Patent US3079880A successfully refreshed from Google Patents.
Patent EP0145926A2 successfully refreshed from Google Patents.
← Back to Patent Explorer
EP0145926A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Polysilicon resistors compensated with double ion-implantation

Assignee: International Business Machines Corp
•
Filing: 1984-11-06
•
Granted: —
•
Expires: 2004-11-06
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract @ A compensated polysilicon resistor wherein both N-type and P-type dopants are ion implanted into the polysilicon, whereby the net doping concentration is the difference between the concentration of the P-type and N-type dopants. The N-type dopants provide for compensation at the grain boundaries. As a result of this background doping or compensation the sensitivity of the sheet resistance of the polysilicon upon net doping concentration is greatly reduced.

Inventors

  • 👤 Min Sung Choi
  • 👤 Desmond A. Fitzpatrick

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 17:08
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/40; H10D1/47; H10P; H10P32/00; H10P32/30; H10P32/302

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 107 words
A compensated polysilicon resistor, comprising an insulating base (42) and a layer (44) of polysilicon overlaying said insulating layer, said polysilicon layer having a predetermined width, and a predetermined length between two contact areas, said polysilicon layer comprising: a P-type dopant of a predetermined acceptor concentration included in said polysilicon layer substantially uniform over said length; and an N-type dopant of a predetermined donor concentration included in said polysilicon layer substantially uniform over said length, with the net dopant concentration being the difference between said first and second concentrations, whereby the sensitivity of the sheet resistance of the polysilicon upon the net doping concentration is greatly reduced.
Claim 2
Dependent Claim 107 words
A compensated polysilicon resistor, comprising an insulating base (42) and a layer (44) of polysilicon overlaying said insulating layer, said polysilicon layer having a predetermined width, and a predetermined length between two contact areas, said polysilicon layer comprising: a P-type dopant of a predetermined acceptor concentration included in said polysilicon layer substantially uniform over said length; and an N-type dopant of a predetermined donor concentration included in said polysilicon layer substantially uniform over said length, with the net dopant concentration being the difference between said first and second concentrations, whereby the sensitivity of the sheet resistance of the polysilicon upon the net doping concentration is greatly reduced.
Claim 3
Dependent Claim 21 words
The polysilicon resistor as recited in claim 1, further comprising a layer (46) of silicon oxide overlaying said polysilicon layer (44).
Claim 4
Dependent Claim 51 words
The polysilicon resistor as recited in claims 1 or 2, further comprising a contact dopant of the type of the P-type or N-type dopant having the higher concentration, said contact dopant being included in a portion (50, 52) of said polysilicon layer (44) near the surface of said two contact areas.
Claim 5
Dependent Claim 23 words
The polysilicon resistor as recited in one of the preceding claims, wherein said P-type dopant is boron and said N-type dopant is phosphorous.
Claim 6
Dependent Claim 22 words
The polysilicon resistor as recited in claim 4, wherein said acceptor concentration of boron is greater than said donor concentration of phosphorous.
Claim 7
Dependent Claim 106 words
The polysilicon resistor as recited in at least one of the preceding claims being characterized by a method for manufacture comprising: forming a polysilicon layer (44) onto a desired substrate (e.g. 40, 42); forming a layer of silicon dioxide (46) upon the exposed major surface of said polysilicon layer; ion implanting P ions (e.g. boron) and N ions (e.g. phosphorous) through said layer of silicon dioxide (46) and into said polysilicon layer; annealing the structure to form said P type polysilicon resistor which is compensated with N ions and the grain boundaries of said polysilicon resistor; and making electrical contacts (58, 60) to said polysilicon resistor.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag