Patent EP0081135A2 successfully refreshed from Google Patents.
EP0081135A2
Expired / Lapsed
EP
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Substrate for mounting integrated circuit chips
Assignee: International Business Machines Corp
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Filing: 1982-11-23
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Granted: —
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Expires: 2002-11-23
Abstract
Abstract A novel substrate (10) is disclosed which can mount either flip-chip solder bonded IC chips (12) or wire bonded chips (18), or both chips, or a single chip having both solder bonds and wire bond. The substrate has an array of solder pads (26,28) which will accept solder bonds. Those pads (28) which are to be used for wire bonding have mounted thereon a trimetallic pedestal (30). Each pedestal has a layer (32) of solder metal bonded to the solder pad, a top layer metal (34) suitable for wire bonding, such as, aluminum or gold, and an intermediate layer (36) of metal, such as nickel, which is impervious to both solder metal and the top layer metal.
Inventors
- 👤 Robert Marks
- 👤 Douglas Wallace Phelps, Jr.
- 👤 William Carroll Ward
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 15:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4015; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W99/00; H10W72/00; H10W72/071; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/541; H10W72/5434; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/874; H10W72/879; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
109 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 28), at least some of which are arranged in a pattern for interconnecting an integrated circuit chip, characterized in that at least one of said solder pads (28) has connected thereto a multi-layer metallic pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminium or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 2
Dependent Claim
109 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 28), at least some of which are arranged in a pattern for interconnecting an integrated circuit chip, characterized in that at least one of said solder pads (28) has connected thereto a multi-layer metallic pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminium or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 3
Dependent Claim
123 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 48; Fig. 4), at least one group (26) of which is arranged in a pattern to match and interconnect with solder pads (14) on at least one flip-chip integrated circuit (12), characterized in that at least one of said solder pads (48) has connected thereto a multi-layer metal pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminum or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 4
Dependent Claim
123 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 48; Fig. 4), at least one group (26) of which is arranged in a pattern to match and interconnect with solder pads (14) on at least one flip-chip integrated circuit (12), characterized in that at least one of said solder pads (48) has connected thereto a multi-layer metal pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminum or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 5
Dependent Claim
149 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 28) at least one group (26) of which is arranged in a pattern to match and interconnect with solder pads (14) on at least one flip-chip integrated circuit (12), characterized in that a second group (28) of said solder pads being arranged in a pattern to interconnect with a selected configuration of a wire bond type integrated circuit chip (18), each of said second group of solder pads having connected thereto a multi-layer metal pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminum or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 6
Dependent Claim
149 words
Substrate for mounting integrated circuit chips, which substrate has input/output means (40) and a plurality of solder pads (26, 28) at least one group (26) of which is arranged in a pattern to match and interconnect with solder pads (14) on at least one flip-chip integrated circuit (12), characterized in that a second group (28) of said solder pads being arranged in a pattern to interconnect with a selected configuration of a wire bond type integrated circuit chip (18), each of said second group of solder pads having connected thereto a multi-layer metal pedestal (30), each pedestal having a solder layer (32) joined to the solder pad, an upper layer (34) of metal suitable for bonding to aluminum or gold wire, and a layer (36) of metal interposed between the solder layer and the upper layer which is substantially impervious to both solder and the upper layer of metal.
Claim 7
Dependent Claim
25 words
Substrate as defined in Claims 1, 2, or 3 wherein the upper layer (34) of metal is selected from the group of aluminum and gold.
Claim 8
Dependent Claim
18 words
Substrate as defined in Claims 1, 2, or 3 wherein the upper layer (34) of metal is aluminum.
Claim 9
Dependent Claim
32 words
Substrate as defined in Claims 1, 2, or 3 wherein the upper layer (34) of metal is selected from the group of aluminum and gold and the intermediate layer (36) is nickel.
References Cited (Backward Citations)
No citation records indexed.
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