Improvements in or relating to the covering of substrates with synthetic resin films

Claim 2

Process for covering a substrate with a synthetic resin film by contacting the substrate with one or more precursorsfor the synthetic resin and polymerising the precursor(s) in contact with the substrate characterised in that the or each precursor is evaporated under vacuum to form vapors of-the precursor and the substrate is contacted with the vapors.

Claim 3

A process as claimed in claim 1, wherein the precursor is evaporated under a vacuum of from about 1 x 10 -2 to about 1 x 10 -6 Torr.

Claim 4

A process as claimed in claim 1 or 2, wherein the synthetic resin is formed from the precursor by a condensation polymerization reaction.

Claim 5

A process as claimed in claim 3, wherein the synthetic resin is a polyimide.

Claim 6

A process as claimed in claim 4, wherein the precursor comprises pyromellitic acid dianhydride and 4,4' - diaminodiphenylether.

Claim 7

A process as claimed in claim 3, wherein the synthetic resin is a polyamide.

Claim 8

A process as claimed in claim 6, wherein the precursor comprises terephthalic acid dichloride and 4,4'-diaminodiphenylether.

Claim 9

A process as claimed in claim 1 or 2, wherein the synthetic resin is formed by an addition polymerization reaction.

Claim 10

A process as claimed in.claim 8, wherein the synthetic resin is a polyurea.

Claim 11

A process as claimed in claim 9, wherein the precursor comprises 4,4'-diphenylmethane diisocyanate and 4,4'-diaminodiphenylether.

Claim 12

A process as claimed in claim 8, wherein the synthetic resin is a polyurethane.

Claim 13

A process as claimed in claim 11, wherein the precursor comprises 4,4'-diphenylmethane diisocyanate and p-hydroquinone.

Claim 14

A process as claimed in claim 1 or 2, wherein the synthetic resin is formed by a photo-polymerization reaction.

Claim 15

A process as claimed in claim 13, wherein the synthetic resin is a cinnamic acid derivative polymer.

Claim 16

A process as claimed in claim 14, wherein the precursor comprises distyryl ketone.

Claim 17

An apparatus for covering a substrate with a synthetic resin film by the process claimed in claim 1, characterised in that it comprises a treatment chamber connected to a vacuum supply, an evaporation container located within the chamber for each precursor, a holder for the substrate which holder is located within the chamber and is disposed so that the substrate can be contacted by precursor vapors from the or each evaporation container, a heater for heating the precursor in each evaporation container, and a shutter capable of being interposed between the substrate holder and the evaporation container(s).

Claim 18

An apparatus as claimed in claim 16 wherein a heater is provided for heating the substrate held by the substrate holder.

Claim 19

An apparatus as claimed in claim 16 or 17, wherein a part of at least one evaporation container extends outside of the treatment chamber, said part being heatable and containing precursor.

Claim 20

An apparatus as claimed in claim 16 wherein the treatment chamber includes a light transmitting window and the apparatus includes a light source outside the treatment chamber for irradiating the substrate through the window.