Patent EP0121402A2 successfully refreshed from Google Patents.
EP0121402A2
Expired / Lapsed
EP
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A semiconductor component and method of manufacture
Assignee: BAE Systems Electronics Ltd
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Filing: 1984-03-28
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Granted: —
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Expires: 2004-03-28
Abstract
Abstract An electronic component comprises a mounting substrate (13) having a surface provided with a plurality of spaced contact pads (15) and a semiconductor chip (10); having at least one active element (11) and a surface provided with metallised contact regions (14). The metallised contact regions (14) are superimposed on and electrically conductively bonded to a different one of the mounting substrate contact pads (15). The method comprises the forming on a surface of a semiconductor chip at least one active device having a raised metallised contact region and at least one additional raised contact region spaced from the active device contact region. A metallised contact pad for each of the raised contact regions is provided on a mounting substrate their spacing corresponding to the spacing of the raised contact regions. The contact pad for each active device is arranged to form part of a conductor connection. The chip is positioned on the mounting substrate with the associated raised contact regions and contact pads in mutual contact and they are electrically conductively bonded together.
Inventors
- 👤 Ricardo Simon Sussmann
- 👤 Robert Charles Goodfellow
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 19:45
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/855; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4219; G02B6/4228; G02B6/423; G02B6/4249; H10D; H10D62/00; H10D62/10; H10D62/117; H10F; H10F77/00; H10F77/50; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/484; G02B6/4236; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
53 words
An electronic component, comprising a mounting substrate having a surface provided with a plurality of spaced contact pads and a semiconductor chip having at least one active element and a surface provided with projecting metallised contact regions which are superimposed on and electrically conductively bonded to a different one of the contact pads.
Claim 2
Dependent Claim
53 words
An electronic component, comprising a mounting substrate having a surface provided with a plurality of spaced contact pads and a semiconductor chip having at least one active element and a surface provided with projecting metallised contact regions which are superimposed on and electrically conductively bonded to a different one of the contact pads.
Claim 3
Dependent Claim
23 words
A component as claimed in claim 1, wherein the contact pads and associated contact regions are electrically conductively bonded by thermal compression bonding.
Claim 4
Dependent Claim
24 words
A component as claimed in claim 1 or 2, wherein the contact pads and associated raised contacts are electrically conductively bonded by a solder.
Claim 5
Dependent Claim
41 words
A component as claimed in any one of the preceding claims, comprising a group of said projecting metallised contact regions and associated electrically bonded contact pads distributed around the or each active element to support the chip on the mounting substrate.
Claim 6
Dependent Claim
43 words
A component as claimed in any one of claims 1 to 3, comprising for each active element a metallised contact region and associated electrically bonded contact pad which extends at least partially around the element to support the chip on the mounting substrate.
Claim 7
Dependent Claim
27 words
A component as claimed in any one of the preceding claims, wherein the contact pad(s) associated with an active device form part of an extended conductor connection.
Claim 8
Dependent Claim
20 words
A component as claimed in claim 6, wherein the extended conductor connection(s) extend to an enlarged connection pad or pads.
Claim 9
Dependent Claim
32 words
A component as claimed in any one of the preceding claims, wherein the mounting substrate is an integrated circuit and said active element(s) are connected into the circuit via the electrical bonding.
Claim 10
Dependent Claim
24 words
A component as claimed in any one of the preceding claims, wherein the projecting metallised contact regions are provided on mesas on the chip.
Claim 11
Dependent Claim
24 words
A component as claimed in any one of the preceding claims, wherein the semiconductor chip has a metallised contact region on its outer face.
Claim 12
Dependent Claim
30 words
A component as claimed in any one of the preceding claims comprising an active device in the form of a photodiode formed on a substrate of light transmissive semiconductor material.
Claim 13
Dependent Claim
42 words
A component as claimed in claim 11, wherein the diode is a PIN diode and the mounting substrate is an integrated circuit to which the diode is connected via said electrical bonding to provide an optical receiver equivalent to a PIN-FET receiver.
Claim 14
Dependent Claim
33 words
A component as claimed in any one of claims 1 to 10, comprising an active device in the form of a light emitting diode formed on a chip of light transmissive semiconductor material.
Claim 15
Dependent Claim
39 words
A component as claimed in any one of claims 11,12 or 13, wherein the substrate of the chip is provided with a cavity in its outer face opposite the diode junction for receipt of a microlens or optical fibre.
Claim 16
Dependent Claim
24 words
A component as claimed in claim 14, having a contact pad provided on the outer face of the chip which pad surrounds the cavity.
Claim 17
Dependent Claim
12 words
An electronic component substantially as described herein with reference to the drawings.
Claim 18
Dependent Claim
12 words
An electronic component substantially as described herein with reference to the drawings.
Claim 19
Independent Claim
123 words
A method of manufacturing a semiconductor device, comprising forming on a surface of a semiconductor chip substrate at least one active device having a raised metallised contact region and at least one additional raised metallised contact region spaced from said active device contact region, forming on a surface of an insulating or semi insulating mounting substrate a metallised contact pad for each of said raised contact regions of spacing corresponding to the spacing of said raised contact regions, the contact pad for each said active device forming part of a conductor connection, positioning the chip on the mounting substrate with the associated raised contact regions and contact pads in mutual contact and electrically conductively bonding the raised contact regions to the contact pads.
Claim 20
Independent Claim
123 words
A method of manufacturing a semiconductor device, comprising forming on a surface of a semiconductor chip substrate at least one active device having a raised metallised contact region and at least one additional raised metallised contact region spaced from said active device contact region, forming on a surface of an insulating or semi insulating mounting substrate a metallised contact pad for each of said raised contact regions of spacing corresponding to the spacing of said raised contact regions, the contact pad for each said active device forming part of a conductor connection, positioning the chip on the mounting substrate with the associated raised contact regions and contact pads in mutual contact and electrically conductively bonding the raised contact regions to the contact pads.
Claim 21
Dependent Claim
17 words
A.method as claimed in claim 17, wherein the electrically conductive bonding is effected by thermal compression bonding.
Claim 22
Dependent Claim
18 words
. 19. A method as claimed in claim 17, wherein the electrically conductive bonding is effected by soldering.
Claim 23
Dependent Claim
54 words
.20. A method as claimed in any one of claims 17 to 19, wherein, for each active device, an additional raised metallised contact region and associated pad are provided shaped to extend at least partially around the element to reduce the load on the active device during bonding and provide mechanical stability and support.
Claim 24
Independent Claim
52 words
A method as claimed in any one of claims 17 to 19, wherein for each active device a group of said additional raised metallised contact regions and associated pads are provided distributed around the active element to reduce the load on the active device during bonding and provide mechanical stability and support.
Claim 25
Independent Claim
26 words
A method as claimed in any one of claims 17 to 21, wherein the raised metallised contact regions are formed on individual mesas on the chip.
Claim 26
Independent Claim
47 words
A method as claimed in any one of claims 17 to 22, wherein at least one of said additional raised metallised contact regions is provided on a diode structure formed in the chip and connection to the substrate is completed by burning out the diode (punch through).
Claim 27
Independent Claim
11 words
A method of manufacturing a semiconductor device substantially as described herein.
Claim 28
Independent Claim
11 words
A method of manufacturing a semiconductor device substantially as described herein.
References Cited (Backward Citations)
No citation records indexed.
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