Patent EP0083436A2 successfully refreshed from Google Patents.
EP0083436A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A process for joining a metallic coated connector pin to a multilayer ceramic substrate
Assignee: International Business Machines Corp
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Filing: 1982-12-20
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Granted: —
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Expires: 2002-12-20
Abstract
Abstract In the process for joining metallic coated connector pins (20) to a multilayer ceramic substrate (10), contact areas on the substrate are formed by sequential coatings of molybdenum (12) and nickel (14), which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film (14) into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.
Inventors
- 👤 Raj Navinchandra Master
- 👤 Marvin Stanley Pittler
- 👤 Paul Anthony Totta
- 👤 Norman George Ainslie
- 👤 Paul Harry Palmateer
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 21:09
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/30; H05K3/32; H05K3/34; H05K3/346
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
97 words
A process for joining a metallic coated connector pin (20) to a ceramic substrate (10), characterized by the steps of: depositing a layer of molybdenum (12) on a surface of said substrate, depositing a film of nickel (14) on said molybdenum layer, heating said assembly at a specified temperature for diffusing said nickel applying substantially pure gold to said nickel film and sintering said gold, so that said nickel film is converted into a continuous gold- nickel solid solution and brazing said connector pin with a gold-tin brazing compound (16) to join said pin to said substrate.
Claim 2
Dependent Claim
97 words
A process for joining a metallic coated connector pin (20) to a ceramic substrate (10), characterized by the steps of: depositing a layer of molybdenum (12) on a surface of said substrate, depositing a film of nickel (14) on said molybdenum layer, heating said assembly at a specified temperature for diffusing said nickel applying substantially pure gold to said nickel film and sintering said gold, so that said nickel film is converted into a continuous gold- nickel solid solution and brazing said connector pin with a gold-tin brazing compound (16) to join said pin to said substrate.
Claim 3
Dependent Claim
22 words
A process as in claim 1, characterized in that said applied gold is a gold paste comprising pure gold in a binder.
Claim 4
Dependent Claim
16 words
A process as in claim 2, characterized in that said gold paste is applied by screening.
Claim 5
Dependent Claim
23 words
A process as in claim 2, characterized in that it includes the step of firing said gold paste to burn out said binder.
Claim 6
Dependent Claim
21 words
A process as in claim 1, characterized in that said gold is sintered at a temperature in the range of 680°C-850°C.
Claim 7
Dependent Claim
18 words
A process as in claim 1, characterized in that said connector pin is a nickel plated Kovar pin.
Claim 8
Dependent Claim
21 words
A process as in claim 1, characterized in that said connector pin is coated with a metal of gold-nickel or gold-palladium.
Claim 9
Dependent Claim
36 words
The process as in claim 1, characterized in that said diffusion employs a portion of said nickel at its interface with molybdenum with said gold forming a solid solution with the remaining portion of said nickel.
Claim 10
Dependent Claim
91 words
A process for joining a metallic coated connector pin (20) to a ceramic substrate (10), characterized in the the steps of: depositing a layer of molybdenum (14) on a surface of said substrate: depositing a film of nickel (14) on said molybdenum layer: applying substantially pure gold film over said nickel film, and heating the resultant structure to concurrently diffuse a portion of said nickel film into said molybdenum layer at the interface thereof and to form a solid solution of gold film.with the remaining portion of said nickel film. -
Claim 11
Dependent Claim
91 words
A process for joining a metallic coated connector pin (20) to a ceramic substrate (10), characterized in the the steps of: depositing a layer of molybdenum (14) on a surface of said substrate: depositing a film of nickel (14) on said molybdenum layer: applying substantially pure gold film over said nickel film, and heating the resultant structure to concurrently diffuse a portion of said nickel film into said molybdenum layer at the interface thereof and to form a solid solution of gold film.with the remaining portion of said nickel film. -
References Cited (Backward Citations)
No citation records indexed.
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