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EP0132015A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

An ion beam machining device

Assignee: The University of Tokyo
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Filing: 1984-02-27
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Granted: —
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Expires: 2004-02-27
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Abstract

Abstract An ion beam machining device has a plasma-generating chamber (21), a machining chamber (23), and an ion-extracting grid (22) disposed between the two chambers (21, 23). The grid (22) has an insulator layer (24) facing the plasma-generating chamber (21) and a conductor layer (25) facing the machining chamber (23). A plurality of holes (26) extend through the insulator and conductor layers (24, 25). The conductor layer (25) is held at an electric potential negative with respect to the plasma.

Inventors

  • 👤 Takahisa Masuzawa
  • 👤 Ichiro Tsuchiya

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-30 19:45
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/30; H01J37/305; H01J37/3053; H01J37/3056; H01J37/02; H01J37/04; H01J37/08

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 106 words
An ion beam machining device, comprising a plasma-generating chamber (21) for producing plasma ions, an ion-extracting grid (22) for extracting the produced ions as ion beams, and a machining chamber (23) for irradiating the extracted ion beams onto a workpiece (14), characterised in that the ion-extracting grid (22) has an insulator layer (24) facing the plasma-generating chamber (21). a conductor layer (25) facing the machining chamber (23), and a plurality of holes (26) extending through both the insulator layer (24) and the conductor layer (25). and means for connecting the conductor layer (25) to an electric potential which is negative relative to potential of said plasma.
Claim 2
Dependent Claim 106 words
An ion beam machining device, comprising a plasma-generating chamber (21) for producing plasma ions, an ion-extracting grid (22) for extracting the produced ions as ion beams, and a machining chamber (23) for irradiating the extracted ion beams onto a workpiece (14), characterised in that the ion-extracting grid (22) has an insulator layer (24) facing the plasma-generating chamber (21). a conductor layer (25) facing the machining chamber (23), and a plurality of holes (26) extending through both the insulator layer (24) and the conductor layer (25). and means for connecting the conductor layer (25) to an electric potential which is negative relative to potential of said plasma.
Claim 3
Dependent Claim 27 words
An ion beam machining device according to claim 1. characterized in that the insulator layer (24) of said grid (22) is thicker than its conductor layer (25).
Claim 4
Dependent Claim 37 words
An ion beam machining device according to claim 1, characterized in that said insulator layer (24) of said grid (22) has a thickness which is more than 20% of the diameter of each of the holes (26).
Claim 5
Dependent Claim 33 words
An ion beam machining device according to claim 1, characterized in that said insulator layer (24) is an alumina layer and said conductor layer (25) is a nickel film.plated on said alumina layer.
Claim 6
Dependent Claim 37 words
An ion beam machining device according to claim 1, characterized in that said conductor layer (25) is a stainless steel plate and said insulator layer (24) is a silica film vacuum deposited on said conductor layer (25).

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