Patent EP0092930A1 successfully refreshed from Google Patents.
EP0092930A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Lead frame with fusible links
Assignee: TE Connectivity Corp
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Filing: 1983-04-12
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Granted: —
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Expires: 2003-04-12
Abstract
Abstract Copper lead frame (10) for manufacturing a semiconductor chip carrier (11) has signal leads (19) extending from outer leads (17) about the periphery of the frame (10) and temporarily attached to a ground bus (30) toward the center of the frame (10) by fusible links (22). Ground leads (24) extend from bus (30) alternately with signal leads (19) and have fusible links (21) at outer leads (17) which are melted to isolate them from signal leads (19) and eliminate noise between signal leads (19) in finished carrier (11). A power bus (36) located within the ground bus (30) and a chip mounting pad (42) located within the power bus (36) are similarly positioned by fusible links (34, 44).
Inventors
- 👤 Charles Richard Downs
- 👤 Dimitry G. Grabbe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 12:19
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/40; H10W70/60; H10W70/611; H10W70/62; H10W70/641; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
201 words
1 . A metallic lead frame (10) for manufacturing a semiconductor chip carrier (11), said lead frame (10) having a planar surface (13) which is to be bonded to a ceramic substrate (12), said lead frame (10) comprising a plurality of outer leads (17) extending to a plurality of locations about the periphery of the lead frame (10) and a plurality of signal leads (19) extending from said outer leads (19) toward the center of said lead frame (10), each said signal lead (19) having a first end (20) attached to a respective outer lead (17) and a second end (21) attached to support means toward the center of said lead frame, characterised in that said support means is a ground bus (30) which is to be bonded to said ceramic substrate (12), each said signal lead (19) having a neck portion (2 2 ) proximate to said second end (21), said neck portion (22) being of smaller cross section than the rest of said signal lead (19), said neck portion (22) being recessed from said planar surface (13), whereby, upon bonding said lead frame (10) to said substrate (12) said neck portion (22) will not bond to said substrate (12).
Claim 2
Dependent Claim
201 words
1 . A metallic lead frame (10) for manufacturing a semiconductor chip carrier (11), said lead frame (10) having a planar surface (13) which is to be bonded to a ceramic substrate (12), said lead frame (10) comprising a plurality of outer leads (17) extending to a plurality of locations about the periphery of the lead frame (10) and a plurality of signal leads (19) extending from said outer leads (19) toward the center of said lead frame (10), each said signal lead (19) having a first end (20) attached to a respective outer lead (17) and a second end (21) attached to support means toward the center of said lead frame, characterised in that said support means is a ground bus (30) which is to be bonded to said ceramic substrate (12), each said signal lead (19) having a neck portion (2 2 ) proximate to said second end (21), said neck portion (22) being of smaller cross section than the rest of said signal lead (19), said neck portion (22) being recessed from said planar surface (13), whereby, upon bonding said lead frame (10) to said substrate (12) said neck portion (22) will not bond to said substrate (12).
Claim 3
Dependent Claim
94 words
A lead frame (10) as in claim 1 characterised in that said metallic lead frame (10) is copper and has a copper oxide surface, the cross-sectional area of said neck portions (22) being such that the ratio of copper oxide to copper in said neck portion (22) will cause a eutectic melting of said neck portion (22) at a temperature lower than the melting point of the copper, whereby the neck portions will melt in the manner of fusible links as the lead frame (10) is heated to bond it to the substrate (12).
Claim 4
Dependent Claim
40 words
A lead frame (10) as in claim 1 characterised in that said metallic lead frame (10) is bare copper, whereby the leads (19, 24) can have very small cross sections without melting at less than the melting point of copper.
Claim 5
Dependent Claim
82 words
A lead frame as in claim 1 characterised in that said lead frame (10) further comprises a power bus (36) located toward the center of said lead frame internally of said ground bus (30), said power bus (36) being connected to said ground bus (30) by a plurality of neck portions (34), said neck portions (34) being of a cross section comparable to that of said neck portions (22) of said signal leads (19) and likewise recessed from said planar surface (13).
Claim 6
Dependent Claim
85 words
A lewd frame as In claim 4 characterised in that said lead frame ( 10 ) further comprises a ground pad (42) located in the center of said lead frame (10) Internally of said power bus (36), said ground pad (42) being connected to said power bus (36) by a plurality of neck portions (44), said neck portions (44) being of a cross section comparable to that of said neck portions (22) of said signal leads (19) and likewise recessed from said planar surface (13).
Claim 7
Dependent Claim
179 words
A lead frame (10) as in claim 1 characterised in that said lead frame (10) further comprises a plurality of ground leads (24) extending from said outer leads (17) to said ground bus (30), each said ground lead (24) having a first end (25) attached to a respective outer lead (17) and a second end (28) attached to said ground bus (30), each said ground lead (24) having a neck portion (26) proximate to said first end (25), said neck portion (26) being of smaller cross section than the rest of said ground lead (24), said neck portion (26) being recessed from said planar surface (13), whereby, upon bonding said lead frame (10) to said substrate (12) said neck portion (26) will not bond to said substrate (12), and upon melting said neck portion (26) to leave a gap between each said ground lead (24) and the respective outer lead (17), said ground leads (24) will be at a common potential with said ground bus (30) and provide electromagnetic shielding between said signal leads in the finished chip carrier.
Claim 8
Dependent Claim
38 words
A lead frame (10) as in claim 5 characterised in that the first end (25) of at least some of said ground leads (24) is attached to an outer lead (17) common with the adjacent signal lead (19).
Claim 9
Dependent Claim
112 words
A metallic lead frame (10) for manufacturing a network of electrical leads (17, 19, 24), said lead frame (10) having a planar surface (13) which is to be bonded to a ceramic substrate (12), said lead frame (10) comprising support means which accurately maintains the spacing of leads (17, 19, 24) prior to bonding, said support means comprising a plurality of neck portions (22, 34, 44) which are of smaller cross section than the leads (17, 19, 24), said neck portions (22, 34, 44) being recessed from said planar surface (13), whereby, upon bonding said lead frame (10) to a substrate (12) said neck portions (22, 34, 44) will not bond thereto.
Claim 10
Dependent Claim
112 words
A metallic lead frame (10) for manufacturing a network of electrical leads (17, 19, 24), said lead frame (10) having a planar surface (13) which is to be bonded to a ceramic substrate (12), said lead frame (10) comprising support means which accurately maintains the spacing of leads (17, 19, 24) prior to bonding, said support means comprising a plurality of neck portions (22, 34, 44) which are of smaller cross section than the leads (17, 19, 24), said neck portions (22, 34, 44) being recessed from said planar surface (13), whereby, upon bonding said lead frame (10) to a substrate (12) said neck portions (22, 34, 44) will not bond thereto.
References Cited (Backward Citations)
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