Patent EP0125098A1 successfully refreshed from Google Patents.
EP0125098A1
Expired / Lapsed
EP
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A method of forming electrically conductive pins
Assignee: Balfour Beatty PLC
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Filing: 1984-05-02
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Granted: —
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Expires: 2004-05-02
Abstract
Abstract A method of forming electrically conductive pins for printed circuit boards from strip or sheet metal or metal alloy comprises the following steps:- (a) shearing the strip orsheetto form a carrierstrip (1) and pin profiles (2), each pin profile having a defined portion (3) for becoming the compliant section of the pin, and each profile being attached to the carrier strip; (b) coining the defined portion of each pin to increase its surface area; and (c) folding the defined portion of each pin to form the required cross-sectional shape of the compliant section.
Inventors
- 👤 David Lee
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 21:09
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/58; H01R43/00; H01R43/16; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/308
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
A method of forming electrically conductive pins for printed circuit boards from strip or sheet metal or metal alloy comprises the following steps:- (a) shearing the strip or sheet to form a carrier strip (1) and pin profiles (2), each pin profile having a defined portion (3) for becoming the compliant section of the pin, and each profile being attached to the carrier strip; (b) coining the defined portion of each pin to increase its surface area; and (c) folding the defined portion of each pin to form the required cross-sectional shape of the compliant section.
Claim 2
Independent Claim
96 words
A method of forming electrically conductive pins for printed circuit boards from strip or sheet metal or metal alloy comprises the following steps:- (a) shearing the strip or sheet to form a carrier strip (1) and pin profiles (2), each pin profile having a defined portion (3) for becoming the compliant section of the pin, and each profile being attached to the carrier strip; (b) coining the defined portion of each pin to increase its surface area; and (c) folding the defined portion of each pin to form the required cross-sectional shape of the compliant section.
Claim 3
Dependent Claim
26 words
A method of forming electrically conductive pins as claimed in Claim 1, wherein the defined portion of each pin is folded into a substantially C-shaped cross-section.
Claim 4
Dependent Claim
30 words
A method of forming electrically conductive pins as claimed in Claim 2, wherein a slot (5) is cut in the defined portion and extends.in the longitudinal direction of the pin.
Claim 5
Dependent Claim
23 words
A method of forming electrically conductive pins as claimed in Claim 1, wherein the defined portion is folded into a substantially S-shaped cross-section.
Claim 6
Independent Claim
33 words
A method of forming electrically conductive pins as claimed in any one of Claims 1 to 4, wherein each pin is formed with the compliant section positioned between two longitudinally extending posts (4).
Claim 7
Independent Claim
31 words
A method of forming electrically conductive pins as claimed in any one of Claims 1 to 5, wherein at least one post is folded round to have a substantially circular cross-section.
Claim 8
Independent Claim
35 words
A method of forming electrically conductive pins as claimed in any one of Claims 1 to 4, wherein each pin is formed with the compliant section positioned between a post and an electric contact (7).
Claim 9
Dependent Claim
27 words
A method of forming electrically conductive pins as claimed in Claim 7, wherein the electric contact is formed whilst each pin is attached to the carrier strip.
Claim 10
Independent Claim
31 words
A method of forming electrically conductive pins as claimed in any one of Claims 1 to 8, wherein each pin is formed with an enlarged section (6) adjacent the defined portion.
Claim 11
Dependent Claim
21 words
Electrically conductive pins for printed circuit boards made by a method as claimed in any one of Claims 1 to 9.
References Cited (Backward Citations)
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Cited
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