Patent EP0164906A1 successfully refreshed from Google Patents.
EP0164906A1
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EP
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Solder composition
Assignee: Raychem Corp
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Filing: 1985-05-13
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Granted: —
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Expires: 2005-05-13
Abstract
Abstract A solder composition is used to form interconnects between electrical components, such as chip carriers and circuit boards, wherein the solder composition comprises solder paste and disposed in the solder paste a filler which may be particles of filaments which are solid at a temperature at which the solder is molten and are present in an amount and are of sufficient size and density to substantially maintain the solder in a preformed shape when the solder is molten. This filled solder paste can be screen printed on such components and can be layered to form an interconnect with increased height to better withstand thermal expansion stresses.
Inventors
- 👤 Gabe Cherian
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 04:10
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; B23K35/22; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K3/341; H05K3/3431; H05K3/3442
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
59 words
A solder composition comprising: solder paste; and disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 2
Dependent Claim
59 words
A solder composition comprising: solder paste; and disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 3
Dependent Claim
13 words
A solder composition according to claim 1 wherein the filler is electrically conductive.
Claim 4
Dependent Claim
27 words
A solder composition according to claim 1 or 2 wherein the filler comprises metal particles or filaments, preferably of copper, iron or nickel, and more preferably copper.
Claim 5
Dependent Claim
46 words
A solder composition according to claim 1, 2 or 3 wherein the filler is present in an amount of at least 10% by weight based on the total weight of the solder paste-filler mixture, preferably from 10% to 90%, and more preferably from 20% to 60%.
Claim 6
Independent Claim
138 words
A method for forming a connection between preselected points of first and second electrically conductive elements comprising: applying to a preselected point on the first electrically conductive element an amount of solder composition sufficient to form an electrical connection wherein the solder composition comprises solder paste having disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten; positioning a preselected point on the second electrically conductive element in contact with said amount of solder composition; and effecting a bond between the electrically conductive elements at the preselected points by reflowing the solder in the solder composition.
Claim 7
Independent Claim
138 words
A method for forming a connection between preselected points of first and second electrically conductive elements comprising: applying to a preselected point on the first electrically conductive element an amount of solder composition sufficient to form an electrical connection wherein the solder composition comprises solder paste having disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten; positioning a preselected point on the second electrically conductive element in contact with said amount of solder composition; and effecting a bond between the electrically conductive elements at the preselected points by reflowing the solder in the solder composition.
Claim 8
Dependent Claim
46 words
A method according to claim 5 wherein the filler in the solder composition is present in an amount of at least 10% by weight based on the total weight of the solder paste-filler mixture, preferably from 15% to 80% and more preferably from 20% to 60%.
Claim 9
Dependent Claim
20 words
A method according to claim 5 or 6 wherein the filler comprises copper, iron or nickel, preferably spherical copper particles.
Claim 10
Independent Claim
97 words
A method for forming an electrically conductive element having a preselected solder point thereon comprising; applying to a preselected point on the electrically conductive element an amount of a solder composition sufficient to form an electrical connection wherein the solder composition comprises solder paste having disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 11
Independent Claim
97 words
A method for forming an electrically conductive element having a preselected solder point thereon comprising; applying to a preselected point on the electrically conductive element an amount of a solder composition sufficient to form an electrical connection wherein the solder composition comprises solder paste having disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 12
Dependent Claim
15 words
A method according to claim 8 further comprising the step of reflowing the solder composition.
Claim 13
Dependent Claim
45 words
A method according to claim 9 further comprising: applying an additional amount of the solder composition on the reflowed solder on the preselected point, and preferably reflowing the additional amount of the solder composition, whereby a filled solder contact point of increased height is formed.
Claim 14
Dependent Claim
45 words
A method according to claim 9 or 10 further comprising: positioning a preselected point on a second electrically conductive element in contact with the preselected solder point on said electrically conductive element; and effecting a bond between the electrically conductive elements by reflowing the solder.
Claim 15
Dependent Claim
74 words
12 An article comprising an electrically conductive element having disposed on a preselected point thereon a solder composition comprising: solder paste; and disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 16
Dependent Claim
74 words
12 An article comprising an electrically conductive element having disposed on a preselected point thereon a solder composition comprising: solder paste; and disposed in the solder paste a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, and which are present in an amount and are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 17
Dependent Claim
13 words
An article according to claim 12 wherein the solder composition has been reflowed.
Claim 18
Dependent Claim
24 words
An article according to claim 13 having disposed on the reflowed solder composition on the preselected point an additional amount of said solder composition.
Claim 19
Dependent Claim
17 words
An article according to claim 12, 13 or 14 wherein the filler comprises copper, iron or nickel.
References Cited (Backward Citations)
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