Patent EP0160439A2 successfully refreshed from Google Patents.
EP0160439A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Improved printed circuit board
Assignee: Junkosha Co Ltd
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Filing: 1985-04-11
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Granted: —
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Expires: 2005-04-11
Abstract
Abstract A printed circuit board for use in the 10 GHz signal transmission range is provided comprising a layer of expanded, porous polytetrafluorethylene having a layer of electrical signal transmitting metal firmly bonded to one side thereof and preferably having a layer of a solid plastic such as polyimide, polyamide or polyester bonded to the other side. Unwanted metal is removed to provide the desired circuitry.
Inventors
- 👤 Hirosuke Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 15:49
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/046; B32B15/08; B32B5/00; B32B5/18; B32B7/00; B32B7/04; B32B7/12; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; H05K1/0353; H05K1/036; H05K1/0366; H05K3/00; H05K3/38; H05K3/386; H05K3/387; B32B2266/00; B32B2266/02; B32B2266/0214; B32B2266/025; B32B2305/00; B32B2305/30; B32B2307/00; B32B2307/20; B32B2307/202; B32B2457/00; B32B2457/08; H05K1/0213; H05K1/0237; H05K1/024; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/0137; H05K2201/0145; H05K2201/015; H05K2201/0154; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
28 words
A printed circuit board comprising a layer of expanded, porous polytetrafluoroethylene (PTFE) firmly bonded to and in laminar contact with at least one layer of electrically conducting metal.
Claim 2
Dependent Claim
28 words
A printed circuit board comprising a layer of expanded, porous polytetrafluoroethylene (PTFE) firmly bonded to and in laminar contact with at least one layer of electrically conducting metal.
Claim 3
Dependent Claim
27 words
A printed circuit board according to claim 1 characterised in that said metal layer has been catalytically plated on to a surface of said expanded, porous-PTFE layer.
Claim 4
Dependent Claim
29 words
A printed circuit board according to claim 1 characterised in that said metal layer is a metal foil bonded to said expanded, porous PTFE layer with a bonding agent.
Claim 5
Dependent Claim
25 words
A printed circuit board according to claim 3, characterised in that said bonding agent consists of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) or tetrafluoroethylene-hexafluoropropylene copolymer (FEP).
Claim 6
Dependent Claim
28 words
A printed circuit board according to any preceding claim characterised in that said layer of expanded, porous PTFE is a cloth woven from fibers of expanded, porous PTFE.
Claim 7
Dependent Claim
21 words
A printed circuit board according to any preceding claim characterised in that said layer of expanded porous PTFE contains a filler.
Claim 8
Dependent Claim
17 words
A printed circuit board according to claim 6 characterised in that said filler is titanium dioxide powder.
Claim 9
Dependent Claim
17 words
A printed circuit board according to claim 6 characterised in that said filler is aluminum oxide powder.
Claim 10
Dependent Claim
24 words
A printed circuit board according to any preceding claim characterised in that said layer of expanded, porous PTFE has a plurality of through holes.
Claim 11
Dependent Claim
34 words
A printed circuit board according to any preceding claim characterised in that said layer of expanded, porous PTFE is a composite of a plurality of layers of expanded, porous PTFE having different specific gravities.
Claim 12
Dependent Claim
29 words
A printed circuit board according to any preceding claim characterised in that said expanded, porous PTFE has a layer of solid, non-porous plastic material bonded to one side thereof.
Claim 13
Dependent Claim
26 words
A printed circuit board according to claim 11 characterised in that said solid layer consists of solid, non-porous PTFE, polyimide resin, polyamide resin or polyester resin.
References Cited (Backward Citations)
No citation records indexed.
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