Abstract The invention is directed to a reuseable change pad (70) for an MLC interconnection change system. The change pad of this invention includes a body element (72) formed on the MLC substrate to which one or more change couplers (74,76) are attached for coupling the body element to one or more circuits (82, 84; 92, 94) of the chip interconnect change systems. The body element is configured to bondably receive one or more discrete jump leads from either an interconnection contact pad provided on the MLC or another change pad. Additionally, one or more pad couplers are configured to be integrally formed with the body element for electrically connecting the body element to one or more circuits of the chip interconnect change system. As configured, the couplers are severable from the pad body to isolate the pad body from one or all of the chip interconnection circuits. Once isolated, the pad may be joined to a second change pad with a discrete jump wire so as to connect the first change pad to the second and the second pad's associated coupler and buried change metallization. ln this way, multiple changes to an initial change may be made by adding additional jump wire without the need to eliminate any jump wire previously inserted.
An interconnection change pad for use on a ceramic substrate receiving integrated circuit chips and having a multilayer chip interconnection system and a multilayer chip interconnection change system, the pad being characterized by comprising: a) a body element (72; Fig. 5) formed on the substrate to which one or more leads may be joined for electrically connecting the body element with one or more circuits of the chip interconnection system, and b) one or more couplers (74, 76) each integrally formed with the body element for electrically connecting the body element to one or more circuits (82, 84; 92, 94) of the chip interconnection change system, the couplers being severable from the body element to isolate the body element from one or all of the chip interconnection change circuits.
Claim 2
Dependent Claim
129 words
An interconnection change pad for use on a ceramic substrate receiving integrated circuit chips and having a multilayer chip interconnection system and a multilayer chip interconnection change system, the pad being characterized by comprising: a) a body element (72; Fig. 5) formed on the substrate to which one or more leads may be joined for electrically connecting the body element with one or more circuits of the chip interconnection system, and b) one or more couplers (74, 76) each integrally formed with the body element for electrically connecting the body element to one or more circuits (82, 84; 92, 94) of the chip interconnection change system, the couplers being severable from the body element to isolate the body element from one or all of the chip interconnection change circuits.
Claim 3
Dependent Claim
65 words
An interconnection change pad according to claim 1 characterized in that the pad couplers are in the form of tabs each having a first end (78, 88) integrally formed with the pad body element, a second end (80, 90) connected to a vertical metallization (82, 92) of the chip interconnection change system and a bridge section (86, 96) joining the first and second coupler ends.
Claim 4
Dependent Claim
62 words
An interconnection change pad according to claim 2 characterized in that the pad body is substantially rectangular in form having a coupler extending from each of at least two opposite sides of the body, the couplers also having a substantially rectangular form, the major axis of the coupler extending perpendicularly to the body side (98, 100) with which the coupler is formed.
Claim 5
Dependent Claim
21 words
An interconnection change pad according to claim 2 characterized in that the pad coupler bridge section (86, 96) is laser severable.
Claim 6
Dependent Claim
24 words
An interconnection change pad according to claim 1 characterized in that the pad body and couplers are formed of a single layer of metallization.
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