Patent EP0157508A2 successfully refreshed from Google Patents.
EP0157508A2
Expired / Lapsed
EP
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Thin adhesive sheet for use in working semiconductor wafers
Assignee: Nitto Denko Corp
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Filing: 1985-03-11
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Granted: —
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Expires: 2005-03-11
Abstract
Abstract @ A thin adhesive sheet for working semiconductor wafers is described. The sheet comprises a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process; the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up of IC element chips from the wafer, can be carried out easily.
Inventors
- 👤 Gosei Nitto Electric-Industrial Co. Ltd. Uemura
- 👤 Eiji Nitto Electric Industrial Co. Ltd Shigemura
- 👤 Yoshinari Nitto Elec. Ind. Co. Ltd. Satoda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 22:03
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; C; C08; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/40; C08G18/62; C08G18/6216; C08G18/625; C08G18/67; C08G18/671; C08G18/672; C08G18/673; C09; C09J; C09J175/00; C09J175/04; C09J175/14; C09J175/16; C09J4/00; C09J4/06; C09J7/00; C09J7/30; C09J7/38; C09J7/381; C09J7/385; H10P50/00; H10P72/00; H10P72/04; H10P72/0442; H10P72/70; H10P72/74; H10P72/7402; H10W; H10W72/00; H10W72/30; C08G2170/00; C08G2170/40; C08L; C08L51/00; C08L51/003; C09J2203/00; C09J2203/326; C09J2423/00; C09J2423/006; C09J2427/00; C09J2427/006; C09J2433/00; C09J2467/00; C09J2467/006; H10P72/7416; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
129 words
A thin adhesive sheet for working semiconductor wafers, comprising a light-permeable support and provided thereon a pressure-sensitive adhesive layer which can be cured by irradiation with light to form a three-dimensional network structure, wherein the pressure-sensitive adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator, and the 180° peeling adhesive force of the pressure-sensitive adhesive layer to the semiconductor wafer (as determined at a peeling speed of 300 mm/min) is 200 g/ 20 mm or more and, after irradiation with light, decreases to 150 g/20 mm or less.
Claim 2
Dependent Claim
129 words
A thin adhesive sheet for working semiconductor wafers, comprising a light-permeable support and provided thereon a pressure-sensitive adhesive layer which can be cured by irradiation with light to form a three-dimensional network structure, wherein the pressure-sensitive adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator, and the 180° peeling adhesive force of the pressure-sensitive adhesive layer to the semiconductor wafer (as determined at a peeling speed of 300 mm/min) is 200 g/ 20 mm or more and, after irradiation with light, decreases to 150 g/20 mm or less.
Claim 3
Dependent Claim
36 words
The thin adhesive sheet as claimed in Claim 1, wherein the light-permeable support is at least one member selected from the group consisting of a heat-shrinkable plastic film and a stretchable synthetic resin or rubber film.
Claim 4
Dependent Claim
35 words
The thin adhesive sheet as claimed in Claim 1, wherein the light-permeable support is selected from the group consisting of a polyvinyl chloride film, a polyethylene terephthalate film, a polyethylene film and a polypropylene film.
Claim 5
Dependent Claim
24 words
The thin -adhesive sheet as claimed in any preceding Claim, wherein the light-permeable support has a thickness of from about 10 to 300 um.
Claim 6
Dependent Claim
28 words
The thin adhesive sheet as claimed in any preceding Claim, wherein the base polymer is selected from the group consisting of a rubber-based polymer and an acrylic polymer.
Claim 7
Dependent Claim
50 words
The thin adhesive sheet as claimed in Claim 5, wherein the acrylic polymer is selected from the group consisting of an alkyl (meth)acrylate and a copolymer comprising about 50 to 99.5% by weight of an alkyl (meth)acrylate and about 50 to 0.5% by weight of an unsaturated monomer copolymerizable therewith.
Claim 8
Dependent Claim
26 words
The thin adhesive sheet as claimed in any preceding Claim, wherein the low molecular weight compound has a number average molecular weight of 10,000 or less.
Claim 9
Dependent Claim
19 words
The thin adhesive sheet as claimed in Claim 7, wherein the number average molecular weight is 5,000 or less.
Claim 10
Dependent Claim
27 words
The thin adhesive sheet as claimed in any preceding Claim, wherein the low molecular weight compound has 3 to 6 photopolymerizable carbon-carbon double bonds in the molecule.
Claim 11
Dependent Claim
35 words
The thin adhesive sheet as claimed in any preceding Claim 1, wherein the low molecular weight compound is selected from the group consisting of trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate and dipentaerythritol hexaacrylate.
Claim 12
Dependent Claim
43 words
The thin adhesive sheet as claimed in any preceding Claim , wherein the photopolymerization initiator is selected from the group consisting of isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, acetophenone diethylketal, benzyl dimethylketal, a-hydroxycyclohexyl phenyl ketone'and 2-hydroxymethylphenylpropane.
Claim 13
Dependent Claim
26 words
The thin adhesive sheet as claimed in any preceding Claim , wherein the pressure-sensitive adhesive layer has a thickness of from about 5 to 70 µm.
Claim 14
Dependent Claim
58 words
The thin adhesive sheet as claimed in any preceding Claim , wherein the pressure-sensitive adhesive layer has a 100% modulus (20°C) of 10 kg/cm 2 or less, a gel content (as determined by immersing in toluene (20°C) for 24 hours) of less than 55% by weight, and a degree of swelling of gel of at least 20 times.
Claim 15
Dependent Claim
20 words
The thin adhesive sheet as claimed in Claim 13, wherein the 100% modulus is 0.5 to 8 kg/cm 2 .
Claim 16
Dependent Claim
24 words
The thin adhesive sheet as claimed in Claim 13 or Claim 14, wherein the gel content is 0.5 to less than 55% by weight.
Claim 17
Dependent Claim
25 words
The thin adhesive sheet as claimed in any of Claims 13 to 15, wherein the degree of swelling of gel is 25 to 80 times.
Claim 18
Dependent Claim
29 words
A thin adhesive sheet as claimed in any preceding Claim, wherein the 180° peeling adhesive force is 200 to 1,800 g/20 mm, and preferably 200 to 1,000 g/20 mm.
Claim 19
Independent Claim
22 words
A method of producing IC element chips, substantially as hereinbefore described with reference to the Examples 1 to 7 of the invention.
Claim 20
Independent Claim
22 words
A method of producing IC element chips, substantially as hereinbefore described with reference to the Examples 1 to 7 of the invention.
References Cited (Backward Citations)
No citation records indexed.
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