Patent EP0149923A2 successfully refreshed from Google Patents.
EP0149923A2
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EP
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Microcircuit substrate and method of making same
Assignee: Jade Corp
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Filing: 1984-12-27
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Granted: —
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Expires: 2004-12-27
Abstract
Abstract Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations (118) which define score lines (12) along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallised and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates. This eliminates tensile forces which cause cracking of the substrate during lead bonding.
Inventors
- 👤 Vincent A. Spadafora
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 19:59
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/403; H10; H10W; H10W70/00; H10W70/099; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W72/00; H10W72/01; H10W72/0198; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K2201/09818; H05K2201/09854; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10946; H05K3/0011; H05K3/0044; H05K3/0052; H05K3/30; H05K3/32; H05K3/328; H05K3/4038; H05K3/4053; H05K3/4061; H05K3/42; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142; Y10T29/49144; Y10T29/49147; Y10T29/49149; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
95 words
A method of making individual microcircuit ceramic substrates, characterised by: (a) constructing an integral array of a plurality of individual substrates on a sheet of ceramic material, (b) forming rectangular holes in the ceramic material along score lines which define the periphery of individual substrates, (c) separating the individual substrates from the array by breaking the array along the score lines to yield individual substrates having semi-rectangular openings around the periphery of each substrate, (d) metallising at least one surface of the semi-rectangular openings, and (e) bonding leads to the substrate at the semi-rectangular openings.
Claim 2
Independent Claim
95 words
A method of making individual microcircuit ceramic substrates, characterised by: (a) constructing an integral array of a plurality of individual substrates on a sheet of ceramic material, (b) forming rectangular holes in the ceramic material along score lines which define the periphery of individual substrates, (c) separating the individual substrates from the array by breaking the array along the score lines to yield individual substrates having semi-rectangular openings around the periphery of each substrate, (d) metallising at least one surface of the semi-rectangular openings, and (e) bonding leads to the substrate at the semi-rectangular openings.
Claim 3
Dependent Claim
15 words
A method according to claim 1, characterised in that said bonding step comprises thermocompression bonding.
Claim 4
Dependent Claim
15 words
A method according to claim 1, characterised in that said bonding step comprises thermosonic bonding.
Claim 5
Dependent Claim
14 words
A method according to claim 1, characterised in that said forming step comprises punching.
Claim 6
Dependent Claim
18 words
A ceramic substrate for an electronic microcircuit made according to the method as claimed in any preceding claim.
Claim 7
Dependent Claim
40 words
A ceramic substrate for an electronic microcircuit comprising an element of ceramic material bounded by a peripheral edge, characterised in that the peripheral edge is provided with a plurality of spaced semi-rectangular recesses extending through the depth of the element.
Claim 8
Dependent Claim
40 words
A ceramic substrate for an electronic microcircuit comprising an element of ceramic material bounded by a peripheral edge, characterised in that the peripheral edge is provided with a plurality of spaced semi-rectangular recesses extending through the depth of the element.
Claim 9
Dependent Claim
42 words
A ceramic substrate as claimed in claim 6, characterised in that a metallic layer is provided on at least one surface of each of said recesses, and leads each having a flat face are bonded to at least some of said openings.
Claim 10
Dependent Claim
39 words
A ceramic substrate for a plurality of electronic microcircuits comprising a sheet of ceramic material provided with holes therethrough defining lines along which the sheet can be broken to form individual substrates, characterised in that the holes are rectangular.
Claim 11
Dependent Claim
39 words
A ceramic substrate for a plurality of electronic microcircuits comprising a sheet of ceramic material provided with holes therethrough defining lines along which the sheet can be broken to form individual substrates, characterised in that the holes are rectangular.
References Cited (Backward Citations)
No citation records indexed.
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