EP0132677A1
Expired / Lapsed
EP
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Process for activating substrate surfaces for the direct partial metallization of support materials
Assignee: Bayer AG
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Filing: 1984-07-09
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Granted: —
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Expires: 2004-07-09
Abstract
Abstract Metallised substrate surfaces, especially circuit boards for printed circuits, are advantageously obtained by applying metal- organic compounds, homogeneously distributed in organic solvents, of elements of subgroups 1 and 8 of the periodic table by the ink-mist or ink-jet process to the support boards and immediately introducing the thus pretreated substrates after sensitisation into a currentless metallisation bath.
Inventors
- 👤 Ulrich Dr. Von Gizycki
- 👤 Gerhard Dieter Dr. Wolf
- 👤 Kirkor Dr. Sirinyan
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 12:06
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/18; C23C18/20; C23C18/28; C23C18/30; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; C23C18/31; C23C18/32; C23C18/34; C23C18/38; C23C18/40; C23C18/405; C23C18/42
Claims Analysis
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