Patent EP0157685A1 successfully refreshed from Google Patents.
EP0157685A1
Expired / Lapsed
EP
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Corrosion resistant microcircuit package
Assignee: Isotronics Inc
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Filing: 1985-03-15
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Granted: —
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Expires: 2005-03-15
Abstract
Abstract @ A microcircuit package utilizes a two-part bimetal lead frame (10) to achieve high-integrity matched hermetic seals for withstanding corrosion including salt spray through the utilization of a two-part lead comprising in one embodiment a "Kovar" portion (12) which passes from the interior of the package through the glass seal (30) to within a predetermined shortdistance of the package exterior. Atthis pointthe "Kovar" lead portion (12) is mechanically and electrically connected to another metal lead frame portion (14) which passes the rest of the way through the glass seal (30) and extends from the microcircuit package, with the exteriorly extending lead frame portion (14) being selected for either corrosion resistance or improved thermal or electrical characteristics, or both.
Inventors
- 👤 Steven A. Tower
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 04:27
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W70/456; H10W76/00; H10W76/60; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
74 words
A two-part lead frame (10) for use with a microcircuit package having at least one side wall (20) with apertures (28) therethrough, with said two-part lead frame being sealed in at least one of said apertures such that one lead frame portion (12) extends to the interior of said package and such that the other lead frame portion (14) extends exteriorly of said package, said lead frame portions being electrically and mechanically connected together.
Claim 2
Dependent Claim
74 words
A two-part lead frame (10) for use with a microcircuit package having at least one side wall (20) with apertures (28) therethrough, with said two-part lead frame being sealed in at least one of said apertures such that one lead frame portion (12) extends to the interior of said package and such that the other lead frame portion (14) extends exteriorly of said package, said lead frame portions being electrically and mechanically connected together.
Claim 3
Dependent Claim
43 words
The lead frame of claim 1, wherein said lead frame (10) is sealed in said aperture (28) by a sealant (30) having predetermined thermal characteristics and wherein said interiorly extending lead portion (12) has thermal characteristics which match those of said sealant material.
Claim 4
Dependent Claim
18 words
The lead frame of claim 2, wherein said interiorly projecting lead frame portion (12) is made of "Kovar".
Claim 5
Dependent Claim
24 words
The lead frame of claim 1, wherein the joint (18) between the two portions (12,14) lies close the exterior of said side wall (20).
Claim 6
Dependent Claim
19 words
The lead frame of claim 1, wherein said exteriorly extending lead frame portion (14) is a corrosion resistant material.
Claim 7
Dependent Claim
21 words
The lead frame of claim 1, wherein said exteriorly extending lead frame portion (14) is a material having preselected thermal characteristics.
Claim 8
Dependent Claim
18 words
The lead frame of claim 1, wherein said exteriorly extending lead frame portion (14) has preselected electrical characteristics.
Claim 9
Dependent Claim
100 words
A microcircuit package having a two-part bimetal lead frame (10) for achieving high integrity matched hermetic seals for withstanding corrosion comprising : a microcircuit package having a side wall (20) with at least one aperture (28) therethrough, at least one two-part bimetal lead frame (10) extending through and being sealed to said aperture with a sealant (30), said two-part bimetal lead frame including an interiorly projecting portion (12) and an exteriorly projecting portion (14) which are electrically and mechanically connected together at a joint (18) , said joint being a predetermined short distance (36) away from the microcircuit package exterior.
Claim 10
Dependent Claim
100 words
A microcircuit package having a two-part bimetal lead frame (10) for achieving high integrity matched hermetic seals for withstanding corrosion comprising : a microcircuit package having a side wall (20) with at least one aperture (28) therethrough, at least one two-part bimetal lead frame (10) extending through and being sealed to said aperture with a sealant (30), said two-part bimetal lead frame including an interiorly projecting portion (12) and an exteriorly projecting portion (14) which are electrically and mechanically connected together at a joint (18) , said joint being a predetermined short distance (36) away from the microcircuit package exterior.
Claim 11
Dependent Claim
15 words
The microcircuit package of claim 8, wherein said interior lead frame portion (12) is "Kovar".
Claim 12
Dependent Claim
26 words
The microcircuit package of claim 8, wherein at least a portion of said microcircuit is made of "Kovar", said portion including said apertured side wall (20).
Claim 13
Dependent Claim
14 words
The microcircuit package of claim 10, wherein said sealant (30) is a borosilicate glass.
Claim 14
Dependent Claim
27 words
The microcircuit package of claim 8, wherein said exterior lead frame portion (14) includes a material taken from the group consisting of nickel, stainless steel, or aluminum.
Claim 15
Dependent Claim
26 words
The microcircuit package of claim 8, wherein said interior lead frame portion (12) includes a material having thermal characteristics matched to that of said sealant (30).
Claim 16
Dependent Claim
58 words
The microcircuit package of claim 8, wherein said package includes a base (24), a ring (22) sealed to said base, and a lid (35) sealed to said ring, said microcircuit package including an electronic circuit (31) mounted to said base (24) and having electrical contact pads electrically connected to selected ones of said interior lead frame portions (12).
References Cited (Backward Citations)
FR2436498A1
Cited
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