Patent EP0146241A2 successfully refreshed from Google Patents.
EP0146241A2
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EP
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Circuit board
Assignee: Toshiba Corp
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Filing: 1984-10-26
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Granted: —
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Expires: 2004-10-26
Abstract
Abstract A circuit board is prepared such that at least two resin substrates (30,31,32) are laminated and bonded bythermocom- pression, a circuit pattern (301, 303, 311-315, 321-325) made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates (30, 31, 32), a region of the substrate which corresponds to a specific portion of the circuit pattern (301, 303, 311-315, 321-325) is recessed, the specific portion of the circuit projects into the recess (302, 322) in accordance with plastic deformation of the substrates (30, 31, 32) and the circuit pattern (301, 303, 311-315, 321-325) which is caused by thermocompression bonding, and the specific portion of the circuit pattern (301, 303, 311-315, 321-325) constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.
Inventors
- 👤 Hirosi C/O Patent Division Oodaira
- 👤 Yoshikatsu C/O Patent Division Fukumoto
- 👤 Shuji C/O Patent Division Hiranuma
- 👤 Masayuki C/O Patent Division Ohuchi
- 👤 Tamio C/O Patent Division Saito
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 22:39
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/185; H05K1/186; H05K3/00; H05K3/22; H05K3/28; H05K3/281; H05K3/40; H05K3/4038; H05K3/4084; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4626; H05K3/4632; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/09; H05K2201/09009; H05K2201/091; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1572; H05K2203/30; H05K2203/302; H05K3/0011; H05K3/0014; H05K3/4007; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1089; Y10T156/109; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49155; Y10T29/49165; Y10T29/49167; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24339; Y10T428/24347
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
96 words
A circuit board wherein at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion.
Claim 2
Dependent Claim
96 words
A circuit board wherein at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion.
Claim 3
Dependent Claim
30 words
A circuit board according to claim 1, characterized in that a circuit element is buried between the substrates in accordance with plastic deformation and is connected to the circuit pattern.
Claim 4
Dependent Claim
84 words
A circuit board according to claim 1, charac- .terized in that the substrates comprise at least three substrates including an intermediate substrate, and upper and lower substrates which sandwich the intermediate substrate; regions of the intermediate substrate which oppose specific portions of circuit patterns formed on opposing surfaces of the upper and lower substrates are recessed, and the specific portions of the upper and lower substrates are made to project into the recesses by plastic deformation and are brought into contact with each other.
Claim 5
Dependent Claim
26 words
A circuit board according to claim 1, characterized in that a resin constituting the substrates and a resin constituting the resin composition comprise thermoplastic resins, respectively.
Claim 6
Dependent Claim
43 words
A circuit board according to claim 1, characterized in that a resin constituting the substrates and a resin constituting the resin composition comprise thermosetting resins, respectively, the thermosetting resins being subjected to a crosslinking reaction and cured by heat, a catalyst or radiation.
References Cited (Backward Citations)
No citation records indexed.
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