Patent EP0114211A2 successfully refreshed from Google Patents.
EP0114211A2
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EP
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Multi-layer flexible film module
Assignee: International Business Machines Corp
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Filing: 1983-11-03
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Granted: —
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Expires: 2003-11-03
Abstract
Abstract @ A high density electronic circuit module includes a chip (55) carrying, thin, flexible film (30) having circuitry (20, 40) on both sides thereof. The double-sided circuitry is fabricated by depositing a first layer (20) of chrome-copper-chrome circuitry on an aluminum substrate (10). This first circuitry layer is covered with a layer of polyimide (30). Vias (30A, 30B) are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry (40) is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate. Hydrochloric acid etches aluminum but not the chrome-copper-chrome circuitry.
Inventors
- 👤 Charles Edward Gazdik
- 👤 Donald Gene Mcbride
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 18:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/46; H05K3/4644; H05K3/467; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/69; H10W70/695; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/03; H05K2203/0376; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0011; H05K3/0017; H05K3/002; H05K3/38; H05K3/388; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
86 words
A method of making a double-sided thin, flexible circuitry, characterized by the following steps: depositing a first layer (20) of circuitry on a substrate (10), covering said first layer of circuitry with a thin layer of insulating material (30), etching vias (30A, 30B) into said layer of insulating material, curing said insulating material, depositing a second layer (40) of circuitry on top of said insulating material, and etching away said substrate (10) with an etchant that attacks said substrate but not said first layer of circuitry.
Claim 2
Independent Claim
86 words
A method of making a double-sided thin, flexible circuitry, characterized by the following steps: depositing a first layer (20) of circuitry on a substrate (10), covering said first layer of circuitry with a thin layer of insulating material (30), etching vias (30A, 30B) into said layer of insulating material, curing said insulating material, depositing a second layer (40) of circuitry on top of said insulating material, and etching away said substrate (10) with an etchant that attacks said substrate but not said first layer of circuitry.
Claim 3
Dependent Claim
13 words
The method according to claim 1, wherein said insulating material (30) is polyimide.
Claim 4
Dependent Claim
19 words
The method according to claim 1, wherein said first and second layers (20, 40) of circuitry are chrome-copper-chrome layers.
Claim 5
Dependent Claim
26 words
The method according to claim 1 or 3, wherein said first and second layers (20, 40) of circuitry are electrically connected through said vias (30A, 30B).
Claim 6
Dependent Claim
18 words
The method according to claim 1, wherein said substrate (10) is aluminum and said etchant is hydrochloric acid.
Claim 7
Dependent Claim
35 words
The method according to claim 1 or 5, wherein said etching step is executed by covering all except at least one selected area (10A) of said substrate (10) with a material impervious to said etchant.
Claim 8
Dependent Claim
71 words
An electronic package including a substrate (10) with an opening (10A) therein, a two-sided, thin, flexible film circuitry (20, 30, 40) covering said opening, said film circuitry including a base layer (30) of insulating material having circuits (20, 40) on either side, which circuits are interconnected by vias (30A, 30B) etched through said insulating material, and at least one integrated circuit chip (55) mounted on said film circuitry above said opening.
Claim 9
Dependent Claim
71 words
An electronic package including a substrate (10) with an opening (10A) therein, a two-sided, thin, flexible film circuitry (20, 30, 40) covering said opening, said film circuitry including a base layer (30) of insulating material having circuits (20, 40) on either side, which circuits are interconnected by vias (30A, 30B) etched through said insulating material, and at least one integrated circuit chip (55) mounted on said film circuitry above said opening.
Claim 10
Dependent Claim
21 words
The electronic package of claim 7, wherein said substrate (10) is aluminum and said opening (10A) is etched using hydrochloric acid.
Claim 11
Dependent Claim
14 words
The electronic package of claim 7 or 8, wherein said insulating material is polyimide.
Claim 12
Dependent Claim
18 words
The electronic package of any of claims 7 through 9, wherein said circuits (20, 40) are chrome-copper-chrome circuits.
References Cited (Backward Citations)
No citation records indexed.
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