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EP0078480A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method for fusing and connecting solder of IC chip

Assignee: Hitachi Ltd
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Filing: 1982-10-25
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Granted: —
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Expires: 2002-10-25
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Abstract

Abstract Disclosed is a method for solder-fusing and connecting an IC chip which comprises locating solder bumps for electric connection, disposed on an IC chip, and a metallic layer for controlling the shape of connecting portions, disposed on the IC chip having said solder bumps and having a melting point higher than the melting point of the solder bumps, to terminals for electric connection and to terminals for controlling the shape of the connecting portions, disposed on a substrate, respectively; heat-fusing the solder bumps to form the connecting portions having the swelling shape at the center; and heat-fusing the metallic layer at a higher temperature to form bumps for controlling the shape of connecting portions, having the swelling shape at the center, and changing the connecting portions having the swelling shape at the center to connecting portions having the contracted shape at the center.

Inventors

  • 👤 Muneo Hitachi Hachimanyama Ohshima
  • 👤 Akihiro Kenmotsu

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-06 11:11
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W72/00; H10W72/20; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2201/09654; H05K2201/09781; H05K2201/20; H05K2201/2036; H05K3/346; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/251; H10W72/252; H10W72/257; Y; Y02; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 138 words
A methodfor solder-fusing and connecting an IC chip comprising: locating solder bumps for electric connection, disposed on an IC chip and a metallic layer for controlling the shape of connecting portions, disposed on said IC chip having said solder bumps and having a melting point higher than the melting point of said solder bumps, to terminals for electric connection and to terminals for controlling the shape of said connection portions, disposed on a substrate, respectively; heat-fusing said solder bumps to form said connecting portions having the swelling shape at the center; heat-fusing said metallic layer at a higher temperature to form bumps for controlling the shape of connecting portions, having the swelling shape at the center, and changing said connecting portions having the swelling shape at the center to connecting portions having the contracted shape at the center.
Claim 2
Dependent Claim 138 words
A methodfor solder-fusing and connecting an IC chip comprising: locating solder bumps for electric connection, disposed on an IC chip and a metallic layer for controlling the shape of connecting portions, disposed on said IC chip having said solder bumps and having a melting point higher than the melting point of said solder bumps, to terminals for electric connection and to terminals for controlling the shape of said connection portions, disposed on a substrate, respectively; heat-fusing said solder bumps to form said connecting portions having the swelling shape at the center; heat-fusing said metallic layer at a higher temperature to form bumps for controlling the shape of connecting portions, having the swelling shape at the center, and changing said connecting portions having the swelling shape at the center to connecting portions having the contracted shape at the center.
Claim 3
Independent Claim 64 words
The method for solder-fusing and connecting an IC chip as defined in cliam 1 wherein said metallic layer for controlling the shape of connecting portions, having a melting point higher than the melting point of said solder bumps for electric connection, consists of an alloy having a melting point by about 5°C higher than the melting point of said solder bumps for electric connection.
Claim 4
Independent Claim 64 words
The method for solder-fusing and connecting an IC chip as defined in cliam 1 wherein said metallic layer for controlling the shape of connecting portions, having a melting point higher than the melting point of said solder bumps for electric connection, consists of an alloy having a melting point by about 5°C higher than the melting point of said solder bumps for electric connection.
Claim 5
Dependent Claim 74 words
The method for solder-fusing and connecting an IC chip as defined in claim 1 wherein said solder bump for electric connection consists of 37 to 95 wt% of Pb and 63 to 5 wt% of Sn and said metallic layer for controlling the shape of.connecting portions, having a melting point higher than the melting point of said solder bump, consists of at least 97 wt% of Pb and up to 3 wt% of Sn.

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