Patent US3689362A successfully refreshed from Google Patents.
Patent EP0084866A2 successfully refreshed from Google Patents.
EP0084866A2
Expired / Lapsed
EP
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Semiconductor casing
Assignee: Olin Corp
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Filing: 1983-01-20
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Granted: —
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Expires: 2003-01-20
Abstract
Abstract A casing for an electrical component comprises a metal base member. A metal housing member is mounted on the base member to provide a hollow enclosed casing for receiving the electrical component. A metal liead frame is provided within the enclosed casing and is electrically connected to the electrical component. The lead frame has terminal leads projecting between the base member and the housing member external to the casing. The improvement comprises a device extending from the base member for strengthening the base member and providing additional heat transfer from the casing. Also, an adhesive seals and bonds the terminal leads to both the base member and to the housing member to form the enclosed casing.
Inventors
- 👤 Sheldon H. Butt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 22:05
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W76/60; H05K1/03; H05K1/05; H05K1/056; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
97 words
In a casing for an electrical component characterized by: a metal base member; a metal housing member being mounted upon said base member to provide a hollow enclosed casing for receiving said electrical component; a metal lead frame within said enclosed casing for electrical connection to said electrical component, said lead frame having terminal leads projecting between said base member and said housing member external to said casing, the improvement characterized by: adhesive means for sealing and bonding said terminal leads to both said base member and to said housing member whereby said enclosed casing is formed.
Claim 2
Dependent Claim
97 words
In a casing for an electrical component characterized by: a metal base member; a metal housing member being mounted upon said base member to provide a hollow enclosed casing for receiving said electrical component; a metal lead frame within said enclosed casing for electrical connection to said electrical component, said lead frame having terminal leads projecting between said base member and said housing member external to said casing, the improvement characterized by: adhesive means for sealing and bonding said terminal leads to both said base member and to said housing member whereby said enclosed casing is formed.
Claim 3
Dependent Claim
33 words
An apparatus as in claim 1 characterized in that said metal is copper or a copper base alloy having a thin refractory oxide layer on a surface in contact with said adhesive means.
Claim 4
Dependent Claim
23 words
An apparatus as in claim 2 characterized in that said copper base alloy comprises 2 to 12% aluminum and the balance essentially copper.
Claim 5
Dependent Claim
29 words
An apparatus as in claim 3 characterized in that said copper base alloy consists essentially of 2.5 to 3.1% aluminum, 1.5 to 2.1% silicon and the balance essentially copper.
Claim 6
Dependent Claim
15 words
An apparatus as in claim 4 characterized. in that said refractory oxide layer includes A1203.
Claim 7
Dependent Claim
27 words
The apparatus of claim 1 further characterized by: means extending from said base member for strengthening said base member and providing additional heat transfer from said casing.
Claim 8
Dependent Claim
25 words
The apparatus as in claim 6 further characterized by: fin means for cooling said casing being adjoined to the bottom surface of said base member.
Claim 9
Dependent Claim
72 words
The apparatus as in claim 6 further characterized by: a printed circuit board having a first metal or alloy component; a second metal or alloy component; means for bonding said first and second components together; a heat sink plate embedded in said bonding means; and at least one cavity extending from said heat sink plate to receive said extending means whereby said extending means can be adjoined to said heat sink plate.
Claim 10
Dependent Claim
165 words
A circuit board structure characterized by: a casing for an electrical component characterized by: a metal or alloy base member having a recess therein; a metal or alloy housing member being mounted upon said base member to enclose said recess and provide a hollow enclosed casing for receiving said electrical component; a metal or alloy lead frame within said enclosed casing having substantially the same shape as said base member for connection to said electrical component; said lead frame having terminal leads projecting between said base member and said housing member external to said casing for connection to said circuit board structure, said circuit board comprising: a first metal or alloy component; a second metal or alloy component; means for bonding said first and second components together; a heat sink plate embedded in said bonding means; a cavity extending from said heat sink plate to receive said base member; and a portion of an outer surface of said base member being joined to said plate.
Claim 11
Dependent Claim
165 words
A circuit board structure characterized by: a casing for an electrical component characterized by: a metal or alloy base member having a recess therein; a metal or alloy housing member being mounted upon said base member to enclose said recess and provide a hollow enclosed casing for receiving said electrical component; a metal or alloy lead frame within said enclosed casing having substantially the same shape as said base member for connection to said electrical component; said lead frame having terminal leads projecting between said base member and said housing member external to said casing for connection to said circuit board structure, said circuit board comprising: a first metal or alloy component; a second metal or alloy component; means for bonding said first and second components together; a heat sink plate embedded in said bonding means; a cavity extending from said heat sink plate to receive said base member; and a portion of an outer surface of said base member being joined to said plate.
Claim 12
Dependent Claim
40 words
An apparatus as in claim 9 characterized by: said electrical component being affixed in the recess of the base member on a surface opposite the outer surface of said base member whereby heat can be effectively transferred from said component.
Claim 13
Dependent Claim
20 words
A casing as in claims 6 or 9 further characterized by: absorption means within said enclosed casing for absorbing contaminants.
Claim 14
Independent Claim
108 words
The method of forming casing for an electrical component, characterized by the steps of: providing a metal base member; mounting a metal housing member upon said base member to provide a hollow enclosed casing for receiving said electrical component; providing a metal lead frame within said enclosed casing, said lead frame having terminal leads projecting between said base member and said housing member external to said casing; electrically connecting said electrical component to said lead frame, the improvement characterized by the step of: applying adhesive means to seal and bond said terminal leads to both said base member and to said housing member for forming said enclosed casing.
Claim 15
Independent Claim
108 words
The method of forming casing for an electrical component, characterized by the steps of: providing a metal base member; mounting a metal housing member upon said base member to provide a hollow enclosed casing for receiving said electrical component; providing a metal lead frame within said enclosed casing, said lead frame having terminal leads projecting between said base member and said housing member external to said casing; electrically connecting said electrical component to said lead frame, the improvement characterized by the step of: applying adhesive means to seal and bond said terminal leads to both said base member and to said housing member for forming said enclosed casing.
Claim 16
Dependent Claim
56 words
A method as in claim 12 wherein said step of providing said base member, housing member and lead frame is characterized by: providing a material comprising a copper or copper base alloy; and forming a refractory oxide layer on the surfaces of said base member, housing member and lead frame in contact with said adhesive means.
Claim 17
Dependent Claim
22 words
The method as in claim 13 characterized by: said copper base alloy comprising 2 to 12% aluminum and the balance essentially copper.
Claim 18
Dependent Claim
28 words
The method as in claim 14 characterized by: said copper base alloy consisting essentially of 2.5 to 3.1% aluminum, 1.5 to 2.1% silicon and the balance essentially copper.
Claim 19
Dependent Claim
18 words
The method as in claim 15 characterized by: said refractory oxide layer including A1 2 0 3 ,
References Cited (Backward Citations)
No citation records indexed.
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