Patent EP0106475A1 successfully refreshed from Google Patents.
EP0106475A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus and method for semiconductor device packaging
Assignee: Texas Instruments Inc
•
Filing: 1983-09-01
•
Granted: —
•
Expires: 2003-09-01
Abstract
Abstract An apparatus and method for packing a semiconductor device having a strip (20) with a plurality of lead frames (40-49) with a semiconductor device (120) attached to the bar pad (56) of at least some of the lead frames. The strip (20) includes at least one solid thoroughfare (300) on its surface extending to at least two of the lead frames. Plastic in liquid form is supplied through a runner (265, 290) to a mold (190) containing the semiconductor devices (120) and the strip (20). The mold (190) forms a cavity (280) about the semiconductor device (120) and the portion of its associated lead frame adjacent to the semiconductor device (120). In particular the two semiconductor devices (120) attached to the lead frames adjacent the thoroughfare (300) are enclosed in two cavities (280). The plastic is directed over the thoroughfare (300) into the two cavities (280) adjacent to the thoroughfare (300).
Inventors
- 👤 John W. Orcutt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 22:27
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H10W72/00; H10W72/01; H10W72/0198; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
252 words
An apparatus for packaging semiconductor devices within encapsulating plastic enclosures comprising: (a) a substantially flat metal strip having two longitudinal sides, a plurality of lead frames therein, and at least one solid thoroughfare on a flat surface extending from one longitudinal side to at least a first and second lead frames, each lead frame provided with.a bar pad having a semiconductor device attached thereto and a plurality of leads, each lead extending from one end adjacent said bar pad to another opposite end away from said bar pad; (b) a cull of encapsulating plastic selectively under pressure; and (c) a mold having a first and second parts movable between a closed and open positions, said first part adapted to receive at least a portion of said strip therein when in said open position in a predetermined alignment, said strip maintained in said predetermined alignment when said mold is in said closed position, said first and second parts including a plurality of depressions forming two cavities with one cavity about a portion of each lead of said first lead frame adjacent said one end and a first semiconductor device attached thereto and with another cavity about a portion of each lead of said second lead frame adjacent said one end and a second semiconductor device attached thereto, and a runner connecting said cull over said one longitudinal side along said thoroughfare with said one and another cavities when said mold is in said closed position and said strip is in said predetermined alignment.
Claim 2
Independent Claim
252 words
An apparatus for packaging semiconductor devices within encapsulating plastic enclosures comprising: (a) a substantially flat metal strip having two longitudinal sides, a plurality of lead frames therein, and at least one solid thoroughfare on a flat surface extending from one longitudinal side to at least a first and second lead frames, each lead frame provided with.a bar pad having a semiconductor device attached thereto and a plurality of leads, each lead extending from one end adjacent said bar pad to another opposite end away from said bar pad; (b) a cull of encapsulating plastic selectively under pressure; and (c) a mold having a first and second parts movable between a closed and open positions, said first part adapted to receive at least a portion of said strip therein when in said open position in a predetermined alignment, said strip maintained in said predetermined alignment when said mold is in said closed position, said first and second parts including a plurality of depressions forming two cavities with one cavity about a portion of each lead of said first lead frame adjacent said one end and a first semiconductor device attached thereto and with another cavity about a portion of each lead of said second lead frame adjacent said one end and a second semiconductor device attached thereto, and a runner connecting said cull over said one longitudinal side along said thoroughfare with said one and another cavities when said mold is in said closed position and said strip is in said predetermined alignment.
Claim 3
Dependent Claim
155 words
.An apparatus for encapsulating semiconductor devices within plastic comprising: (a) a substantially flat metal strip having two longitudinal sides and a plurality of lead frames arranged therein with a thoroughfare extending over a solid surface of said strip to a fir.st and second lead frames, said first lead frame having a first semiconductor device attached thereto and said second lead frame having a second semiconductor device attached thereto; (b) a first means for selectively supplying plastic in fluid form under pressure; (c) a second means having said strip aligned therein with said first semiconductor device and a portion of said first lead frame adjacent thereto in a first cavity and with said second semiconductor device and a portion of said second lead frame adjacent thereto in a second cavity; and (d) a third means connected to said first means and said second means for directing plastic over said thoroughfare into said first and second cavities.
Claim 4
Dependent Claim
155 words
.An apparatus for encapsulating semiconductor devices within plastic comprising: (a) a substantially flat metal strip having two longitudinal sides and a plurality of lead frames arranged therein with a thoroughfare extending over a solid surface of said strip to a fir.st and second lead frames, said first lead frame having a first semiconductor device attached thereto and said second lead frame having a second semiconductor device attached thereto; (b) a first means for selectively supplying plastic in fluid form under pressure; (c) a second means having said strip aligned therein with said first semiconductor device and a portion of said first lead frame adjacent thereto in a first cavity and with said second semiconductor device and a portion of said second lead frame adjacent thereto in a second cavity; and (d) a third means connected to said first means and said second means for directing plastic over said thoroughfare into said first and second cavities.
Claim 5
Independent Claim
84 words
A method of encapsulating a first and second semiconductor devices within plastic comprising the steps of: (a) aligning said strip within a closed mold with said first semiconductor device and a portion of said first lead frame adjacent thereto in a first cavity and with said second semiconductor device and a portion of said second lead frame adjacent thereto in a second cavity; and (b) directing plastic under pressure over a solid thoroughfare of said strip into said cavity and into said second cavity.
Claim 6
Independent Claim
84 words
A method of encapsulating a first and second semiconductor devices within plastic comprising the steps of: (a) aligning said strip within a closed mold with said first semiconductor device and a portion of said first lead frame adjacent thereto in a first cavity and with said second semiconductor device and a portion of said second lead frame adjacent thereto in a second cavity; and (b) directing plastic under pressure over a solid thoroughfare of said strip into said cavity and into said second cavity.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.