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EP0082640A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Ion implantation method

Assignee: Toshiba Corp
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Filing: 1982-12-09
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Granted: —
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Expires: 2002-12-09
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Abstract

Abstract An ion implantation method is provided which uses an ion implantation apparatus which is capable of focusing an ion beam into a spot having a diameter smaller than the size of a region into which ions are to be implanted. The ion dose is varied in accordance with the gate region, source and drain regions, and the field region of a semiconductor device including a transistor having short gate length and width.

Inventors

  • 👤 Tadahiro Takigawa
  • 👤 Isao Sasaki

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 05:00
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H01; H01J; H01J37/00; H01J37/30; H01J37/302; H01J37/317; H01J37/3171; H01J37/3172; Y; Y10; Y10S; Y10S438/00; Y10S438/961

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 198 words
An ion implantation method which uses an ion implantation apparatus comprising an ion gun and an ion optical system for producing an ion beam having a spot diameter which is smaller than the size of a region into which ions are to be implanted, a deflecting device for scanning the ion beam on a surface of a wafer, a blanking device for blanking the ion beam, and a control device for controlling said devices, said method implanting the ions into at least one of a gate region, source and drain regions, and a field region of a semiconductor device including a transistor being formed on the wafer having short gate length and width, characterized in that said method also comprises the steps of: determining an ion dose for a predetermined region of said wafer as a function of location thereof and storing data of the ion dose in said control device (39); and controlling at least said deflecting device (31) and said blanking device (26, 27) in accordance with said data so as to vary an ON time of the ion beam in accordance with said regions of said semiconductor device, thereby allowing variation of the ion dose.
Claim 2
Dependent Claim 198 words
An ion implantation method which uses an ion implantation apparatus comprising an ion gun and an ion optical system for producing an ion beam having a spot diameter which is smaller than the size of a region into which ions are to be implanted, a deflecting device for scanning the ion beam on a surface of a wafer, a blanking device for blanking the ion beam, and a control device for controlling said devices, said method implanting the ions into at least one of a gate region, source and drain regions, and a field region of a semiconductor device including a transistor being formed on the wafer having short gate length and width, characterized in that said method also comprises the steps of: determining an ion dose for a predetermined region of said wafer as a function of location thereof and storing data of the ion dose in said control device (39); and controlling at least said deflecting device (31) and said blanking device (26, 27) in accordance with said data so as to vary an ON time of the ion beam in accordance with said regions of said semiconductor device, thereby allowing variation of the ion dose.
Claim 3
Dependent Claim 34 words
A method according to claim 1, characterized in that said data is determined so that the ion dose during ion implantation into said gate region is increased with a decrease in the gate length.
Claim 4
Dependent Claim 42 words
A method according to claim 1, characterized - in that said data is determined so that the ion dose during ion implantation into said source and drain regions is small at a portion of said drain region close to said gate region.
Claim 5
Dependent Claim 52 words
, 4. A method according to claim 1, characterized in that said data is determined so that the ion dose at a portion of said field region close to said source and drain regions and at a boundary between said field region and said channel region below said gate region is small.

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