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EP0127682A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of mounting electronic part
Assignee: Panasonic Holdings Corp
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Filing: 1982-07-13
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Granted: —
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Expires: 2002-07-13
Abstract
Abstract Method of mounting an electronic part, which comprises the steps of coating a two-liquid adhesive (12) composed of a main agent and a separate curing accelerator using a dispenser containing a mixture (2) of the main agent and the curing accelerator on the area of a printed circuit board (10) where the partisto be placed, placing the electronic part (3) on the area coated with the adhesive (12), thereafter heating or shining ultra-violet light thereon to cure the adhesive (12), thereby temporarily securing the part (13), and then soldering the part on. This enables the mounting of large-sized electronic parts.
Inventors
- 👤 Ryuzoh Hohchin
- 👤 Shinichi Kudoh
- 👤 Yukio Maeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 12:12
CPC Classifications
B; B01; B01F; B01F25/00; B01F25/40; B01F25/42; B01F25/43; B01F25/431; B01F25/43197; B01F25/431972; H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; B01F35/00; B01F35/50; B01F35/52; B01F35/522; B01F35/71; B01F35/717; B01F35/71745; C; C09; C09J; C09J5/00; C09J5/06; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/11; H05K2203/1163; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
92 words
A method of fitting an electronic parts comprising applying a two liquid component adhesive consisting of its main component and a setting promoter on the parts mounting portion on a printed wiring board from a dispenser having a mixing part for mixing the main component and the setting promoter of the adhesive which are separated beforehand, then, mounting the electronic parts on the portion coated with the adhesive and, thereafter, fixing the aforementioned electronic parts by setting the aforementioned adhesive by way of heating or irradiation of ultraviolet rays, followed by soldering.
Claim 2
Independent Claim
92 words
A method of fitting an electronic parts comprising applying a two liquid component adhesive consisting of its main component and a setting promoter on the parts mounting portion on a printed wiring board from a dispenser having a mixing part for mixing the main component and the setting promoter of the adhesive which are separated beforehand, then, mounting the electronic parts on the portion coated with the adhesive and, thereafter, fixing the aforementioned electronic parts by setting the aforementioned adhesive by way of heating or irradiation of ultraviolet rays, followed by soldering.
Claim 3
Dependent Claim
112 words
A method of fitting an electronic parts according to Claim 1, wherein the main component of the aforementioned two liquid component adhesive is composed of 100 weight parts of resin composite material consisting of acrylic oligomers and low viscosity acrylates or metacrylates, 0.1 ~ 10 weight parts of thermal polymerization initiator and 20 ~ 150 weight parts of inorganic filler and the setting promoter of the aforementioned two liquid component adhesive is composed of 100 weight parts of the acrylic resin composite material of exactly the same composition as that of the aforementioned main component, 0.1 ~ 20 weight parts of polymerization promoter and 20 ~ 170 weight parts of inorganic filler.
References Cited (Backward Citations)
No citation records indexed.
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