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EP0104111A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

A method for producing a semiconductor device

Assignee: Fujitsu Ltd
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Filing: 1983-09-13
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Granted: —
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Expires: 2003-09-13
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Abstract

Abstract A method for producing a semiconductor device comprising the steps of : forming, in a well (2) having a first conductivity type (p) and selectively provided in a semiconductor substrate (1) having a second conductivity type (N), two first impurity diffusion regions (6s, 6d) having the second conductivity type and in an exposed surface region of the substrate (1), two second impurity diffusion regions (8s, 8d) respectively; forming, in the well (2) and the exposed surface region of the substrate (1), a third impurity diffusion region by implanting impurity ion having a P-type or N-type into the semiconductor substrate (1) and forming an electric current channel (9) either between the two first impurity diffusion region or between the two second impurity diffusion region, thereby forming various integrated circuits by changing wiring channel.

Inventors

  • 👤 Takehide Shirato

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-30 20:44
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D84/0184; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 128 words
A method for producing a semiconductor device comprising the steps of: forming, in a well having a first conductivity type and selectively provided in a semiconductor substrate having a second conductivity type, two first impurity regions having the second conductivity type and, in an exposed surface region of the substrate, two second impurity regions having the first conductivity type; and forming, in the well and the exposed surface region of the substrate, a third impurity region by implanting impurity ions of either oen of said first or second conductivity type into the semiconductor substrate to form an electric current channel selectively between the two second impurity regions or between the two first impurity regions so that various integrated circuits can be made by changing the electric current channel.
Claim 2
Independent Claim 128 words
A method for producing a semiconductor device comprising the steps of: forming, in a well having a first conductivity type and selectively provided in a semiconductor substrate having a second conductivity type, two first impurity regions having the second conductivity type and, in an exposed surface region of the substrate, two second impurity regions having the first conductivity type; and forming, in the well and the exposed surface region of the substrate, a third impurity region by implanting impurity ions of either oen of said first or second conductivity type into the semiconductor substrate to form an electric current channel selectively between the two second impurity regions or between the two first impurity regions so that various integrated circuits can be made by changing the electric current channel.
Claim 3
Dependent Claim 18 words
A method according to claim 1, wherein arsenic or phosphorus is used to form said second impurity region.
Claim 4
Dependent Claim 17 words
A method according to claim 1, wherein boron or indium is used to form first impurity region.
Claim 5
Dependent Claim 16 words
A method according to claim 1, wherein arsenic or phosphorus is used as said third impurity.
Claim 6
Dependent Claim 22 words
A method according to claim 1, wherein an integrated circuit of N-channel open-drain output type is formed by said electric current channel.
Claim 7
Dependent Claim 22 words
A method according to claim 1, wherein an integrated circuit of P-channel open-drain output type is formed by said electric current channel.
Claim 8
Dependent Claim 20 words
A method according to claim 1, wherein integrated circuits of both N-channel open-drain type and P-channel open-drain types are formed.
Claim 9
Dependent Claim 16 words
..-8. A method according to claim 1, wherein said electric current channel forms a resistance layer.

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