Patent EP0152634A2 successfully refreshed from Google Patents.
EP0152634A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method for manufacture of printed wiring board
Assignee: Hitachi Ltd
•
Filing: 1984-12-31
•
Granted: —
•
Expires: 2004-12-31
Abstract
Abstract A method for the manufacture of a printing wiring board, which proves particularly useful as a printed coil, is characterized by the fact that in the work in process which has undergone the step for fomation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil (8) having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.
Inventors
- 👤 Kanji Murakami
- 👤 Haruo Akahoshi
- 👤 Mineo Kawamoto
- 👤 Motoyo Wajima
- 👤 Yoichi Matsuda
- 👤 Kyoji Kawakubo
- 👤 Minoru Kanechiku
- 👤 Toyofusa Yoshimura
- 👤 Makoto Matsunaga
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 09:31
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/165; H01; H01F; H01F41/00; H01F41/02; H01F41/04; H01F41/041; H01F41/042; H05K3/00; H05K3/10; H05K3/20; H05K3/205; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/07; H05K2203/0703; H05K2203/0726; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
112 words
A method for the manufacture of a printed wiring board, characterized in that it comprises the following steps in the order mentioned: (a) applying a metallic film (6) on a substrate (1), (b) forming a plating resist (2) on said metallic film (6) except the portion intended for the formation of a conductor circuit, (c) plating said metallic film surface covered with said plating resist (2) thereby forming a conductor circuit (3), (d) separating said metallic film (6), said conductor circuit (3), and the said plating resist (2) jointly from said substrate (1), (e) transferring them to an insulating substrate (5), and (f) removing said metallic film (6) so transferred by etching.
Claim 2
Independent Claim
112 words
A method for the manufacture of a printed wiring board, characterized in that it comprises the following steps in the order mentioned: (a) applying a metallic film (6) on a substrate (1), (b) forming a plating resist (2) on said metallic film (6) except the portion intended for the formation of a conductor circuit, (c) plating said metallic film surface covered with said plating resist (2) thereby forming a conductor circuit (3), (d) separating said metallic film (6), said conductor circuit (3), and the said plating resist (2) jointly from said substrate (1), (e) transferring them to an insulating substrate (5), and (f) removing said metallic film (6) so transferred by etching.
Claim 3
Dependent Claim
24 words
The method of claim 1, whereby said transfer is effected by applying an insulating substratal material (5) by printing subsequently to the step (d).
Claim 4
Independent Claim
137 words
A method for the manufacture of a printed wiring board, characterized in that it comprises the following steps in the order mentioned: (a) applying a metallic film (6) on a substrate (1), (b) forming a plating resist (2) on said metallic film (6) except the portion intended for the formation of a conductor circuit, (c) plating said metallic film surface covered with said plating resist (2) thereby forming a conductor circuit (3), (d) applying an insulating substratal material (5) fast to the surface of said plating resist (2) and that of said conductor circuit (3), separating said metallic film (6), said conductor circuit (3), and said plating resist (2) in conjunction with said insulating substratal material (5) from said substrate (1), and immediately effecting their transfer, and (e) removing said metallic film (6) so transferred by etching.
Claim 5
Independent Claim
137 words
A method for the manufacture of a printed wiring board, characterized in that it comprises the following steps in the order mentioned: (a) applying a metallic film (6) on a substrate (1), (b) forming a plating resist (2) on said metallic film (6) except the portion intended for the formation of a conductor circuit, (c) plating said metallic film surface covered with said plating resist (2) thereby forming a conductor circuit (3), (d) applying an insulating substratal material (5) fast to the surface of said plating resist (2) and that of said conductor circuit (3), separating said metallic film (6), said conductor circuit (3), and said plating resist (2) in conjunction with said insulating substratal material (5) from said substrate (1), and immediately effecting their transfer, and (e) removing said metallic film (6) so transferred by etching.
Claim 6
Dependent Claim
22 words
The method of claim 3, wherein said insulating substratal material (5) is deposited by printing on the surface of said resist (2).
Claim 7
Independent Claim
22 words
The method of any of claims 1 to 4, wherein said printed wiring board is in the form of a printed coil.
Claim 8
Dependent Claim
39 words
The method of claim 5, further comprising the step of alternately superposing circuit resist layers containing spiral conductor circuit (3) and insulating substrate (5) layers and, at the same time, establishing electric continuity (9) between adjacent spiral circuits (3).
Claim 9
Independent Claim
26 words
The method of any of claims 1 to 6, further comprising the step of coarsening the surface of said metallic film (6) formed in step (a).
Claim 10
Dependent Claim
29 words
The method of any of claim 1 to 7, wherein the surface of said insulating substratal material (5) for transfer has an adhesive agent (4) applied thereon in advance.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.