Patent EP0084464A2 successfully refreshed from Google Patents.
EP0084464A2
Expired / Lapsed
EP
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Connector for electronic subassemblies
Assignee: Ennovi Advanced Mobility Solutions NJ Inc
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Filing: 1983-01-20
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Granted: —
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Expires: 2003-01-20
Abstract
Abstract A connector for electronic subassemblies is initially formed as a small sphere having an outer coating of solder (2), for example 1.0mm in diameter, and an inner core (4) of copper, for example 0.5mm in diameter. To effect a connection, the connector is positioned between an electrical bonding pad (16) of an integrated circuit chip (12) and an interconnect pattern (14) on a ceramic substrate (10), and is then heated so that the solder (2) flows, making mechanical and electrical contact to the pad and interconnect pattern on the chip and substrate. The copper (4) core does not melt and maintains a predetermined space, between the chip (12) and substrate (10).
Inventors
- 👤 Jack Seidler
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 12:03
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2201/10613; H05K2201/10954; H05K2201/10992; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
42 words
A connector for attaching and spacing a microelectronic component (12) to a base (10), characterised by an inner core (4) and an outer layer (2) of solder surrounding said inner core, said inner core having a higher melting point than said solder.
Claim 2
Dependent Claim
42 words
A connector for attaching and spacing a microelectronic component (12) to a base (10), characterised by an inner core (4) and an outer layer (2) of solder surrounding said inner core, said inner core having a higher melting point than said solder.
Claim 3
Dependent Claim
18 words
A connector according to claim 1, characterised in that the inner core (4) is an electrically conductive material.
Claim 4
Dependent Claim
14 words
A connector according to claim 2, characterised in that the core (4) is copper.
Claim 5
Dependent Claim
28 words
A connector according to claim 1, 2 or 3, characterised in that the inner core (4) is a sphere and the outer layer (2) is of uniform thickness.
Claim 6
Dependent Claim
30 words
A connector according to claim 4,characterised in that the core (4) is about one-half millimeter in diameter and the outer layer (2) has an outside diameter of approximately one millimeter.
Claim 7
Dependent Claim
20 words
A connector according to claim 4, characterised in that the core (4) has a diameter of less than one-half millimeter.
Claim 8
Dependent Claim
23 words
A connector according to claim 4 or 6, characterised in that the outer layer (2) has a diameter of less than one millimeter.
Claim 9
Dependent Claim
91 words
An electronic module comprising two members (10,12) facing each other and spaced apart from each other, one or more pairs of connection locations (14,16) on the members facing each other, and a connector between the or each of said pairs of connection locations, characterised in that the connector has a central core (4) surrounded by solder (2),said central core has a higher melting point than said solder, said solder is flowed onto the associated facing pair of connection locations (14,16),a-nd said solder is of uniform composition between said facing connection locations.
Claim 10
Dependent Claim
91 words
An electronic module comprising two members (10,12) facing each other and spaced apart from each other, one or more pairs of connection locations (14,16) on the members facing each other, and a connector between the or each of said pairs of connection locations, characterised in that the connector has a central core (4) surrounded by solder (2),said central core has a higher melting point than said solder, said solder is flowed onto the associated facing pair of connection locations (14,16),a-nd said solder is of uniform composition between said facing connection locations.
Claim 11
Dependent Claim
20 words
A module according to claim 8, characterised in that the core (4) is a sphere approximately one-half millimeter in diameter.
Claim 12
Dependent Claim
23 words
A module according to claim 8 or 9, characterised in that the core (4) is made of copper or other electrically conductive material.
References Cited (Backward Citations)
No citation records indexed.
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