Patent EP0109015A1 successfully refreshed from Google Patents.
EP0109015A1
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EP
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Electroless copper plating
Assignee: Shipley Co Inc
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Filing: 1983-11-04
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Granted: —
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Expires: 2003-11-04
Abstract
Abstract A non-fuming copper plating solution where formaldehyde fuming is eliminated by adjustment of the copper and formaldehyde to hydroxide. The preferred ratio of each to hydroxide is preferably at least 1 to 10.
Inventors
- 👤 Magda Abu-Moustafa
- 👤 Silvester Paul Valayil
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:39
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
77 words
In an aqueous electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, sufficient complexing agent to render said cupric ions soluble in alkaline solution, and the addition product of formaldehyde and a formaldehyde addition agent, the improvement comprising a solution pH of at least 11 and a molar ratio of each of copper and free formaldehyde to hydroxide whereby the concentration of free formaldehyde in solution during plating detectable by analysis is essentially 0.
Claim 2
Dependent Claim
77 words
In an aqueous electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, sufficient complexing agent to render said cupric ions soluble in alkaline solution, and the addition product of formaldehyde and a formaldehyde addition agent, the improvement comprising a solution pH of at least 11 and a molar ratio of each of copper and free formaldehyde to hydroxide whereby the concentration of free formaldehyde in solution during plating detectable by analysis is essentially 0.
Claim 3
Dependent Claim
19 words
The solution of claim 1 where the molar ratio of copper to hydroxide is at least I to 10.
Claim 4
Dependent Claim
16 words
The solution of claim 2 where the pH of the solution varies between 11 and 14.
Claim 5
Dependent Claim
16 words
The solution of claim 2 where the pH of the solution varies between 11.5 and 12.5.
Claim 6
Dependent Claim
22 words
The solution of claim 2 where the molar ratio of copper to hydroxide varies between 1 to 12 and 1 to 40.
Claim 7
Dependent Claim
17 words
The solution of claim 5 where the ratio varies between 1 to 12 and 1 to 25.
Claim 8
Dependent Claim
35 words
The solution of claim 5 where the ratio of free formaldehyde to hydroxide, after at least 4 hours of use of the solution to deposit copper over a substrate, is at least 1 to 10.
Claim 9
Dependent Claim
14 words
The solution of claim 7 where the ratio is at least I to 12.
Claim 10
Dependent Claim
25 words
The solution of claim 2 where the addition product of formaldehyde and the addition agent are reacted together before addition to the copper plating solution.
Claim 11
Dependent Claim
32 words
The solution of claim 2 where the addition agent is selected from the group of salts of sulphites, bisulphites, nitrites and phosphites, said salt having a cation non-interfering with the plating solution.
Claim 12
Dependent Claim
13 words
The solution of claim 10 where the formaldehyde addition agent is a bisulfite.
Claim 13
Dependent Claim
35 words
A process for initiating plating from a freshly prepared solution having the formulation of claim 2, said process comprising addition of a free formaldehyde to the solution in an amount just sufficient to initiate deposition.
References Cited (Backward Citations)
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