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Process for selectively cutting an electrical conductive layer by irradiation with an energy beam

Assignee: Fujitsu Ltd
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Filing: 1983-03-18
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Granted: —
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Expires: 2003-03-18
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Abstract

Abstract A method of cutting an electrical conductive layer (1) by irradiation with an energy beam (5) includes the step of depositing an energy beam film (3) on the portion of the electrical conductive layer (1) to be cut. The energy beam absorbing material (3) absorbs the energy beam more readily than the electrical conductive layer (1) and thus when the energy beam (5) is irradiated on to the surface the portion of the electrical conductive layer (1) beneath the film (3) melts due to the energy adsorbed by and transferred from the film (3).

Inventors

  • 👤 Tsutomu Ogawa

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 23:23
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493; H10W20/494; H10P; H10P34/00; H10P34/40; H10P34/42; H10W20/01; H10W20/031; H10W20/067; H10W20/068

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 93 words
A process for selectively cutting an electrical conductive layer (1) by irradiation with an energy beam, including the steps of depositing a film of an energy beam absorbing material (3) having a greater energy beam absorbtion than the electrical conductive layer (1) on a portion of the electrical conductive layer (1) to be cut and then irradiating the film with the energy beam (5), the film (3) absorbing energy from the energy beam (5) and transferring the absorbed energy to the layer (1) thereby melting the portion of the electrical conductive layer (1).
Claim 2
Dependent Claim 93 words
A process for selectively cutting an electrical conductive layer (1) by irradiation with an energy beam, including the steps of depositing a film of an energy beam absorbing material (3) having a greater energy beam absorbtion than the electrical conductive layer (1) on a portion of the electrical conductive layer (1) to be cut and then irradiating the film with the energy beam (5), the film (3) absorbing energy from the energy beam (5) and transferring the absorbed energy to the layer (1) thereby melting the portion of the electrical conductive layer (1).
Claim 3
Dependent Claim 16 words
A process according to claim 1, in which the energy beam (5) is a laser beam.
Claim 4
Dependent Claim 27 words
A process according to claim 1 or 2, in which the electrical conductive layer (1) is aluminium and in which the heat-absorbing film (3) is amorphous silicon.
Claim 5
Dependent Claim 30 words
A process according to claim 1 or 2, in which the electrical conductive layer (1) is a refractory metal, and in which the heat-absorbing film (3) is-polysilicon or amorphous silicon.

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