solid metallic residue on said first non-conductive layer defining a first predetermined circuit configuration, applying a second non-conductive layer over said solid metallic residue and printing a second conducting material layer over the second non-conductive layer, whereby, upon drying, said second conductive material layer defines a second predetermined circuit configuration on said second non-conductive layer.
Claim 11
Independent Claim
133 words
A method of manufacturing a multi-layer printed circuit board of the type having at least two layers of an electrically conductive medium separated by an electrically non-conductive medium, the two conductive medium layers defining respective predetermined circuit patterns, characterised by printing a first electrically conductive medium layer directly onto a first electrically non-conductive layer in the form of a metal-based fluid, drying the metal-based fluid, the metal-based fluid being chosen such that, on drying it leaves behind a solid metallic residue on said first non-conductive layer defining a first predetermined circuit configuration, applying a second non-conductive layer over said solid metallic residue and printing a second conducting material layer over the second non-conductive layer, whereby, upon drying, said second conductive material layer defines a second predetermined circuit configuration on said second non-conductive layer.
Claim 12
Dependent Claim
84 words
A method as claimed in claim 3 or 6, wherein printing is accomplished by forming a photographic negative of a required circuit configuration, producing from the negative a plastics printing plate wherein the pattern of the circuit is in raised relief, applying said conductive metal-based fluid to the plate by way of a roller, transferring the image from the plate to a cylinder covered by a rubber sheet and thence to the non-conductive surface on which the relevant circuit pattern is to be applied.
Claim 13
Dependent Claim
61 words
A method as claimed in claim 3, 6 or 7, in which the metal-based fluid comprises flaked and/or powdered metal particles suspended in a mixture of two different varnishes, the varnishes being chosen such that when heat is applied to the fluid, one varnish evaporates and the other oxidises to bind the flaked and/or powdered metal particles into a solid layer.
Claim 14
Dependent Claim
12 words
A method as claimed in claim 8, wherein the metal is silver.
References Cited (Backward Citations)
No citation records indexed.
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