Patent US3263750A successfully refreshed from Google Patents.
Patent EP0146330A2 successfully refreshed from Google Patents.
EP0146330A2
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EP
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Integrated circuit device with textured bar pad
Assignee: Texas Instruments Inc
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Filing: 1984-12-11
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Granted: —
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Expires: 2004-12-11
Abstract
Abstract A semiconductor integrated circuit device (10) includes a bar pad (14) to which a semiconductor bar (12) is affixed. The lower surface (18) of the bar pad (14) is textured (20) to mechanically lock the bar pad (14) to the encapsulating medium (16).
Inventors
- 👤 John W. Orcutt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 12:39
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W74/00; H10W74/10; H10W74/111
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
71 words
An integrated circuit device comprising: a semiconductor bar; a bar pad having first and second surfaces, said semiconductor bar being affixed to said first surface of said bar pad, and said second surface of said bar pad being textured; and an encapsulating medium surrounding said semiconductor bar and at least a portion of said bar pad, mechanically locked to said textured surface to distribute thermal shear stress over the bar pad.
Claim 2
Dependent Claim
71 words
An integrated circuit device comprising: a semiconductor bar; a bar pad having first and second surfaces, said semiconductor bar being affixed to said first surface of said bar pad, and said second surface of said bar pad being textured; and an encapsulating medium surrounding said semiconductor bar and at least a portion of said bar pad, mechanically locked to said textured surface to distribute thermal shear stress over the bar pad.
Claim 3
Dependent Claim
25 words
The integrated circuit device of claim 1 wherein said textured second surface of said bar pad includes a plurality of spaced apart grooves formed therein.
Claim 4
Dependent Claim
18 words
The integrated circuit device of claim 1 wherein said textured second surface of said bar pad is pebbled.
Claim 5
Dependent Claim
25 words
The integrated circuit device of claim 1 wherein said textured second surface of said bar pad includes a plurality of spaced apart cavities formed therein.
Claim 6
Dependent Claim
64 words
An integrated circuit device comprising: a semiconductor integrated circuit bar; support means having an upper surface and a lower surface, said semiconductor integrated circuit bar being affixed to said upper surface and said lower surface being textured; and packaging means encapsulating said integrated circuit bar and said support means, mechanically locked to said textured surface to distribute thermal shear stress over the support means.
Claim 7
Dependent Claim
64 words
An integrated circuit device comprising: a semiconductor integrated circuit bar; support means having an upper surface and a lower surface, said semiconductor integrated circuit bar being affixed to said upper surface and said lower surface being textured; and packaging means encapsulating said integrated circuit bar and said support means, mechanically locked to said textured surface to distribute thermal shear stress over the support means.
Claim 8
Dependent Claim
13 words
The integrated circuit device of claim 5 wherein said packaging means comprises plastic.
Claim 9
Dependent Claim
25 words
The integrated circuit device of claim 6 wherein said textured second surface of said bar pad includes a plurality of spaced apart grooves formed therein.
Claim 10
Dependent Claim
18 words
The integrated circuit device of claim 6 wherein said textured second surface of said bar pad is pebbled.
Claim 11
Dependent Claim
25 words
The integrated circuit device of claim 6 wherein said textured second surface of said bar pad includes a plurality of spaced apart cavities formed therein.
References Cited (Backward Citations)
No citation records indexed.
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