Patent EP0097782A2 successfully refreshed from Google Patents.
EP0097782A2
Expired / Lapsed
EP
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Thermal conduction bridge element for semiconductor device packages
Assignee: International Business Machines Corp
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Filing: 1983-04-20
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Granted: —
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Expires: 2003-04-20
Abstract
Abstract A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device (12) to a cold plate of cover (16) positioned in close proximity. The bridge element (24) has an axially compressible spring (26) with a bulged central portion, a first flat plate adapted to be placed in contact with the device, a second flat plate adapted to be disposed in contact with the cold plate or cover, and means (32,34;44) to maintain the spring, the first plate, and the second plate in operative engagement.
Inventors
- 👤 Joseph Louis Horvath
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 15:21
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
118 words
Thermal conduction bridge element for semiconductor device packages employed to conduct heat from a semiconductor device (12) mounted on a substrate (10) to a cold plate (16) positioned in close proximity to the device, characterized in that it comprises an axially compressible large area spring (26) provided with a bulged central portion, a first flat plate (30) adapted to be disposed in contact with the back side of the device, a means (32,34) to join the first flat plate to the bulged portion of the spring, a second flat plate (40) adapted to be disposed in contact with the cold plate, and a means (44) to maintain the spring and the second flat plate in contacting operative engagement.
Claim 2
Dependent Claim
118 words
Thermal conduction bridge element for semiconductor device packages employed to conduct heat from a semiconductor device (12) mounted on a substrate (10) to a cold plate (16) positioned in close proximity to the device, characterized in that it comprises an axially compressible large area spring (26) provided with a bulged central portion, a first flat plate (30) adapted to be disposed in contact with the back side of the device, a means (32,34) to join the first flat plate to the bulged portion of the spring, a second flat plate (40) adapted to be disposed in contact with the cold plate, and a means (44) to maintain the spring and the second flat plate in contacting operative engagement.
Claim 3
Dependent Claim
41 words
A bridge element as claimed in claim 1, wherein a coating of solder is provided at least on the interface between the spring (26) and the first plate (30), and on the interface between the spring and the second plate (40).
Claim 4
Dependent Claim
50 words
A bridge element as claimed in claim 1, wherein the first plate (30) and the second plate (40) are formed of solder wettable metal, a coating layer of solder is provided on the first and second flat plates (30,40), and wherein the surface of the spring is unwettable to solder.
Claim 5
Dependent Claim
18 words
A bridge element as claimed in claim 3, wherein the first and second plates are formed of Cu.
Claim 6
Dependent Claim
30 words
A bridge element as claimed in claim 3, wherein the spring is formed of an alloy that includes Cu, and the surface is rendered non-solderwettable by a surface oxide layer.
Claim 7
Dependent Claim
36 words
A bridge element as claimed in claim 3, wherein the coating layer of solder has a thickness in the range of 0.025 to 0.125 mm with a melting point in the range of 100 - 200°C.
Claim 8
Dependent Claim
50 words
A bridge element as claimed in claim 1, wherein the spring is annular in shape with a bulged center portion, and wherein the means to join the first plate (30) to the spring (26) is a projection (32) received in an aperture (34) in the bulged portion of the spring.
Claim 9
Dependent Claim
33 words
A bridge element as claimed in claim 7, wherein the means to maintain the spring (26) and the second plate (40) in contacting operative engagement is a flange (44) on the second plate.
Claim 10
Dependent Claim
26 words
A bridge element as claimed in claim 8, wherein clearance is provided between the flange (44) and the edge of the spring (26) allowing for flexure.
Claim 11
Dependent Claim
27 words
A bridge element as claimed in claim 1, wherein the spring (26) is provided with radially extending slots (28) to decrease the force necessary to produce flexure.
References Cited (Backward Citations)
No citation records indexed.
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