Plating appliance for thin plates, foils or similar sheet-like material.

Abstract

Abstract In the known appliances for electroplating, especially of the lands in printed circuits, those parts of the surface of the circuit board which are not to be plated are first covered and the board is then suspended in the plating bath. By means of the novel appliance, the effort and the material required for covering can be saved, and more uniform plating can be achieved. To this end, the appliance has a retaining device whose retaining plates (7, 8) are used at the same time for covering those parts of the surface which are not to be plated, and the plating solution is sprayed from nozzles (12, 13) on to the boards to be plated, which permits more uniform deposition of the plating material and more effective mixing and thus more uniform concentration of the plating solution. <IMAGE>

Inventors

• 👤 Kazuhiro Higuchi
• 👤 Junichi Tezuka

Bibliographic Details