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EP0091079A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Power MOSFET

Assignee: Toshiba Corp
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Filing: 1983-03-29
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Granted: —
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Expires: 2003-03-29
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Abstract

Abstract A plurality of drain projections (22a-1, 22a-2, ...) are formed on a surface of a semiconductor substrate (21) in column and row directions. A portion is formed between two longitudinally adjacent drain projections (22a-1, 22a-2) so as to form a source electrode contact. A drain projection (22b-2) which is formed alongside the longitudinally adjacent drain projections (22a-1, 22a-2) is offset therefrom by a length corresponding to half of a long side of each projection.

Inventors

  • 👤 Hirohito Tanabe
  • 👤 Yu Ohata
  • 👤 Yukiharu Miwa
  • 👤 Tsuyoshi Kuramoto

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 19:50
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/64; H10D30/66; H10D62/00; H10D62/10; H10D62/17; H10D62/393

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 376 words
A power MOSFET having a semiconductor substrate used as a common drain region, a base region for dividing a surface of said semiconductor substrate into a plurality of small regions, and a plurality of source regions opposing said drain region through said base region, characterized in that said power MOSFET comprises: a plurality of projections (22a-1, 22a-2) formed integrally on the surface of said semiconductor substrate (21) of one conductivity type which serves as said drain region, each of said plurality of projections having a rectangular surface, and said plurality of projections having a plurality of rows of projections and a plurality of columns of projections which are respectively spaced apart from each other by predetermined distances such that said projections (22a-l, 22a-2) of one of said plurality of rows of projections are offset by a distance corresponding to half of a long side of said rectangular surface with respect to said projections (22b-l, 22b-2) of an adjacent one of said plurality of rows of projections; a base region (23) of another conductivity type formed to cover a surface portion of said semiconductor substrate (21) which excludes surfaces of said plurality of projections (22a-l, 22a-2); a source region (24) of said one conductivity type which is formed to surround said plurality of projections (22a-1, 22a-2) so as to sandwich said base region (23a, 23b) having a predetermined width therebetween; an insulating film (32) formed to cover surfaces of said plurality of projections (22a-1, 22a-2), said base region (23), and said source region (24); a plurality of gate films (33a - 33e) formed on at least said surfaces of said plurality of projections (22a-1, 22a-2) and said base region (23a, 23b) and which are formed on said insulating film (32); a plurality of source electrode contacts (25a) formed such that each of said source electrode contacts is formed between first and second projections (22a-l, 22a-2) of said plurality of projections which are longitudinally adjacent to each other so as to connect said source region (24) respectively formed around said first projection (22a-l) and said second projection (22a-2); and a plurality of gate electrode contacts (33c-1, 33d-l, 33e-l) which respectively extend through said insulating film (32) to be connected to said plurality of gate films (33a - 33e).
Claim 2
Dependent Claim 376 words
A power MOSFET having a semiconductor substrate used as a common drain region, a base region for dividing a surface of said semiconductor substrate into a plurality of small regions, and a plurality of source regions opposing said drain region through said base region, characterized in that said power MOSFET comprises: a plurality of projections (22a-1, 22a-2) formed integrally on the surface of said semiconductor substrate (21) of one conductivity type which serves as said drain region, each of said plurality of projections having a rectangular surface, and said plurality of projections having a plurality of rows of projections and a plurality of columns of projections which are respectively spaced apart from each other by predetermined distances such that said projections (22a-l, 22a-2) of one of said plurality of rows of projections are offset by a distance corresponding to half of a long side of said rectangular surface with respect to said projections (22b-l, 22b-2) of an adjacent one of said plurality of rows of projections; a base region (23) of another conductivity type formed to cover a surface portion of said semiconductor substrate (21) which excludes surfaces of said plurality of projections (22a-l, 22a-2); a source region (24) of said one conductivity type which is formed to surround said plurality of projections (22a-1, 22a-2) so as to sandwich said base region (23a, 23b) having a predetermined width therebetween; an insulating film (32) formed to cover surfaces of said plurality of projections (22a-1, 22a-2), said base region (23), and said source region (24); a plurality of gate films (33a - 33e) formed on at least said surfaces of said plurality of projections (22a-1, 22a-2) and said base region (23a, 23b) and which are formed on said insulating film (32); a plurality of source electrode contacts (25a) formed such that each of said source electrode contacts is formed between first and second projections (22a-l, 22a-2) of said plurality of projections which are longitudinally adjacent to each other so as to connect said source region (24) respectively formed around said first projection (22a-l) and said second projection (22a-2); and a plurality of gate electrode contacts (33c-1, 33d-l, 33e-l) which respectively extend through said insulating film (32) to be connected to said plurality of gate films (33a - 33e).
Claim 3
Dependent Claim 55 words
A power MOSFET according to claim 1, characterized in that said semiconductor substrate (21) comprises an n +- type substrate drain (21a) and an n-type epitaxial drain (21b) formed on said n +- type substrate drain (21a), said plurality of projections (22a-1, 22a-2) being formed in a surface layer of said n-type epitaxial drain (21b).
Claim 4
Dependent Claim 20 words
A power MOSFET according to claim 1, characterized in that said gate films (33a - 33e) comprise polycrystalline silicon films.
Claim 5
Dependent Claim 47 words
A power MOSFET according to claim 1, characterized in that said semiconductor substrate comprises a p +- type substrate drain and a p-type epitaxial drain formed on said p +- type substrate drain, said plurality of projections being formed in a surface of said p-type epitaxial drain.

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