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EP0164580A2
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Electroless copper plating bath and plating method using such bath
Assignee: International Business Machines Corp
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Filing: 1985-05-10
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Granted: —
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Expires: 2005-05-10
Abstract
Abstract The electroless copper plating bath having improved stability contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains essentially a cupric ion source, a reducing agent forthe cupric ion source, and a complexing agent for the cupric ion. A substrate to be plated is contacted with the plating bath maintained preferably at a temperature in the range between about 70°C and about 80°C.
Inventors
- 👤 William Joseph Amelio
- 👤 Peter Gerard Bartolotta
- 👤 Voya Markovich
- 👤 Ralph Elliott Parsons
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 14:53
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
122 words
Electroless copper plating bath which comprises: A. cupric ion source in an amount from about 3 to about 15 grams per liter and preferably from about 8 to about 12 grams per liter calculated as cupric sulfate; B. a reducing agent for the cupric ion source in an amount from about 0.7 to about 7 grams per liter and preferably from about 0.7 to about 2.2 grams per liter calculated as formaldehyde; C. a complexing agent, like ethylene diamine tetraacetic acid or salt thereof, for the cupric ion in an amount of about 20 to 50 grams per liter; and D. about 1 part per billion to about 1,000 parts per billion of a cationic polymer from acrylamide or methacrylamide, or both.
Claim 2
Dependent Claim
122 words
Electroless copper plating bath which comprises: A. cupric ion source in an amount from about 3 to about 15 grams per liter and preferably from about 8 to about 12 grams per liter calculated as cupric sulfate; B. a reducing agent for the cupric ion source in an amount from about 0.7 to about 7 grams per liter and preferably from about 0.7 to about 2.2 grams per liter calculated as formaldehyde; C. a complexing agent, like ethylene diamine tetraacetic acid or salt thereof, for the cupric ion in an amount of about 20 to 50 grams per liter; and D. about 1 part per billion to about 1,000 parts per billion of a cationic polymer from acrylamide or methacrylamide, or both.
Claim 3
Dependent Claim
23 words
Plating bath according to claim 1 which contains about 1 part per billion to about 500 parts per billion of said cationic polymer.
Claim 4
Dependent Claim
27 words
Plating bath according to claim 1 or 2 which contains an anionic surface-active agent, generally in an amount from about 0.02 to about 0.3 grams per liter.
Claim 5
Dependent Claim
20 words
Plating bath according to any one of claims 1 to 3 having a pH of about 11.8 to about 12.5.
Claim 6
Dependent Claim
26 words
Plating bath according to any one of claims 1 to 4 which also contains about 10 to about 25 milligrams per liter of a cyanide ion.
Claim 7
Dependent Claim
20 words
Plating bath according to any one of claims 1 to 5 wherein said cationic polymer is a multifunctional cationic polymer.
Claim 8
Dependent Claim
24 words
Plating bath according to any one of claims 1 to 6 wherein said cationic polymer is a copolymer of acrylamide and ammonium quaternary compound.
Claim 9
Dependent Claim
24 words
Plating bath according to any one of claims 1 to 7 which also contains between about 2 and about 4 ppm O 2 .
Claim 10
Dependent Claim
20 words
Method for coating a substrate which comprises contacting the substrate with an electroless copper plating bath according to claim 1.
Claim 11
Dependent Claim
22 words
Method according to claim 9 wherein said electroless copper plating bath is maintained at a temperature of about 70°C to about 80°C.
References Cited (Backward Citations)
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